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AU2003287116A1 - Strip-line topology for a high speed pcb with low dissipation - Google Patents

Strip-line topology for a high speed pcb with low dissipation

Info

Publication number
AU2003287116A1
AU2003287116A1 AU2003287116A AU2003287116A AU2003287116A1 AU 2003287116 A1 AU2003287116 A1 AU 2003287116A1 AU 2003287116 A AU2003287116 A AU 2003287116A AU 2003287116 A AU2003287116 A AU 2003287116A AU 2003287116 A1 AU2003287116 A1 AU 2003287116A1
Authority
AU
Australia
Prior art keywords
strip
high speed
low dissipation
line topology
speed pcb
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003287116A
Other versions
AU2003287116A8 (en
Inventor
Igor Anatolievich Abrosimov
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of AU2003287116A1 publication Critical patent/AU2003287116A1/en
Publication of AU2003287116A8 publication Critical patent/AU2003287116A8/en
Abandoned legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0237High frequency adaptations
    • H05K1/0242Structural details of individual signal conductors, e.g. related to the skin effect
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09218Conductive traces
    • H05K2201/09236Parallel layout
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09654Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09672Superposed layout, i.e. in different planes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4611Manufacturing multilayer circuits by laminating two or more circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
AU2003287116A 2002-12-06 2003-11-27 Strip-line topology for a high speed pcb with low dissipation Abandoned AU2003287116A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US43122602P 2002-12-06 2002-12-06
US60/431,226 2002-12-06
PCT/RU2003/000529 WO2004054332A2 (en) 2002-12-06 2003-11-27 Strip-line topology for a high speed pcb with low dissipation

Publications (2)

Publication Number Publication Date
AU2003287116A1 true AU2003287116A1 (en) 2004-06-30
AU2003287116A8 AU2003287116A8 (en) 2004-06-30

Family

ID=32507683

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003287116A Abandoned AU2003287116A1 (en) 2002-12-06 2003-11-27 Strip-line topology for a high speed pcb with low dissipation

Country Status (2)

Country Link
AU (1) AU2003287116A1 (en)
WO (1) WO2004054332A2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9648723B2 (en) 2015-09-16 2017-05-09 International Business Machines Corporation Process of fabricating printed circuit board
JP2017112191A (en) * 2015-12-15 2017-06-22 富士電機株式会社 Printed wiring board
US10903543B2 (en) * 2016-12-06 2021-01-26 Hewlett Packard Enterprise Development Lp PCB transmission lines having reduced loss

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1915633A1 (en) * 1969-03-27 1970-10-08 Licentia Gmbh Low-loss strip line with specified wave - impedance
US5268064A (en) * 1992-02-04 1993-12-07 Trimble Navigation Limited Copper clad epoxy printed circuit board suitable for microwave frequencies encountered in GPS receivers
JPH11112113A (en) * 1997-09-30 1999-04-23 Hitachi Ltd Electronic equipment
JP3675688B2 (en) * 2000-01-27 2005-07-27 寛治 大塚 Wiring board and manufacturing method thereof

Also Published As

Publication number Publication date
WO2004054332A2 (en) 2004-06-24
WO2004054332A3 (en) 2004-11-18
AU2003287116A8 (en) 2004-06-30

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase