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AU2000248274A1 - Conical sputtering target - Google Patents

Conical sputtering target

Info

Publication number
AU2000248274A1
AU2000248274A1 AU2000248274A AU4827400A AU2000248274A1 AU 2000248274 A1 AU2000248274 A1 AU 2000248274A1 AU 2000248274 A AU2000248274 A AU 2000248274A AU 4827400 A AU4827400 A AU 4827400A AU 2000248274 A1 AU2000248274 A1 AU 2000248274A1
Authority
AU
Australia
Prior art keywords
sputtering target
conical sputtering
conical
target
sputtering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2000248274A
Inventor
David A. Glocker
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of AU2000248274A1 publication Critical patent/AU2000248274A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3414—Targets
    • H01J37/3423—Shape
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
AU2000248274A 2000-01-19 2000-05-08 Conical sputtering target Abandoned AU2000248274A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/487,041 US6235170B1 (en) 1998-06-10 2000-01-19 Conical sputtering target
US09487041 2000-01-19
PCT/US2000/012490 WO2001053562A1 (en) 2000-01-19 2000-05-08 Conical sputtering target

Publications (1)

Publication Number Publication Date
AU2000248274A1 true AU2000248274A1 (en) 2001-07-31

Family

ID=23934162

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2000248274A Abandoned AU2000248274A1 (en) 2000-01-19 2000-05-08 Conical sputtering target

Country Status (4)

Country Link
US (1) US6235170B1 (en)
EP (1) EP1252357A1 (en)
AU (1) AU2000248274A1 (en)
WO (1) WO2001053562A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6432286B1 (en) * 1998-06-10 2002-08-13 David A. Glocker Conical sputtering target
US6709557B1 (en) 2002-02-28 2004-03-23 Novellus Systems, Inc. Sputter apparatus for producing multi-component metal alloy films and method for making the same
JP4541014B2 (en) 2004-01-13 2010-09-08 キヤノンアネルバ株式会社 Plasma assisted sputter deposition system
WO2006091943A2 (en) * 2005-02-28 2006-08-31 Nanoset, Llc Cylindrical sputtering apparatus
US10471467B2 (en) 2014-07-18 2019-11-12 North Inc. Lighting arrangement

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4031424A (en) 1971-09-07 1977-06-21 Telic Corporation Electrode type glow discharge apparatus
US3995187A (en) 1971-09-07 1976-11-30 Telic Corporation Electrode type glow discharge apparatus
US4041353A (en) 1971-09-07 1977-08-09 Telic Corporation Glow discharge method and apparatus
US4030996A (en) 1971-09-07 1977-06-21 Telic Corporation Electrode type glow discharge method and apparatus
US3884793A (en) 1971-09-07 1975-05-20 Telic Corp Electrode type glow discharge apparatus
US3919678A (en) 1974-04-01 1975-11-11 Telic Corp Magnetic field generation apparatus
US4132612A (en) 1974-12-23 1979-01-02 Telic Corporation Glow discharge method and apparatus
DE3480245D1 (en) * 1983-12-05 1989-11-23 Leybold Ag Magnetron-cathodes for the sputtering of ferromagnetic targets
US4486287A (en) 1984-02-06 1984-12-04 Fournier Paul R Cross-field diode sputtering target assembly
CH659484A5 (en) * 1984-04-19 1987-01-30 Balzers Hochvakuum ARRANGEMENT FOR COATING SUBSTRATES BY CATHODE SPRAYING.
US4606806A (en) 1984-05-17 1986-08-19 Varian Associates, Inc. Magnetron sputter device having planar and curved targets
US4595482A (en) * 1984-05-17 1986-06-17 Varian Associates, Inc. Apparatus for and the method of controlling magnetron sputter device having separate confining magnetic fields to separate targets subject to separate discharges
JPS61183467A (en) * 1985-02-08 1986-08-16 Hitachi Ltd Sputtering electrode
US4810347A (en) * 1988-03-21 1989-03-07 Eaton Corporation Penning type cathode for sputter coating
DE3920835C2 (en) * 1989-06-24 1997-12-18 Leybold Ag Device for coating substrates
US5525199A (en) 1991-11-13 1996-06-11 Optical Corporation Of America Low pressure reactive magnetron sputtering apparatus and method
US5415757A (en) * 1991-11-26 1995-05-16 Leybold Aktiengesellschaft Apparatus for coating a substrate with electrically nonconductive coatings
US5597459A (en) 1995-02-08 1997-01-28 Nobler Technologies, Inc. Magnetron cathode sputtering method and apparatus
US6066242A (en) * 1998-06-10 2000-05-23 David A. Glocker Conical sputtering target

Also Published As

Publication number Publication date
US6235170B1 (en) 2001-05-22
WO2001053562A1 (en) 2001-07-26
EP1252357A1 (en) 2002-10-30

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