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AU2001268358A1 - Self retained pressure connection - Google Patents

Self retained pressure connection

Info

Publication number
AU2001268358A1
AU2001268358A1 AU2001268358A AU6835801A AU2001268358A1 AU 2001268358 A1 AU2001268358 A1 AU 2001268358A1 AU 2001268358 A AU2001268358 A AU 2001268358A AU 6835801 A AU6835801 A AU 6835801A AU 2001268358 A1 AU2001268358 A1 AU 2001268358A1
Authority
AU
Australia
Prior art keywords
pressure connection
retained pressure
self retained
self
connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001268358A
Inventor
William E Howard
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Teradyne Inc
Original Assignee
Teradyne Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Teradyne Inc filed Critical Teradyne Inc
Publication of AU2001268358A1 publication Critical patent/AU2001268358A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/90—Methods for connecting semiconductor or solid state bodies using means for bonding not being attached to, or not being formed on, the body surface to be connected, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
    • H01R12/585—Terminals having a press fit or a compliant portion and a shank passing through a hole in the printed circuit board
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/113—Manufacturing methods by local deposition of the material of the bump connector
    • H01L2224/1133—Manufacturing methods by local deposition of the material of the bump connector in solid form
    • H01L2224/1134—Stud bumping, i.e. using a wire-bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/13099—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00013—Fully indexed content
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H05K3/308—Adaptations of leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
AU2001268358A 2000-06-29 2001-06-12 Self retained pressure connection Abandoned AU2001268358A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/607,577 2000-06-29
US09/607,577 US6352436B1 (en) 2000-06-29 2000-06-29 Self retained pressure connection
PCT/US2001/018915 WO2002003462A2 (en) 2000-06-29 2001-06-12 Self retained pressure connection

Publications (1)

Publication Number Publication Date
AU2001268358A1 true AU2001268358A1 (en) 2002-01-14

Family

ID=24432879

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001268358A Abandoned AU2001268358A1 (en) 2000-06-29 2001-06-12 Self retained pressure connection

Country Status (4)

Country Link
US (1) US6352436B1 (en)
AU (1) AU2001268358A1 (en)
TW (1) TW492216B (en)
WO (1) WO2002003462A2 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1256146A2 (en) * 2000-02-09 2002-11-13 Solid State Stamping Inc Compliant pin and its method of manufacture
US6672881B2 (en) * 2001-10-31 2004-01-06 Fci Americas Technology, Inc. Ball grid array socket
US6623284B1 (en) * 2003-01-07 2003-09-23 Hon Hai Precision Ind. Co., Ltd. Electrical connector
US20040163717A1 (en) * 2003-02-21 2004-08-26 Cookson Electronics, Inc. MEMS device assembly
KR100443999B1 (en) * 2003-02-28 2004-08-21 주식회사 파이컴 Interconnector for Printed Circuit Board, method thereby and interconnector assembly having it
US7628617B2 (en) * 2003-06-11 2009-12-08 Neoconix, Inc. Structure and process for a contact grid array formed in a circuitized substrate
US7244125B2 (en) * 2003-12-08 2007-07-17 Neoconix, Inc. Connector for making electrical contact at semiconductor scales
US7758351B2 (en) * 2003-04-11 2010-07-20 Neoconix, Inc. Method and system for batch manufacturing of spring elements
US20070020960A1 (en) * 2003-04-11 2007-01-25 Williams John D Contact grid array system
US20100167561A1 (en) * 2003-04-11 2010-07-01 Neoconix, Inc. Structure and process for a contact grid array formed in a circuitized substrate
US7114961B2 (en) * 2003-04-11 2006-10-03 Neoconix, Inc. Electrical connector on a flexible carrier
US7597561B2 (en) * 2003-04-11 2009-10-06 Neoconix, Inc. Method and system for batch forming spring elements in three dimensions
US8584353B2 (en) * 2003-04-11 2013-11-19 Neoconix, Inc. Method for fabricating a contact grid array
US7056131B1 (en) * 2003-04-11 2006-06-06 Neoconix, Inc. Contact grid array system
US20050012212A1 (en) * 2003-07-17 2005-01-20 Cookson Electronics, Inc. Reconnectable chip interface and chip package
US6881074B1 (en) * 2003-09-29 2005-04-19 Cookson Electronics, Inc. Electrical circuit assembly with micro-socket
US20050205988A1 (en) * 2004-03-19 2005-09-22 Epic Technology Inc. Die package with higher useable die contact pad area
WO2005091998A2 (en) 2004-03-19 2005-10-06 Neoconix, Inc. Electrical connector in a flexible host
US7347698B2 (en) * 2004-03-19 2008-03-25 Neoconix, Inc. Deep drawn electrical contacts and method for making
US7354276B2 (en) * 2004-07-20 2008-04-08 Neoconix, Inc. Interposer with compliant pins
US20070050738A1 (en) * 2005-08-31 2007-03-01 Dittmann Larry E Customer designed interposer
TWI287284B (en) * 2005-12-02 2007-09-21 Ind Tech Res Inst Interconnect structure of the integrated circuit and manufacturing method thereof
US7357644B2 (en) * 2005-12-12 2008-04-15 Neoconix, Inc. Connector having staggered contact architecture for enhanced working range
CN100452373C (en) * 2005-12-14 2009-01-14 财团法人工业技术研究院 Connecting structure of integrated circuit and its production
WO2007124113A2 (en) * 2006-04-21 2007-11-01 Neoconix, Inc. Clamping a flat flex cable and spring contacts to a circuit board
EP2111673B1 (en) * 2007-02-02 2014-11-19 Delphi International Operations Luxembourg S.à r.l. Connection device
US7540744B1 (en) * 2008-01-08 2009-06-02 Fci Americas Technology, Inc. Shared hole orthogonal footprint with backdrilled vias
US7816932B2 (en) * 2008-02-21 2010-10-19 Teradyne, Inc. Test system with high frequency interposer
FR2928033B1 (en) * 2008-02-22 2010-07-30 Commissariat Energie Atomique CONNECTING COMPONENT HAVING HOLLOW INSERTS.
US8641428B2 (en) 2011-12-02 2014-02-04 Neoconix, Inc. Electrical connector and method of making it
US8900008B2 (en) 2012-05-25 2014-12-02 International Business Machines Corporation Universal press-fit connection for printed circuit boards
US9680273B2 (en) 2013-03-15 2017-06-13 Neoconix, Inc Electrical connector with electrical contacts protected by a layer of compressible material and method of making it
US9070987B2 (en) * 2013-10-30 2015-06-30 Samtec, Inc. Connector with secure wafer retention
EP3747043A4 (en) * 2018-02-01 2022-02-23 Hrl Laboratories, Llc Integrated circuit with metallic interlocking structure

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3820061A (en) * 1972-09-05 1974-06-25 Hewlett Packard Co Connector for printed circuit boards
US4030792A (en) * 1976-03-01 1977-06-21 Fabri-Tek Incorporated Tuning fork connector
US4555151A (en) * 1984-08-06 1985-11-26 Gte Communication Systems Corporation Contact terminal device for connecting hybrid circuit modules to a printed circuit board
WO1988001795A1 (en) * 1986-09-01 1988-03-10 Amp Incorporated Electrical terminal
US5073118A (en) * 1988-12-08 1991-12-17 Amp Incorporated Surface mounting an electronic component
US5152695A (en) 1991-10-10 1992-10-06 Amp Incorporated Surface mount electrical connector
US5228861A (en) 1992-06-12 1993-07-20 Amp Incorporated High density electrical connector system
US5374204A (en) * 1993-11-30 1994-12-20 The Whitake Corporation Electrical terminal with compliant pin section
US5541449A (en) * 1994-03-11 1996-07-30 The Panda Project Semiconductor chip carrier affording a high-density external interface
US5704793A (en) 1995-04-17 1998-01-06 Teradyne, Inc. High speed high density connector for electronic signals
JP3653131B2 (en) * 1995-12-28 2005-05-25 日本発条株式会社 Conductive contact
US6010342A (en) * 1996-11-19 2000-01-04 Watson; Troy M. Sleeveless high-density compression connector

Also Published As

Publication number Publication date
US6352436B1 (en) 2002-03-05
TW492216B (en) 2002-06-21
WO2002003462A2 (en) 2002-01-10
WO2002003462A3 (en) 2002-10-03

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