AU2002357554A1 - A method of producing a composite electroconductive material - Google Patents
A method of producing a composite electroconductive materialInfo
- Publication number
- AU2002357554A1 AU2002357554A1 AU2002357554A AU2002357554A AU2002357554A1 AU 2002357554 A1 AU2002357554 A1 AU 2002357554A1 AU 2002357554 A AU2002357554 A AU 2002357554A AU 2002357554 A AU2002357554 A AU 2002357554A AU 2002357554 A1 AU2002357554 A1 AU 2002357554A1
- Authority
- AU
- Australia
- Prior art keywords
- producing
- electroconductive material
- composite electroconductive
- composite
- electroconductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M4/00—Electrodes
- H01M4/02—Electrodes composed of, or comprising, active material
- H01M4/64—Carriers or collectors
- H01M4/66—Selection of materials
- H01M4/661—Metal or alloys, e.g. alloy coatings
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/20—Metallic material, boron or silicon on organic substrates
- C23C14/205—Metallic material, boron or silicon on organic substrates by cathodic sputtering
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Mechanical Engineering (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Laminated Bodies (AREA)
- Chemically Coating (AREA)
- Electroplating Methods And Accessories (AREA)
- Physical Vapour Deposition (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Chemical Or Physical Treatment Of Fibers (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN01135296.5 | 2001-12-24 | ||
CNB011352965A CN1148465C (en) | 2001-12-24 | 2001-12-24 | Method for preparing composite conductive material |
PCT/CN2002/000908 WO2003056058A1 (en) | 2001-12-24 | 2002-12-24 | A method of producing a composite electroconductive material |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2002357554A1 true AU2002357554A1 (en) | 2003-07-15 |
Family
ID=4673103
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2002357554A Abandoned AU2002357554A1 (en) | 2001-12-24 | 2002-12-24 | A method of producing a composite electroconductive material |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2003286588A (en) |
CN (1) | CN1148465C (en) |
AU (1) | AU2002357554A1 (en) |
WO (1) | WO2003056058A1 (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101928920B (en) * | 2010-08-25 | 2012-01-11 | 北京航空航天大学 | Multilayer composite wire rotary preparation device and preparation method |
CN103434210A (en) * | 2013-08-05 | 2013-12-11 | 盐城工学院 | Preparation method of high molecular material-metal film composite conducting stably |
CN104513980A (en) * | 2014-11-12 | 2015-04-15 | 惠州建邦精密塑胶有限公司 | Metal layer structure formed on plastic surface and surface treatment technology |
CN105350045A (en) * | 2015-10-30 | 2016-02-24 | 浙江理工大学 | Preparing method of electro-coppering conductive fiber |
CN108103506A (en) * | 2017-12-18 | 2018-06-01 | 常德力元新材料有限责任公司 | A kind of preparation method of foam metal shielding material |
CN108707935A (en) * | 2018-05-30 | 2018-10-26 | 信利光电股份有限公司 | A method of preparing copper film on the insulating material |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03100197A (en) * | 1989-09-12 | 1991-04-25 | Nippon G Ii Plast Kk | Method for plating molded product of polymer blend |
EP0423947B1 (en) * | 1989-09-22 | 1994-09-07 | Minnesota Mining And Manufacturing Company | Process for electroplating electroactive polymers and articles derived therefrom |
JPH03274261A (en) * | 1990-03-26 | 1991-12-05 | Hitachi Chem Co Ltd | Formation of metal layer on polymer film |
JPH05222578A (en) * | 1992-02-14 | 1993-08-31 | Electroplating Eng Of Japan Co | Production of noble metal plated product |
CN1040237C (en) * | 1995-03-11 | 1998-10-14 | 吉林大学 | Process for preparing spongy foam nickel |
-
2001
- 2001-12-24 CN CNB011352965A patent/CN1148465C/en not_active Expired - Lifetime
-
2002
- 2002-12-24 AU AU2002357554A patent/AU2002357554A1/en not_active Abandoned
- 2002-12-24 JP JP2002372627A patent/JP2003286588A/en active Pending
- 2002-12-24 WO PCT/CN2002/000908 patent/WO2003056058A1/en not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
CN1359110A (en) | 2002-07-17 |
WO2003056058A1 (en) | 2003-07-10 |
CN1148465C (en) | 2004-05-05 |
JP2003286588A (en) | 2003-10-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |