[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

AU600785B2 - A method of making memory cards, and cards obtained by implementing said method - Google Patents

A method of making memory cards, and cards obtained by implementing said method Download PDF

Info

Publication number
AU600785B2
AU600785B2 AU10160/88A AU1016088A AU600785B2 AU 600785 B2 AU600785 B2 AU 600785B2 AU 10160/88 A AU10160/88 A AU 10160/88A AU 1016088 A AU1016088 A AU 1016088A AU 600785 B2 AU600785 B2 AU 600785B2
Authority
AU
Australia
Prior art keywords
card
module
mold
memory card
card body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
AU10160/88A
Other versions
AU1016088A (en
Inventor
Marc Brignet
Emile Droche
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Schlumberger SA
Original Assignee
Schlumberger SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=9346968&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=AU600785(B2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Schlumberger SA filed Critical Schlumberger SA
Publication of AU1016088A publication Critical patent/AU1016088A/en
Application granted granted Critical
Publication of AU600785B2 publication Critical patent/AU600785B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07724—Physical layout of the record carrier the record carrier being at least partially made by a molding process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14647—Making flat card-like articles with an incorporated IC or chip module, e.g. IC or chip cards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
    • B60R21/00—Arrangements or fittings on vehicles for protecting or preventing injuries to occupants or pedestrians in case of accidents or other traffic risks
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Credit Cards Or The Like (AREA)
  • Holo Graphy (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Electrically Operated Instructional Devices (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Packaging For Recording Disks (AREA)
  • External Artificial Organs (AREA)
  • Non-Volatile Memory (AREA)
  • Collating Specific Patterns (AREA)
  • Diaphragms For Electromechanical Transducers (AREA)
  • Compression, Expansion, Code Conversion, And Decoders (AREA)

Abstract

In order to produce the card body from a plastic material, the electronic module (14) whose covering (50) has an undercut (54), is placed in a mould (60,62). The module is held in place by suction (72). The plastic material is injected into the mould, thereby producing a moulding around the electronic module. <IMAGE>

Description

Tq
AUSTRALIA
PATENTS ACT 1952 Form COMPLETE SPECIFICATION
(ORIGINAL)
FOR OFFICE USE Short Title: Int. Cl: Application Number: Lodged: Complete Specification-Lodged: Accepted: Lapsed: Published: go*
I
Priority: Related Art: This document contains the amendments made under Secti.n 49 aind is correct for prin ting TO BE COMPLETED BY APPLICANT Name of Applicant: Address of Applicant: 5-S Actual Inventor: SCHLUMBERGER INDUSTRIES 50 AVENUE JEAN-JAURES 92 MONTROUGE
FRANCE
CLEMENT HACK CO., 601 St. Kilda Road, Melbourne, Victoria 3004, Australia.
*r Address for Service: g.
Complete Specification for the invention entitled: A METHOD OF MAKING MEMORY CARDS, AND CARDS OBTAINED BY IMPLEMENTING SAID METHOD The following statement is a full description of this invention including the best method of performing it known to me:i 1A A METHOD OF MAING MEM4ORY CARDS, AND CARDS OBTAINED BY ITPLEEING SAID METHOD The present invention relates to a method of making cards having a memory, in particular an electronic memory, and to cards obtained by implementing said method.
Memory cards are essentially constituted by a card body which is generally made of a plastic material, together with a memory module. For cards having an electronic memory, the memory module is an electronic module essentially constituted 10 by a semiconductor chip having an integrated circuit formed Sos: thereon, together with a piece of printed circuit on which the chip is fixed and which serves to define external electrical contact tabs. The electronic module is fixed in the card body S in such a manner that the electrical contact tabs are flush with one of the main faces of the card body.
0 ~The card body is in the general form of a rectanugular *5 parallelepiped whose thickness is small comnpared with the other dimensions of the card body. The edges of the card body constitute references for positioning the card in a card reader so as to ensure that the contact tabs of the card come into electrical contact with a connector in the card reader.
At present, there are two main techniques for making the card body and for fixing the electronic module therein. With the first technique, the card body is made by hot rolling a plurality of sheets of plastic material such as PVC in order to constitute a laminated structure. The electronic module is put into place before the sheets of plastic material are stacked and before they are rolled. After being rolled, the electronic module is firmly secured within the card body. This method has the advantage of simultaneously making the card body and implanting the electronic module therein. However, the method is difficult and requires the periphery of the card body to be machined back to tolerance.
The seclond technique consists in making the card body in a first step, in machining a cavity in the- card body to receive the electronic module, and then in gluing the electronic module in the cavity. Machining such a card body is always a diffi- 2 cult, and therefore expensive, operation since very accurate diiinensions must be obtained, in particular to ensure that the electronic module is accurately located relative to the edges of the card and relative to tho main face of the card body in which the electrical contact tabs are flush. In addition, the fixing, e.g. gluing, of the electronic module in the cpxd body adds additional steps.
It should be added that the card body must also satisfy other highly detiailed specifications concerning the quality of its surface state and its propertles for withstanding bending, 9:000: both in the longitudinal direction of the card budy and in the 00000 transverse direction thereof. Further, the card body must not encourage electrostatic charge storage. An aim of the present %fee invention is tia provide a method of making a memory card, in particular a card having an electronic memory, enabling the cost of card body manufacture to be reduced while simultaneously enabling the electronic module to be fixed in the card body and also satisfying the above-indicated specifications.
This aim is achieved, according to the present invention, by a method of manufacturing a memory card comprising a card fabody and a memory module having an access face, the method **see: comprising the following steps: a memoxry module is provided having at least one fastening portion; said module is placed in a mold, and it is held in place in such a manner that the access face of the memory module is pressed against one of the walls of the mold; a plastic material is inserted into the mold in such a mnnwer as to cause the plastic material to occupy the entire volume delimited by the walls of the mold and not occupied by said memory module; and the part made in this manner is unmolded.
In a preferred implementation, said memory module is an electronic module comprising an insulating support carrying external electrical contact tabs on a first face thereof and carrying on its opposite, second face a chip together with electrical connection weans between the terminals of said chip
V.
III i i I Ir Y
I
3 and said contact tabs and a coating material for protecting said chip and said electrical connection means, and said fastening portion is constituted by the particular shape of said coating material.
Also preferably, the card body has two main faces, with said electrical contact tabs being flush with one of said main faces, and said electronic module is placed in the mold so that said first face of the insulating support is disposed against that wall of the mold which defines one of the main faces of 10 the card body, and suction is established between said wall of the mold and said first face of the insulating support in order to hold said module against said wall.
It will be understood that in accordance with the e g.
invention, the card body is molded directly over the memory module. The card body is manufactured and the module is implanted in the body in a single operation. In addition, since the module can be positioned highly accurately within the mold, the module is also positioned with great accuracy in the card body.
0 The invention also provides a memory card manufactured according to the method of the present invention, the memory card comprising a body made of plastic material having two main faces and including a memory module having an access face, the card being characterized in that said body is made as a single ooo o piece; in that said module includes at least one fastening portion, and in that said access. face of the module is flush with one of the main facor of the card body with said fastening portions being completely embedded in the plastic material constituting said body.
The invention will be better understood from reading the following description of several implementations of the invention given by way of non-limiting example. The description refers to the accompanying drawings, in which: Figure 1 is a plan view of an electronic memory card in accordance with the invention; Figure 2 is a vertical section through an electronic Smodule useable in the invention; Figure 3 is a simplified section through a first type of 1 mold for implementing the invention; 4 Figure 3a is a section view on line A-A of the Figure 3 showing a first variant c.f the Figure 3 mold; Figure 3b is a section view on line A-A of Figure 3 showing a second variant of the Figure 3 mold; Figure 4 is a simplified section view through a second type of mold for implementing the invention; Figure 5 is a fragmentary vertical section through an goes electronic memory card in accordance with the invention; Figure 6 is a plan view of a third type of mold for making a plurality of cards simultaneously; and Figure 7 is a vertical section on line VII-VII of Figure 6.
Figure 1 is a plan view of a portion of an electronic *see memory card 10. The card 10 omprises a body 12 made made of a plastic material together with an electronic module 14 which is represented in Figure 1 solely by its external electrical contact tabs 16 to 30 which are disposed on an insulating @9 support 32. As is well known in the art, the contact tabs 16 to 30 are intended to cone into electrical contact with a 91 connector in a card reader which is used in conjunction with such cards.
Figure 2 shows an electronic module 14 which is entirely suitable for implementing the invention. The module 14 cotnprises an insulating support 32 with the external electrical contact tabs being formed on a face 32a thereof. Figure 2 shows tabs 18, 28, and 16. The contact tabs are separated from each other by etched zones such as 34. The contact tabs and the insulating support 32 additionally have a series of holes such as 36 whose function is explained below. The other face 32b of the insulating support 32 also includes metallization 38 frw ~30 and I A semiconductor chip 42 is fixed on the central metallij zation 38 by means of a conductive adhesive material. The metallization 38 and the metallizations 40 are electrically connected to the contact tabs 16 to 30 via holes 44 which are provided through the insulating support 32. In addition, each of the terminals 36 of the semiconductor chip 42 is connected to a corresponding metallization 40 by means of a conductor wire 48.
The chip 42 and*. the wires 48 are embedded in an insulating coating material 50 which adheres strongly to the metallizations 40, to the chip 42, and to the wires 48. The coating may be a thermo-setting resin. In addition, the coating material 50 is molded or machined so as to provide a substantially flat bottom 52 which is parallel to thq insulating support 32. The side wall 54 of the coating material is inclined at an angle a which is less than 900 to the portion of the face 32b of the 00000 0.0 insulating support 32 which is not covered with coating 10 material.
Voo: A first embodiment of a card and a first method of fixing the electronic module in the card body in accordance with the invention ar now describe-d with referenoe to Figure 3. The mold is essentially constituted by a fixed front portion 60 and by a removable rear portion 62, with these two portions def ining a cavity in which the card body is formed. More precisely, the portion 60 has a first plane wall 64 which defines one of the main faces of the card body and a side wall 66 which defines the edges of the card body. The second portion 62 of the mold defines the second main face of the card body. The side wall 66 and the front portion 60 of the mold is provided with an injection channel 68 for injecting the plastic material from which the card body is made into the mold. The wall 64 is Vt provided with means for holding the electronic module 14 statioruary while the plastic material is being injected into the mold. In this first implementation of the invention, these means comprise studs such as 70 which project from the inside face 64 of the mold, and a suction system comprising a suction nozzle 72 associated with a vacuum pump 74. The studs 70 have the same physical distribution as the holes 36 through the electronic module 14. In addition, the suction nozzle 72 opens out into that portion of the wall 64 which is surrounded by the studs A card is made in accordance with a first implementation of the invention, as follows: when the mold is open, the electronic module is put into place so that the studs penetrate into the holes 36 through the metallizations 16 to ego* 0 a.
0S* 0* on the module. The vacuum pump 70 is switched on. The module 14 is thus held against the wall 64 of the mold in all three directions and it is held in position by co-operation between the studs 70 and the holes 36. The rear portion 62 of the mold is then put into place on its front portion 60. Plastic material is then injected via the injection channel 68. The plastic material fills the entire cavity delimited by the mold and not occupied by the electronic module 14. The card is then unmolded.
Figure 5 is a fragmentary view in vertical section through a card obtained by implementing the method described above. It must initially be underlined that because of the special shape of the coating 50 and because the card body is made by being molded over the electronic module, the electronic module is mechanically anchored in the card body. As a result the module is very well fixed in the card body 12. Further, since the outer face of the electronic module is pressed against the wall 64 of the mold, no plastic material is deposited on the electrical contact tabs 16 to 30. In addition, since the periphery 76 of the insulating support 32 and the contact tabs 16 to 30 serve to limit the extent to which the mold cavity is filled with plastic material, the external aspect of the card where the outer face of the electronic module runs into the corresponding main face of the card body is particularly satisfactory.
Preferably, as shown in Figure 3a, the injection channel 68 opens out into a "corrner" 63 of the mold defining a corner of the card body which is in the shape of a right angle whereas the other "corners" referenced 65, 67, and 69 are rounded.
Thus, after the corner 63 of the card body has been cut from its sprue, all traces of injection molding can be removed therefrom. it is also possible to have a plurality of injection channels opening out into rnspective "corners" of the mold.
Figure,3b 8hows a variant embodiment of the means for positioning and holding the electronic module in the mnold.
Instead of or in addition to the studs 70, the wall 64 of the
S
S
1 7 mold also includes four projecting portionsq 100 to 106 cxrrespondi~ng to the four corners of the insulating support of the electronic module. The suction nozzle 72 opens out in the portion of the wall 64 which is delimited by the projecting elements 100 to 106. As shown in Figure 3b, the suction nozzle may be terminated by a plurality of orifices 108 each corresponding to one of the contact tabs of the electronic module.
Instead of having four portions 100 to 106, it would also he possible to have a cxxnlete rectangular frame projecting fromn .10 the face 64 of the module.
*se Naturally, other types of electronic module could be used.
For example, electronic modules could be used of the type described in published French patent applications numbers 2.547.440, 2.555.780, or 2.579.799. The module could be a module of the "lead-frame" type. Such electronic modules are described in European patent application number 87/4016797 filed 21 July, 1987. Such a module does not include an 0 0 insulating support. The semiconductor chip is directly fixed to a conducting element which constitutes one of the contact tabs of the memory card, while the terminals of the chip are connected by conducting wires to other conducting elements sed* which constitute the other connection tabs of the card.
Instead of the electronic module having an anchor element constituted by the special outside shape of the chip coating, it is possible for the module to have a portion for fastening it to the card body when the card is made by being molded thereover. For exaffWle, the electronic module may be of the type shown in Figure 2 but without the coating material The fastening portion of the electronic module is then constituted by all of the unevennesses on the electronic module, including its interconnecting wires 48 which appear on '1 that face of the electronic module which does not include the external contact tabs 16, 18. It is also possiL e to improve the fastening properties of the electronic module relative to the card body, for example by surface treatment of the nonmetallized portions of the insulating support 32 of the module, when such a support exists. It is also possible to provide I C I ,8 small holes through the module support, regardless of whether the support is made of insulating material or conducting material, in order to improve fastening by the injected material penetrating into the holes. It is also possible to implement physioo-chemical fastening, or to combine this t-ype of fastening with mechanical fautening or anchoring of the type described above. Physico-chemical fastening may result from a suitable selekL-tion of the injected material and of the materials from which the various portions of the electronic 10 module are made, in particular the material of the insulating support. It is also possible to implement chemical surface treatmient of a portion of the electronic module, for example the insulating support thereof, in order to enhance physicochemical fastening during the molding operation.
It can be seen that in the present patent application the term "fastening portion" of the electronic module does not only relate to a particular shape for the module coating enabling the module to be anchored in the card body, but also covers various dispositions or combinations of dispositions as described above which all seek to fix the electronic module in the card body when the body is molded thereover.
In the above description, the card has only one electronic module. The method of the invention may be used to make a card having it plurality of independent modules. In this case, the mold is provided with as many fixing means (studs 70, suction nozzles 72) as there are modules, and the electrical contact tabs of the modules may be flush with either of the two main faces of the card.
Figure 4 shows a second type of mold which may be used for implementing the method of the invention, and which further improves the retention of the electronic module at the beginning of the injection of plastic material into the mold.
The mold shown in Figure 4 has a fixed front portion which is identical to the front portion 60 of the Figure 3 mold. Thus, the various items relating to the front portion are given the same references as in Figure 3 together with a "prime" symbol as a suffix. The rear portion of the mold 9 comprises a first plate 82 whose periphery 82a is intended to be pressed against the face 60'1a of the front portion of the mold 60', together with a second plate 84 which is a moving plate. The moving plate 84 may be displaced relative to the plate 82 while being constrained to remain exactly parallel to -the face 64' of the front portion 60 of the mold. To do this, the rear face 84a of the plate 84 is provided with guide rods 86 capable of sliding with very little clearance in bearings 88 fixed to the plate 82. The plate 84 is of such a size that its edge 84b slides along the side wall 66' of the front portion Rated springs 90 urge the plate 84 away from the plate 82 up to a distance which is limited by abutments 92 fixed to the *f rods 86.
A memory card is made using the Figure 4 mold as follows.
The rear portion of the mold 80 is removed and the electronic module 14 is put into place against the wall 64' as described S S. above with reference to Figure 3. Then the rear portion 80 is fixed to the front portion 64' of the mold. The plate 84 cones into abutment against the face 52 of the coating 50 on the electronic module 14. The springs 90 are calibrated so that in this position, they are already partially compressed. The prestress on the springs 90 further improve<- the manner by I which the electronic module is pressed against the wall 64' of the mold. Thereafter, plastic material is injected into the mold via injection channel 68'. Initially, by virtue of the prestress in the springs 90, the plate 84 remains stationary pressed against the surface 52 of the module, and the plastic material fills the space surrounding the nvodule 14 as delimited by the plate 84 and the front portion of the mold 60'. This stage continues until the pressure of the plastic material overcomes the prestress of the springs 90. Thereafter, the plastic material progressively thrusts the plate 84 against the *compression of the springs 90 and the plate 84 is no longer in contact with the module 14. However, the plastic material by then already completely surroundls the electronic module 14 which helps keep it in place against the wall 64'. The plate 84 is urged against the springs by the plastic material until it comies into contact with mechanical abutments 96 fixed to the plate 82. This position is determined so that the card body obtained in this way has the desired thickness after shrinkage.
Injection is then stopped, and the rear portion 82 is removed so that the card can be extracted from the mold. This provides a card which is identical to that e-h-wn in Figure Naturally, the Figure 4 mold may include the variants illustrated in Figures 3a and 3b.
The plastic material which is used for making the card 10 body by injection molding may be an acrylonitryl-butadienestyrene or any other similar type of plastic material.
If A.B.S. is used, the material is injected at a temperature *Goo lying betwf-en 1800C and 2800C, and preferably lying between 0 220*C and 260*C, and the mold is maintained at a temperature lying between 50C and 1000C and preferably lying between 000 and 500C.
aeo Other suitable thermoplastic materials incl.ude polystyrene, polypropylene, and polyamine 11.
As shown in Figure 5, a magnetic track 112, may be fixed to the rear face 110 of the card body, e.g. by hot pressing.
It should be underlined that the method of making a card body in acordance with the invention is particularly well adapted to installing such a track. The portion 12b of the card body disposed between the electronic module and the rear face 110 of the card body is highly stable in spite of having reduced thickness where it is directly moZlded over the face 52 of the electronic module. Further, the material used is highly adapted to embossing data on one of the main faces of the card 3 body.
Reference is now made to Figures 6 and 7 for describing an embodiment of the mold suitable for obtaining a pluirality of cards simultaneously.
Figure 6 shows the front portion 160 of the mold which includes a plurality of mold cavities. The portion 160 of the mold has four cavities 162, 164, 166, and 168 which define the bodies of four cards which are manufactured simultaneously. An electronic module 14 is located in each of the cavities 162 to 168 using one of the techniques described with reference to Figures 3 to 3b. The cavities 162 to 168 are separated from one another by projecting portions 170 to 176. As shown in Figure 6, the projecting portions 170 to 176 do not comnpletely separate the cavities from one another, but leave passages enabling the cavities to conmunicate with one another. There is a central passage 178 which puts all four cavities into 0*00 cyxnunication with one another, and there are end passages 180 to 186 which make adjacent cavities communicate with each other 10 in the vicinity of the periphery of the front portion 160 of 0 0 a athe mold. As shown in Figure 7, the passage-s 178 to 186 are 0 0 0 shallower than the cavities 162 to 168. Naturally, these passages could have the sanve depth as the cavities. There are two ways in which material may be injected into the mo~ld.
Either injection takes place through a plurality of points 188 0 to 194 with each injection point opening out into ore of the SS passages 178 to 186, or else sheet injection is performed via a side opening 196 which opens out into the passage 182.
After unmolding, a single piece is obtained comprising four cards corresponding to the cavities 162 to 168, res-pectively, with the cards being irnterconnected by "bridges" which corresponds to the plastic material which has filled the passages 178 to 186.
o: 4.6 Obtaining four cards which are mechanically interconnected so that their relative positions are highly accurate is itself highly advantageous for subsequent offset printing on the card bodies. The printing can then take place simultaneously, and in addition it is easier to handle the larger-sized part for positioning purposes on the printing machine.
1>30 In order to separate the cards from one another, the "bridges" must be cut. This operation is not particularly difficult since the "bridges" are attached to the card bodies at the "corners" thereof, i.e. at non- functional points on the card body. In addition, the sprues relating to the injection points 188 to 196 which open out into these "bridges" are eliminated simultaneously with the "bridges".

Claims (3)

12. A memory card manufactured according to a method as claimed in any one of the preceding claims, the memory card 5 comprising a body made of plastic material having two main faces and including a memory module having an access face, the card being characterized in that said body is made as a single piece; in that said module includes at least one fastening portion, and in that said access face of the module is flush with one of the main faces of the card body with said fastening portions being completely embedded in 1he plastic material constituting said body. 4 13. A memory card according to claim 12, characterized in that the card body is made of acrylonitryl-butadiene-styrene. 25 14. A memory card according to claim 12, characterized in that 1 the card body is made of a plastic material selected from the group comprising: polystyrene; polypropylene; and polyamine 11. A memory card according to claim 12, characterized in that said memory module is an electronic module comprising an insulating support provided with an external layer of electrical contacts, a chip provided with external electrical A It4.4 contact tabs, a chip fixed to said support, electrical 7 jz A~ ?r 15 connection means between the terminals of said chip and said contact tabs, and a coating material coating said chip, said fastening portion being constituted by a special shape given to said coating material.
16. A method of manufacturing a memory card comprising a card body and a memory module having an access face, substantially as herein described with reference to the accompanying drawings.
17. A memory card manufactured according to the method of the present invention, the memory card being substantially as herein described with reference to the accompanying drawings. Dated this 31st day of May 1990. sets SCHLUMBERGER INDUSTRIES By Its Patent Attorneys: :5 GRIFFITH HACK CO. Fellows Institute of Patent Attorneys of Australia.
AU10160/88A 1987-01-16 1988-01-11 A method of making memory cards, and cards obtained by implementing said method Ceased AU600785B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR8700446A FR2609821B1 (en) 1987-01-16 1987-01-16 METHOD FOR REALIZING MEMORY CARDS AND CARDS OBTAINED BY THE IMPLEMENTATION OF SAID METHOD
FR8700446 1987-01-16

Publications (2)

Publication Number Publication Date
AU1016088A AU1016088A (en) 1988-07-21
AU600785B2 true AU600785B2 (en) 1990-08-23

Family

ID=9346968

Family Applications (1)

Application Number Title Priority Date Filing Date
AU10160/88A Ceased AU600785B2 (en) 1987-01-16 1988-01-11 A method of making memory cards, and cards obtained by implementing said method

Country Status (18)

Country Link
EP (1) EP0277854B1 (en)
JP (1) JPS63239097A (en)
KR (1) KR880009317A (en)
AT (1) ATE74456T1 (en)
AU (1) AU600785B2 (en)
BR (1) BR8800135A (en)
CA (1) CA1306058C (en)
DE (1) DE3869635D1 (en)
DK (1) DK16988A (en)
ES (1) ES2031248T3 (en)
FI (1) FI93156C (en)
FR (1) FR2609821B1 (en)
GR (1) GR3004900T3 (en)
IN (1) IN170183B (en)
NO (1) NO178089C (en)
NZ (1) NZ223192A (en)
PT (1) PT86557A (en)
ZA (1) ZA88279B (en)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0825349B2 (en) * 1987-10-22 1996-03-13 日本ユーロテック株式会社 Card manufacturing method
US4943708A (en) * 1988-02-01 1990-07-24 Motorola, Inc. Data device module having locking groove
US5030407A (en) * 1988-04-28 1991-07-09 Schlumberger Industries Method of making cards having graphics elements thereon
FR2636755B1 (en) * 1988-09-16 1992-05-22 Schlumberger Ind Sa METHOD FOR PRODUCING MEMORY CARDS AND CARDS OBTAINED BY SAID METHOD
EP0361194A3 (en) * 1988-09-30 1991-06-12 Siemens Aktiengesellschaft Method of enveloping electrical or electronic components or component assemblies, and envelope for electrical or electronic components or component assemblies
JP2559834B2 (en) * 1989-01-12 1996-12-04 三菱電機株式会社 IC card
JPH0687484B2 (en) * 1989-04-06 1994-11-02 三菱電機株式会社 IC card module
US5244840A (en) * 1989-05-23 1993-09-14 Mitsubishi Denki Kabushiki Kaisha Method for manufacturing an encapsulated IC card having a molded frame and a circuit board
FR2659157B2 (en) * 1989-05-26 1994-09-30 Lemaire Gerard METHOD FOR MANUFACTURING A CARD, SAID CARD, AND CARD OBTAINED BY THIS PROCESS.
FR2647571B1 (en) * 1989-05-26 1994-07-22 Lemaire Gerard METHOD FOR MANUFACTURING A CARD, SAID CARD, AND CARD OBTAINED THEREBY
FR2650530B1 (en) * 1989-08-07 1991-11-29 Schlumberger Ind Sa METHOD FOR REALIZING CARD BODIES WITH GRAPHICS
FR2666687A1 (en) * 1990-09-06 1992-03-13 Sgs Thomson Microelectronics Integrated circuit with moulded housing comprising a thermal dissipator and method of manufacture
IT1243817B (en) * 1990-10-09 1994-06-28 Sgs Thomson Microelectronics METHOD FOR THE MANUFACTURE OF PLASTIC CONTAINERS, FOR INTEGRATED CIRCUITS, WITH BUILT-IN THERMAL DISSIPATOR
DE4038126C2 (en) * 1990-11-27 1993-12-16 Mannesmann Ag Method and device for producing a decorated chip card
FI913357A (en) * 1991-07-10 1993-01-11 Valtion Teknillinen FOERFARANDE OCH FORM FOER FRAMSTAELLNING AV EN STRAENGSPRUTAD ELEKTRONIKMODUL
US5286426A (en) * 1992-04-01 1994-02-15 Allegro Microsystems, Inc. Assembling a lead frame between a pair of molding cavity plates
DE4401588C2 (en) * 1994-01-20 2003-02-20 Gemplus Gmbh Method for capping a chip card module and chip card module
DE9422424U1 (en) * 1994-02-04 2002-02-21 Giesecke & Devrient GmbH, 81677 München Chip card with an electronic module
JPH0890600A (en) * 1994-09-22 1996-04-09 Rhythm Watch Co Ltd Ic card manufacturing mold
DE4435802A1 (en) * 1994-10-06 1996-04-11 Giesecke & Devrient Gmbh Method for producing data carriers with embedded elements and device for carrying out the method
JP3409943B2 (en) * 1995-05-25 2003-05-26 昭和電工株式会社 Plug for infusion container and method for producing the same
FR2735714B1 (en) * 1995-06-21 1997-07-25 Schlumberger Ind Sa METHOD FOR PRINTING A GRAPHICS ON A MEMORY CARD
DE19625228C2 (en) 1996-06-24 1998-05-14 Siemens Ag System carrier for mounting an integrated circuit in an injection molded housing
EP0890928A3 (en) * 1997-07-10 2001-06-13 Sarnoff Corporation Transmission apparatus and remotely identifying an electronically coded article
EP0938060A1 (en) * 1998-02-20 1999-08-25 ESEC Management SA Method for fabricating a chip article and chip article
WO2000019513A1 (en) * 1998-09-29 2000-04-06 Tyco Electronics Logistics Ag Method for moulding a flat electronics module onto the body of a plastic card by means of thermoplastic injection moulding
FR2895547B1 (en) * 2005-12-26 2008-06-06 Oberthur Card Syst Sa METHOD FOR MANUFACTURING A MICROCIRCUIT BOARD
ATE551668T1 (en) 2006-11-17 2012-04-15 Oberthur Technologies METHOD FOR PRODUCING AN ENTITY AND CORRESPONDING APPARATUS
WO2018022755A1 (en) 2016-07-27 2018-02-01 Composecure, Llc Overmolded electronic components for transaction cards and methods of making thereof
US10977540B2 (en) 2016-07-27 2021-04-13 Composecure, Llc RFID device
US11618191B2 (en) 2016-07-27 2023-04-04 Composecure, Llc DI metal transaction devices and processes for the manufacture thereof
US10762412B2 (en) 2018-01-30 2020-09-01 Composecure, Llc DI capacitive embedded metal card
US11151437B2 (en) 2017-09-07 2021-10-19 Composecure, Llc Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting
EP3679523B1 (en) 2017-09-07 2023-02-01 Composecure LLC Transaction card with embedded electronic components and process for manufacture
PL3698280T3 (en) 2017-10-18 2022-12-12 Composecure, Llc Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting
USD948613S1 (en) 2020-04-27 2022-04-12 Composecure, Llc Layer of a transaction card

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2081974A (en) * 1980-08-05 1982-02-24 Gao Ges Automation Org Carrier element for an ic module
FR2520541A1 (en) * 1982-01-22 1983-07-29 Flonic Sa Mounting assembly for memory integrated circuit in bank card - comprises flexible film support carrying metallic connecting pads for chip connections

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6086850A (en) * 1983-10-18 1985-05-16 Dainippon Printing Co Ltd Ic card
JPS60146383A (en) * 1984-01-10 1985-08-02 Dainippon Printing Co Ltd Ic card
JPS61222712A (en) * 1985-03-28 1986-10-03 Mitsubishi Electric Corp Manufacture of resin encapsulated body
JPS6232094A (en) * 1985-08-05 1987-02-12 カシオ計算機株式会社 Integrated circuit card

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2081974A (en) * 1980-08-05 1982-02-24 Gao Ges Automation Org Carrier element for an ic module
FR2520541A1 (en) * 1982-01-22 1983-07-29 Flonic Sa Mounting assembly for memory integrated circuit in bank card - comprises flexible film support carrying metallic connecting pads for chip connections

Also Published As

Publication number Publication date
NO880166L (en) 1988-07-18
NO880166D0 (en) 1988-01-15
GR3004900T3 (en) 1993-04-28
DK16988A (en) 1988-07-17
NO178089B (en) 1995-10-09
FI880152A0 (en) 1988-01-14
DE3869635D1 (en) 1992-05-07
PT86557A (en) 1989-01-30
KR880009317A (en) 1988-09-14
EP0277854B1 (en) 1992-04-01
ES2031248T3 (en) 1992-12-01
IN170183B (en) 1992-02-22
ATE74456T1 (en) 1992-04-15
AU1016088A (en) 1988-07-21
FR2609821A1 (en) 1988-07-22
FI880152A (en) 1988-07-17
ZA88279B (en) 1988-07-01
JPS63239097A (en) 1988-10-05
NZ223192A (en) 1989-09-27
FI93156C (en) 1995-02-27
EP0277854A1 (en) 1988-08-10
CA1306058C (en) 1992-08-04
FI93156B (en) 1994-11-15
BR8800135A (en) 1988-08-23
FR2609821B1 (en) 1989-03-31
NO178089C (en) 1996-01-17
DK16988D0 (en) 1988-01-14

Similar Documents

Publication Publication Date Title
AU600785B2 (en) A method of making memory cards, and cards obtained by implementing said method
US5057460A (en) Method of making an electronic module, for insertion into an electronic memory-card body
US4961893A (en) Method for manufacturing memory cards
US4996411A (en) Method of manufacturing a card having electronic memory and a card obtained by performing said method
JP3095762B2 (en) Method for producing a microchip card incorporating a microprocessor chip and a microchip card produced by this method
US4974120A (en) IC card
AU603142B2 (en) A method of making cards, in particular memory cards
US6010370A (en) Insert molded electrical connector and method for producing same
US5510074A (en) Method for manufacturing smart cards
US6219913B1 (en) Connector producing method and a connector produced by insert molding
CN1199133C (en) Chip card equipped with loop antenna, and assiciated micromodule
US5173840A (en) Molded ic card
US4737620A (en) Method of manufacturing cards having an electronic memory and cards obtained by performing said method
US4822550A (en) Method of molding a protective cover on a pin grid array
US20040259423A1 (en) Dongle which is intended to be connected to a port of a telecommunications device
KR100487175B1 (en) Data carrier having a module including an electronic component and having a coil, and method of manufacturing such a data carrier
US6045739A (en) Method of manufacturing a molded product internally having inserts in a layered state
DK0791446T3 (en) Method and plastic injection mold for making a composite body
EP1346316B1 (en) Electronic data storage medium
CN100532059C (en) Method and device for forming modularized electronic component and modularized electronic component
JP3182097B2 (en) Molding method of case integrated connector
JP3043623B2 (en) Connector insert molding method
JPH02273486A (en) Manufacture of electric parts lines and manufacturing molds thereof
JP2763784B2 (en) Electric parts row
CA1294095C (en) Method of making cards, in particular memory cards

Legal Events

Date Code Title Description
MK14 Patent ceased section 143(a) (annual fees not paid) or expired