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AU2003262924A1 - The laminate structures and method for the electrical testing thereof - Google Patents

The laminate structures and method for the electrical testing thereof

Info

Publication number
AU2003262924A1
AU2003262924A1 AU2003262924A AU2003262924A AU2003262924A1 AU 2003262924 A1 AU2003262924 A1 AU 2003262924A1 AU 2003262924 A AU2003262924 A AU 2003262924A AU 2003262924 A AU2003262924 A AU 2003262924A AU 2003262924 A1 AU2003262924 A1 AU 2003262924A1
Authority
AU
Australia
Prior art keywords
electrical testing
laminate structures
laminate
structures
testing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003262924A
Other versions
AU2003262924A8 (en
Inventor
Todd Bingham
Mark Dhaenens
Scott Mckee
William Zidar
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Park Aerospace Corp
Original Assignee
Park Electrochemical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Park Electrochemical Corp filed Critical Park Electrochemical Corp
Publication of AU2003262924A1 publication Critical patent/AU2003262924A1/en
Publication of AU2003262924A8 publication Critical patent/AU2003262924A8/en
Abandoned legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0254High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0256Electrical insulation details, e.g. around high voltage areas
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/16Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/0929Conductive planes
    • H05K2201/09309Core having two or more power planes; Capacitive laminate of two power planes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16Inspection; Monitoring; Aligning
    • H05K2203/162Testing a finished product, e.g. heat cycle testing of solder joints

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
AU2003262924A 2002-08-26 2003-08-26 The laminate structures and method for the electrical testing thereof Abandoned AU2003262924A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US40629302P 2002-08-26 2002-08-26
US60/406,293 2002-08-26
PCT/US2003/026874 WO2004019663A2 (en) 2002-08-26 2003-08-26 The laminate structures and method for the electrical testing thereof

Publications (2)

Publication Number Publication Date
AU2003262924A1 true AU2003262924A1 (en) 2004-03-11
AU2003262924A8 AU2003262924A8 (en) 2004-03-11

Family

ID=31946964

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003262924A Abandoned AU2003262924A1 (en) 2002-08-26 2003-08-26 The laminate structures and method for the electrical testing thereof

Country Status (2)

Country Link
AU (1) AU2003262924A1 (en)
WO (1) WO2004019663A2 (en)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69534545T2 (en) * 1994-12-28 2006-08-10 Ntt Mobile Communications Network Inc. Automatic call reception procedure
US6134433A (en) * 1996-12-09 2000-10-17 Telefonaktiebolaget L M Ericsson (Publ) System and method of forwarding data calls in a radio telecommunications network
EP0939538B1 (en) * 1997-01-07 2007-03-14 Matsushita Electric Industrial Co., Ltd. Multimedia terminal device
FI105135B (en) * 1997-04-30 2000-06-15 Nokia Mobile Phones Ltd A system and method for transmitting a call and a mobile station
US6114015A (en) * 1998-10-13 2000-09-05 Matsushita Electronic Materials, Inc. Thin-laminate panels for capacitive printed-circuit boards and methods for making the same
US6404615B1 (en) * 2000-02-16 2002-06-11 Intarsia Corporation Thin film capacitors

Also Published As

Publication number Publication date
WO2004019663A3 (en) 2004-04-01
AU2003262924A8 (en) 2004-03-11
WO2004019663A2 (en) 2004-03-04

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase