ATE147672T1 - Steuerungssystem - Google Patents
SteuerungssystemInfo
- Publication number
- ATE147672T1 ATE147672T1 AT92309080T AT92309080T ATE147672T1 AT E147672 T1 ATE147672 T1 AT E147672T1 AT 92309080 T AT92309080 T AT 92309080T AT 92309080 T AT92309080 T AT 92309080T AT E147672 T1 ATE147672 T1 AT E147672T1
- Authority
- AT
- Austria
- Prior art keywords
- wire
- bonding
- deformation
- electrical
- electronic component
- Prior art date
Links
- 238000000034 method Methods 0.000 abstract 2
- 238000012544 monitoring process Methods 0.000 abstract 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
- B23K31/12—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to investigating the properties, e.g. the weldability, of materials
- B23K31/125—Weld quality monitoring
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
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- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
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- H01L2224/852—Applying energy for connecting
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- H01L2224/85205—Ultrasonic bonding
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- H01L24/42—Wire connectors; Manufacturing methods related thereto
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- H01L2924/2076—Diameter ranges equal to or larger than 100 microns
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Quality & Reliability (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Wire Bonding (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Iron Core Of Rotating Electric Machines (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB919123047A GB9123047D0 (en) | 1991-10-30 | 1991-10-30 | Control system |
GB9219029A GB2270868B (en) | 1992-09-08 | 1992-09-08 | Control system |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE147672T1 true ATE147672T1 (de) | 1997-02-15 |
Family
ID=26299771
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT92309080T ATE147672T1 (de) | 1991-10-30 | 1992-10-05 | Steuerungssystem |
Country Status (6)
Country | Link |
---|---|
US (1) | US5314105A (de) |
EP (1) | EP0540189B1 (de) |
JP (1) | JP3276421B2 (de) |
KR (1) | KR930009007A (de) |
AT (1) | ATE147672T1 (de) |
DE (1) | DE69216761T2 (de) |
Families Citing this family (40)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5595330A (en) * | 1994-08-24 | 1997-01-21 | Verity Instruments, Inc. | Power supply |
JP3207685B2 (ja) * | 1994-09-27 | 2001-09-10 | 東芝マイクロエレクトロニクス株式会社 | 半導体装置の組み立て方法とその装置 |
DE19512820B4 (de) * | 1995-04-05 | 2005-11-03 | Branson Ultraschall Niederlassung Der Emerson Technologies Gmbh & Co | Verfahren und Vorrichtung zum Einstellen der Arbeitsfrequenz eines Orbitalvibrationsschweißsystems |
US5824998A (en) * | 1995-12-20 | 1998-10-20 | Pulsar Welding Ltd. | Joining or welding of metal objects by a pulsed magnetic force |
JPH1027996A (ja) * | 1996-07-10 | 1998-01-27 | Matsushita Electric Ind Co Ltd | 電子部品装着装置 |
US5894981A (en) * | 1996-11-27 | 1999-04-20 | Orthodyne Electronics Corporation | Integrated pull tester with an ultrasonic wire bonder |
EP0857535B1 (de) * | 1997-02-06 | 2003-06-25 | F & K Delvotec Bondtechnik GmbH | Verbindungskopf für eine Drahtverbindungsvorrichtung |
EP0864392B1 (de) * | 1997-03-13 | 2001-08-16 | F & K Delvotec Bondtechnik GmbH | Bondkopf |
EP1023139B1 (de) * | 1997-10-13 | 2004-01-14 | Hesse & Knipps GmbH | Verfahren zur qualitätskontrolle |
JPH11330134A (ja) * | 1998-05-12 | 1999-11-30 | Hitachi Ltd | ワイヤボンディング方法およびその装置並びに半導体装置 |
US6237833B1 (en) * | 1998-06-15 | 2001-05-29 | Rohm Co., Ltd. | Method of checking wirebond condition |
US6190497B1 (en) | 1999-04-23 | 2001-02-20 | The Hong Kong Polytechnic University | Ultrasonic transducer |
US6206275B1 (en) | 1999-10-13 | 2001-03-27 | F & K Delvotec Bondtechnik Gmbh | Deep access, close proximity, fine pitch bonding of large wire |
WO2004073914A1 (en) * | 1999-11-10 | 2004-09-02 | Asm Technology Singapore Pte Ltd. | Force sensing apparatus |
US6286747B1 (en) | 2000-03-24 | 2001-09-11 | Hong Kong Polytechnic University | Ultrasonic transducer |
DE10110048A1 (de) * | 2001-03-02 | 2002-09-05 | Bosch Gmbh Robert | Verfahren zum Prüfen von durch Ultraschall-Drahtbonden hergestellten Verbindungen |
JP4202617B2 (ja) | 2001-03-16 | 2008-12-24 | 矢崎総業株式会社 | 被覆電線の超音波接合方法およびその方法を用いた超音波接合装置 |
US6644533B2 (en) | 2001-07-03 | 2003-11-11 | Asm Technology Singapore Pte. Ltd. | Force sensing apparatus |
EP1310319B1 (de) * | 2001-11-07 | 2006-09-06 | F & K Delvotec Bondtechnik GmbH | Prüfverfahren für Bondverbindungen und Drahtbonder |
KR20030066344A (ko) | 2002-02-01 | 2003-08-09 | 에섹 트레이딩 에스에이 | 와이어본더로 접합시에 최적의 접합 파라미터들을결정하기 위한 방법 |
EP1343201A1 (de) | 2002-03-08 | 2003-09-10 | F & K Delvotec Bondtechnik GmbH | "Verfahren und Anordnung zur Herstellung und Qualitätsprüfung einer Drahtbondverbindung" |
DE102004022509A1 (de) * | 2004-01-07 | 2005-08-25 | Stapla Ultraschall-Technik Gmbh | Verfahren zum Abquetschen und Abdichten eines Rohres |
EP1625911B1 (de) * | 2004-08-11 | 2007-10-10 | F&K Delvotec Bondtechnik GmbH | Drahtbonder mit einer Kamera, einer Bildverarbeitungseinrichtung, Speichermittel und Vergleichermittel und Verfahren zum Betrieb eines solchen |
US20060163315A1 (en) * | 2005-01-27 | 2006-07-27 | Delsman Mark A | Ribbon bonding tool and process |
DE102005012992B4 (de) * | 2005-03-21 | 2014-01-02 | Infineon Technologies Ag | Verfahren, Bondeinrichtung und System zum Bonden eines Halbleiterelementes |
DE602006012975D1 (de) * | 2005-06-13 | 2010-04-29 | Panasonic Corp | Vorrichtung zum binden eines halbleiterbauelements und verfahren zum binden eines halbleiterbauelements damit |
US7845542B2 (en) * | 2005-09-22 | 2010-12-07 | Palomar Technologies, Inc. | Monitoring deformation and time to logically constrain a bonding process |
DE102006020417B4 (de) * | 2006-04-26 | 2008-10-02 | Herrmann Ultraschalltechnik Gmbh & Co. Kg | Vorrichtung zum Bearbeiten von Werkstücken mittels Ultraschall |
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CN102509708B (zh) * | 2007-05-16 | 2014-09-24 | 库利克和索夫工业公司 | 金属线接合方法和接合力校准 |
DE102007054626A1 (de) | 2007-11-12 | 2009-05-14 | Hesse & Knipps Gmbh | Verfahren und Vorrichtung zum Ultraschallbonden |
US8875580B2 (en) * | 2011-12-13 | 2014-11-04 | The United States Of America As Represented By The Adminstrator Of The National Aeronautics And Space Adminstration | Method and apparatus to detect wire pathologies near crimped connector |
JP5899907B2 (ja) * | 2011-12-26 | 2016-04-06 | 富士電機株式会社 | ワイヤボンディング用のウェッジツール、ボンディング装置、ワイヤボンディング方法、および半導体装置の製造方法 |
CN103367186B (zh) * | 2012-03-28 | 2015-12-02 | 西安永电电气有限责任公司 | Igbt芯片键合方法 |
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US5192015A (en) * | 1991-11-20 | 1993-03-09 | Santa Barbara Research Center | Method for wire bonding |
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-
1992
- 1992-10-05 DE DE69216761T patent/DE69216761T2/de not_active Expired - Lifetime
- 1992-10-05 EP EP92309080A patent/EP0540189B1/de not_active Expired - Lifetime
- 1992-10-05 AT AT92309080T patent/ATE147672T1/de not_active IP Right Cessation
- 1992-10-27 US US07/967,410 patent/US5314105A/en not_active Expired - Lifetime
- 1992-10-28 JP JP28921092A patent/JP3276421B2/ja not_active Expired - Lifetime
- 1992-10-29 KR KR1019920020040A patent/KR930009007A/ko not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
EP0540189A2 (de) | 1993-05-05 |
DE69216761T2 (de) | 1997-07-03 |
US5314105A (en) | 1994-05-24 |
KR930009007A (ko) | 1993-05-22 |
JPH05218147A (ja) | 1993-08-27 |
EP0540189A3 (en) | 1993-08-18 |
DE69216761D1 (de) | 1997-02-27 |
EP0540189B1 (de) | 1997-01-15 |
JP3276421B2 (ja) | 2002-04-22 |
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REN | Ceased due to non-payment of the annual fee |