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AU2002238409A1 - Method and device for determining the properties of an integrated circuit - Google Patents

Method and device for determining the properties of an integrated circuit

Info

Publication number
AU2002238409A1
AU2002238409A1 AU2002238409A AU3840902A AU2002238409A1 AU 2002238409 A1 AU2002238409 A1 AU 2002238409A1 AU 2002238409 A AU2002238409 A AU 2002238409A AU 3840902 A AU3840902 A AU 3840902A AU 2002238409 A1 AU2002238409 A1 AU 2002238409A1
Authority
AU
Australia
Prior art keywords
properties
determining
integrated circuit
integrated
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
AU2002238409A
Inventor
Christian K. Kalus
Iouri Malov
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SIGMA-C GmbH
Original Assignee
SIGMA C GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SIGMA C GmbH filed Critical SIGMA C GmbH
Publication of AU2002238409A1 publication Critical patent/AU2002238409A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/36—Masks having proximity correction features; Preparation thereof, e.g. optical proximity correction [OPC] design processes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/20—Design optimisation, verification or simulation
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Computer Hardware Design (AREA)
  • Evolutionary Computation (AREA)
  • Geometry (AREA)
  • General Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Weting (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
AU2002238409A 2000-11-30 2001-11-30 Method and device for determining the properties of an integrated circuit Withdrawn AU2002238409A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10059516 2000-11-30
DE10059516 2000-11-30
PCT/EP2001/014004 WO2002045014A2 (en) 2000-11-30 2001-11-30 Method and device for determining the properties of an integrated circuit

Publications (1)

Publication Number Publication Date
AU2002238409A1 true AU2002238409A1 (en) 2002-06-11

Family

ID=7665267

Family Applications (2)

Application Number Title Priority Date Filing Date
AU2002238409A Withdrawn AU2002238409A1 (en) 2000-11-30 2001-11-30 Method and device for determining the properties of an integrated circuit
AU2002227965A Abandoned AU2002227965A1 (en) 2000-11-30 2001-11-30 Method and device for determining the properties of an integrated circuit

Family Applications After (1)

Application Number Title Priority Date Filing Date
AU2002227965A Abandoned AU2002227965A1 (en) 2000-11-30 2001-11-30 Method and device for determining the properties of an integrated circuit

Country Status (7)

Country Link
US (1) US7302090B2 (en)
EP (1) EP1337838B1 (en)
JP (1) JP4216592B2 (en)
KR (1) KR100846018B1 (en)
AU (2) AU2002238409A1 (en)
DE (1) DE50111874D1 (en)
WO (2) WO2002045014A2 (en)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1523696B1 (en) * 2002-07-15 2016-12-21 KLA-Tencor Corporation Defect inspection methods that include acquiring aerial images of a reticle for different lithographic process variables
US7480889B2 (en) * 2003-04-06 2009-01-20 Luminescent Technologies, Inc. Optimized photomasks for photolithography
US7124394B1 (en) * 2003-04-06 2006-10-17 Luminescent Technologies, Inc. Method for time-evolving rectilinear contours representing photo masks
US7698665B2 (en) 2003-04-06 2010-04-13 Luminescent Technologies, Inc. Systems, masks, and methods for manufacturable masks using a functional representation of polygon pattern
JP4351928B2 (en) * 2004-02-23 2009-10-28 株式会社東芝 Mask data correction method, photomask manufacturing method, and mask data correction program
US7448012B1 (en) 2004-04-21 2008-11-04 Qi-De Qian Methods and system for improving integrated circuit layout
WO2005111796A2 (en) * 2004-05-09 2005-11-24 Mentor Graphics Corporation Defect location identification for microdevice manufacturing and test
US7251807B2 (en) * 2005-02-24 2007-07-31 Synopsys, Inc. Method and apparatus for identifying a manufacturing problem area in a layout using a process-sensitivity model
WO2007033362A2 (en) * 2005-09-13 2007-03-22 Luminescent Technologies, Inc. Systems, masks, and methods for photolithography
WO2007041602A2 (en) 2005-10-03 2007-04-12 Luminescent Technologies, Inc. Lithography verification using guard bands
US7921385B2 (en) 2005-10-03 2011-04-05 Luminescent Technologies Inc. Mask-pattern determination using topology types
US7793253B2 (en) 2005-10-04 2010-09-07 Luminescent Technologies, Inc. Mask-patterns including intentional breaks
US7703049B2 (en) 2005-10-06 2010-04-20 Luminescent Technologies, Inc. System, masks, and methods for photomasks optimized with approximate and accurate merit functions
KR101530456B1 (en) * 2005-11-18 2015-06-22 케이엘에이-텐코 코포레이션 Methods and systems for utilizing design data in combination with inspection data
EP1984895A4 (en) * 2006-02-01 2014-09-24 Applied Materials Israel Ltd Method and system for evaluating a variation in a parameter of a pattern
WO2007147826A1 (en) * 2006-06-23 2007-12-27 Sagantec Israel Ltd Layout processing system
US8644588B2 (en) 2006-09-20 2014-02-04 Luminescent Technologies, Inc. Photo-mask and wafer image reconstruction
US8331645B2 (en) * 2006-09-20 2012-12-11 Luminescent Technologies, Inc. Photo-mask and wafer image reconstruction
US8006203B2 (en) * 2008-08-28 2011-08-23 Synopsys, Inc. Bulk image modeling for optical proximity correction
US9232670B2 (en) 2010-02-02 2016-01-05 Apple Inc. Protection and assembly of outer glass surfaces of an electronic device housing
US8463016B2 (en) * 2010-02-05 2013-06-11 Luminescent Technologies, Inc. Extending the field of view of a mask-inspection image
US8612903B2 (en) 2010-09-14 2013-12-17 Luminescent Technologies, Inc. Technique for repairing a reflective photo-mask
US8555214B2 (en) 2010-09-14 2013-10-08 Luminescent Technologies, Inc. Technique for analyzing a reflective photo-mask
US8458622B2 (en) 2010-11-29 2013-06-04 Luminescent Technologies, Inc. Photo-mask acceptance technique
US8386968B2 (en) 2010-11-29 2013-02-26 Luminescent Technologies, Inc. Virtual photo-mask critical-dimension measurement
US9005852B2 (en) 2012-09-10 2015-04-14 Dino Technology Acquisition Llc Technique for repairing a reflective photo-mask
US8653454B2 (en) 2011-07-13 2014-02-18 Luminescent Technologies, Inc. Electron-beam image reconstruction
US9091935B2 (en) 2013-03-11 2015-07-28 Kla-Tencor Corporation Multistage extreme ultra-violet mask qualification
US9494854B2 (en) 2013-03-14 2016-11-15 Kla-Tencor Corporation Technique for repairing an EUV photo-mask
US11798157B2 (en) 2019-10-11 2023-10-24 The Regents Of The University Of Michigan Non-destructive imaging techniques for integrated circuits and other applications

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5801954A (en) * 1996-04-24 1998-09-01 Micron Technology, Inc. Process for designing and checking a mask layout
US6078738A (en) * 1997-05-08 2000-06-20 Lsi Logic Corporation Comparing aerial image to SEM of photoresist or substrate pattern for masking process characterization
US6757645B2 (en) * 1997-09-17 2004-06-29 Numerical Technologies, Inc. Visual inspection and verification system
US6091845A (en) * 1998-02-24 2000-07-18 Micron Technology, Inc. Inspection technique of photomask

Also Published As

Publication number Publication date
US7302090B2 (en) 2007-11-27
WO2002044699A3 (en) 2002-09-19
DE50111874D1 (en) 2007-02-22
KR20040022201A (en) 2004-03-11
US20040136587A1 (en) 2004-07-15
EP1337838A2 (en) 2003-08-27
WO2002044699A2 (en) 2002-06-06
JP4216592B2 (en) 2009-01-28
WO2002045014A2 (en) 2002-06-06
AU2002227965A1 (en) 2002-06-11
EP1337838B1 (en) 2007-01-10
KR100846018B1 (en) 2008-07-11
JP2004514938A (en) 2004-05-20

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