[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

AU2003271061A1 - Connection method and connection device - Google Patents

Connection method and connection device

Info

Publication number
AU2003271061A1
AU2003271061A1 AU2003271061A AU2003271061A AU2003271061A1 AU 2003271061 A1 AU2003271061 A1 AU 2003271061A1 AU 2003271061 A AU2003271061 A AU 2003271061A AU 2003271061 A AU2003271061 A AU 2003271061A AU 2003271061 A1 AU2003271061 A1 AU 2003271061A1
Authority
AU
Australia
Prior art keywords
connection
connection device
connection method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003271061A
Inventor
Akira Yamauchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toray Engineering Co Ltd
Original Assignee
Toray Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Engineering Co Ltd filed Critical Toray Engineering Co Ltd
Publication of AU2003271061A1 publication Critical patent/AU2003271061A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/22—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/24—Preliminary treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/75252—Means for applying energy, e.g. heating means in the upper part of the bonding apparatus, e.g. in the bonding head
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Wire Bonding (AREA)
AU2003271061A 2002-09-25 2003-09-24 Connection method and connection device Abandoned AU2003271061A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2002-278646 2002-09-25
JP2002278646 2002-09-25
JP2002364903 2002-12-17
JP2002-364903 2002-12-17
PCT/JP2003/012144 WO2004028732A1 (en) 2002-09-25 2003-09-24 Connection method and connection device

Publications (1)

Publication Number Publication Date
AU2003271061A1 true AU2003271061A1 (en) 2004-04-19

Family

ID=32044605

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003271061A Abandoned AU2003271061A1 (en) 2002-09-25 2003-09-24 Connection method and connection device

Country Status (3)

Country Link
AU (1) AU2003271061A1 (en)
TW (1) TW200406875A (en)
WO (1) WO2004028732A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB0704753D0 (en) * 2007-03-13 2007-04-18 Airbus Uk Ltd Preparation of a component for use in a joint
JP6663649B2 (en) * 2015-04-14 2020-03-13 東レエンジニアリング株式会社 Semiconductor chip mounting method and semiconductor device
US20190363318A1 (en) * 2017-01-31 2019-11-28 Panasonic Intellectual Property Management Co., Ltd. Battery module and method for manufacturing same

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2854963B2 (en) * 1990-11-28 1999-02-10 株式会社日立製作所 Solid phase bonding method and apparatus
JPH0726076U (en) * 1993-10-13 1995-05-16 三菱重工業株式会社 Room temperature bonding equipment
JP3252745B2 (en) * 1997-03-31 2002-02-04 関西日本電気株式会社 Semiconductor device and manufacturing method thereof
US6605175B1 (en) * 1999-02-19 2003-08-12 Unaxis Balzers Aktiengesellschaft Process for manufacturing component parts, use of same, with air bearing supported workpieces and vacuum processing chamber

Also Published As

Publication number Publication date
TW200406875A (en) 2004-05-01
WO2004028732A1 (en) 2004-04-08

Similar Documents

Publication Publication Date Title
AU2003244310A1 (en) Inter-authentication method and device
AU2003214603A1 (en) Auto-focusing method and device
AU2003223514A1 (en) Lighting device and method
AU2003213357A1 (en) Reception device and reception method
AU2003245712A1 (en) Infusion device and method thereof
AU2003235876A1 (en) Authoring device and authoring method
AU2003259919A1 (en) Element placement method and apparatus
AU2003303837A1 (en) Handwriting-input device and method
AU2003235378A1 (en) Mounting method and mounting device
AU2003266557A1 (en) Bonding device and method
AU2003212875A1 (en) Anastomosis device and method
AU2002245675A1 (en) Electromanipulation device and method
AU2003231477A1 (en) Transmission device and transmission method
AU2003280576A1 (en) Transmitting device and transmitting method
AU2003284473A1 (en) Method and device for joining
AU2002347417A1 (en) Space-dyeing method and apparatus
AU2003280631A1 (en) Soldering method and device
AU2003244462A1 (en) Coating device and coating method
AU2003266601A1 (en) Connection method and connection device
AU2003284474A1 (en) Method and device for joining
AU2003242376A1 (en) Reception device and reception method
AU2003266600A1 (en) Connection method and connection device
AU2003289282A1 (en) Diagnosis device and diagnosis method
AU2003248244A1 (en) Reception device and reception method
AUPR496501A0 (en) Method and device

Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase