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ATE381798T1 - ARRANGEMENT WITH POWER SEMICONDUCTOR MODULE AND WITH CONNECTOR - Google Patents

ARRANGEMENT WITH POWER SEMICONDUCTOR MODULE AND WITH CONNECTOR

Info

Publication number
ATE381798T1
ATE381798T1 AT06017500T AT06017500T ATE381798T1 AT E381798 T1 ATE381798 T1 AT E381798T1 AT 06017500 T AT06017500 T AT 06017500T AT 06017500 T AT06017500 T AT 06017500T AT E381798 T1 ATE381798 T1 AT E381798T1
Authority
AT
Austria
Prior art keywords
power semiconductor
semiconductor module
arrangement
connector
housing
Prior art date
Application number
AT06017500T
Other languages
German (de)
Inventor
Frank Ebersberger
Juergen Steger
Original Assignee
Semikron Elektronik Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semikron Elektronik Gmbh filed Critical Semikron Elektronik Gmbh
Application granted granted Critical
Publication of ATE381798T1 publication Critical patent/ATE381798T1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R31/00—Coupling parts supported only by co-operation with counterpart
    • H01R31/06—Intermediate parts for linking two coupling parts, e.g. adapter
    • H01R31/065—Intermediate parts for linking two coupling parts, e.g. adapter with built-in electric apparatus

Landscapes

  • Coupling Device And Connection With Printed Circuit (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Connector Housings Or Holding Contact Members (AREA)

Abstract

The arrangement includes a power semiconductor module that has a housing (3), and connectors (6) for load connection and auxiliary connections. Spring contact components are arranged projecting from the housing. The housing is also provided with first connecting units for coupling with the connectors, and second connecting units (62,64) and metal molded portion (7) with contact areas for coming in contact with the spring contact components. The metal molded portion also has contact sections (70) for external connection of the power semiconductor module.
AT06017500T 2005-08-24 2006-08-23 ARRANGEMENT WITH POWER SEMICONDUCTOR MODULE AND WITH CONNECTOR ATE381798T1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102005039946A DE102005039946A1 (en) 2005-08-24 2005-08-24 Arrangement with power semiconductor module and with connection connector

Publications (1)

Publication Number Publication Date
ATE381798T1 true ATE381798T1 (en) 2008-01-15

Family

ID=37517179

Family Applications (1)

Application Number Title Priority Date Filing Date
AT06017500T ATE381798T1 (en) 2005-08-24 2006-08-23 ARRANGEMENT WITH POWER SEMICONDUCTOR MODULE AND WITH CONNECTOR

Country Status (7)

Country Link
EP (1) EP1758214B1 (en)
JP (1) JP4834486B2 (en)
CN (1) CN1921110B (en)
AT (1) ATE381798T1 (en)
DE (2) DE102005039946A1 (en)
DK (1) DK1758214T3 (en)
ES (1) ES2299127T3 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006058694B4 (en) * 2006-12-13 2011-06-16 Semikron Elektronik Gmbh & Co. Kg Power semiconductor module with contact springs
DE102008012570B4 (en) * 2008-03-04 2014-02-13 Infineon Technologies Ag Power semiconductor module system, power semiconductor module assembly, and method of making a power semiconductor module assembly
DE102008034467B4 (en) * 2008-07-24 2014-04-03 Semikron Elektronik Gmbh & Co. Kg Arrangement with a power semiconductor module and with a connection device
DE102013113143B4 (en) * 2013-11-28 2016-04-21 Semikron Elektronik Gmbh & Co. Kg Power semiconductor device

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5417752B2 (en) * 1971-10-05 1979-07-02
DE3345285A1 (en) * 1983-12-14 1985-06-27 Siemens AG, 1000 Berlin und 8000 München PERFORMANCE SEMICONDUCTOR ARRANGEMENT
JPH02150771A (en) * 1988-12-01 1990-06-11 Nec Corp Speed measuring instrument
JP3201187B2 (en) * 1994-12-08 2001-08-20 富士電機株式会社 Semiconductor device
JPH08255643A (en) * 1995-01-18 1996-10-01 Furukawa Electric Co Ltd:The Connector for printed board
TW328403U (en) * 1997-05-09 1998-03-11 Formosa Electronicindustries Inc Ac/dc power supplier having a replaceable plug
CN2315700Y (en) * 1997-06-04 1999-04-21 吴祖榆 AC/DC two purpose power supply device capable of changing power plug
US6669495B2 (en) * 2000-11-06 2003-12-30 Research In Motion Limited Universal adapter with interchangeable plugs
DE10100460B4 (en) 2001-01-08 2006-06-01 Semikron Elektronik Gmbh & Co. Kg Power semiconductor module with housing and connecting elements
JP3644406B2 (en) * 2001-05-08 2005-04-27 株式会社デンソー Pointer instrument and its rotating inner unit
EP1291914A1 (en) * 2001-09-10 2003-03-12 ABB Schweiz AG Pressure-contactable power semiconductor module
DE102004025609B4 (en) * 2004-05-25 2010-12-09 Semikron Elektronik Gmbh & Co. Kg Arrangement in screw-type pressure contact with a power semiconductor module

Also Published As

Publication number Publication date
EP1758214B1 (en) 2007-12-19
ES2299127T3 (en) 2008-05-16
DK1758214T3 (en) 2008-04-07
JP4834486B2 (en) 2011-12-14
DE102005039946A1 (en) 2007-03-01
CN1921110B (en) 2010-12-01
DE502006000232D1 (en) 2008-01-31
CN1921110A (en) 2007-02-28
EP1758214A1 (en) 2007-02-28
JP2007059393A (en) 2007-03-08

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