AU2003236212A1 - System for aligning wafers and for reading micro bar-codes and marks on chips using laser - Google Patents
System for aligning wafers and for reading micro bar-codes and marks on chips using laserInfo
- Publication number
- AU2003236212A1 AU2003236212A1 AU2003236212A AU2003236212A AU2003236212A1 AU 2003236212 A1 AU2003236212 A1 AU 2003236212A1 AU 2003236212 A AU2003236212 A AU 2003236212A AU 2003236212 A AU2003236212 A AU 2003236212A AU 2003236212 A1 AU2003236212 A1 AU 2003236212A1
- Authority
- AU
- Australia
- Prior art keywords
- marks
- codes
- chips
- laser
- micro bar
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54453—Marks applied to semiconductor devices or parts for use prior to dicing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| ES200201114A ES2195786B1 (en) | 2002-05-16 | 2002-05-16 | SYSTEM OF ALIGNMENT OF OBLETS AND READING OF MICROCODES OF BARS AND BRANDS IN CHIPS WITH LASER. |
| ESP200201114 | 2002-05-16 | ||
| PCT/ES2003/000207 WO2003098683A1 (en) | 2002-05-16 | 2003-05-09 | System for aligning wafers and for reading micro bar-codes and marks on chips using laser |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AU2003236212A1 true AU2003236212A1 (en) | 2003-12-02 |
Family
ID=29433277
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU2003236212A Abandoned AU2003236212A1 (en) | 2002-05-16 | 2003-05-09 | System for aligning wafers and for reading micro bar-codes and marks on chips using laser |
Country Status (3)
| Country | Link |
|---|---|
| AU (1) | AU2003236212A1 (en) |
| ES (1) | ES2195786B1 (en) |
| WO (1) | WO2003098683A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101812209B1 (en) * | 2016-02-16 | 2017-12-26 | 주식회사 이오테크닉스 | Laser marking apparatus and laser marking method |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3682675D1 (en) * | 1986-04-29 | 1992-01-09 | Ibm Deutschland | INTERFEROMETRIC MASK SUBSTRATE ALIGNMENT. |
| JPH0715927B2 (en) * | 1987-10-30 | 1995-02-22 | 東京エレクトロン株式会社 | Probe device |
| US5733711A (en) * | 1996-01-02 | 1998-03-31 | Micron Technology, Inc. | Process for forming both fixed and variable patterns on a single photoresist resin mask |
| US5705320A (en) * | 1996-11-12 | 1998-01-06 | Taiwan Semiconductor Manufacturing Company, Ltd. | Recovery of alignment marks and laser marks after chemical-mechanical-polishing |
| JPH11135390A (en) * | 1997-10-27 | 1999-05-21 | Sony Corp | Wafer on which id is printed, manufacture of semiconductor device and manufacture equipment therefor |
| JP2002246446A (en) * | 2001-02-20 | 2002-08-30 | Assist Japan Kk | Wafer alignment device |
-
2002
- 2002-05-16 ES ES200201114A patent/ES2195786B1/en not_active Expired - Fee Related
-
2003
- 2003-05-09 WO PCT/ES2003/000207 patent/WO2003098683A1/en not_active Application Discontinuation
- 2003-05-09 AU AU2003236212A patent/AU2003236212A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| ES2195786B1 (en) | 2005-03-16 |
| WO2003098683A1 (en) | 2003-11-27 |
| ES2195786A1 (en) | 2003-12-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |