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ATE147672T1 - Steuerungssystem - Google Patents

Steuerungssystem

Info

Publication number
ATE147672T1
ATE147672T1 AT92309080T AT92309080T ATE147672T1 AT E147672 T1 ATE147672 T1 AT E147672T1 AT 92309080 T AT92309080 T AT 92309080T AT 92309080 T AT92309080 T AT 92309080T AT E147672 T1 ATE147672 T1 AT E147672T1
Authority
AT
Austria
Prior art keywords
wire
bonding
deformation
electrical
electronic component
Prior art date
Application number
AT92309080T
Other languages
English (en)
Inventor
Farhad Farassat
Original Assignee
F&K Delvotec Bondtechnik Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=26299771&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ATE147672(T1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority claimed from GB919123047A external-priority patent/GB9123047D0/en
Priority claimed from GB9219029A external-priority patent/GB2270868B/en
Application filed by F&K Delvotec Bondtechnik Gmbh filed Critical F&K Delvotec Bondtechnik Gmbh
Application granted granted Critical
Publication of ATE147672T1 publication Critical patent/ATE147672T1/de

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K31/00Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
    • B23K31/12Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to investigating the properties, e.g. the weldability, of materials
    • B23K31/125Weld quality monitoring
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
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    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
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Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Quality & Reliability (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Iron Core Of Rotating Electric Machines (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
AT92309080T 1991-10-30 1992-10-05 Steuerungssystem ATE147672T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB919123047A GB9123047D0 (en) 1991-10-30 1991-10-30 Control system
GB9219029A GB2270868B (en) 1992-09-08 1992-09-08 Control system

Publications (1)

Publication Number Publication Date
ATE147672T1 true ATE147672T1 (de) 1997-02-15

Family

ID=26299771

Family Applications (1)

Application Number Title Priority Date Filing Date
AT92309080T ATE147672T1 (de) 1991-10-30 1992-10-05 Steuerungssystem

Country Status (6)

Country Link
US (1) US5314105A (de)
EP (1) EP0540189B1 (de)
JP (1) JP3276421B2 (de)
KR (1) KR930009007A (de)
AT (1) ATE147672T1 (de)
DE (1) DE69216761T2 (de)

Families Citing this family (40)

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US5595330A (en) * 1994-08-24 1997-01-21 Verity Instruments, Inc. Power supply
JP3207685B2 (ja) * 1994-09-27 2001-09-10 東芝マイクロエレクトロニクス株式会社 半導体装置の組み立て方法とその装置
DE19512820B4 (de) * 1995-04-05 2005-11-03 Branson Ultraschall Niederlassung Der Emerson Technologies Gmbh & Co Verfahren und Vorrichtung zum Einstellen der Arbeitsfrequenz eines Orbitalvibrationsschweißsystems
US5824998A (en) * 1995-12-20 1998-10-20 Pulsar Welding Ltd. Joining or welding of metal objects by a pulsed magnetic force
JPH1027996A (ja) * 1996-07-10 1998-01-27 Matsushita Electric Ind Co Ltd 電子部品装着装置
US5894981A (en) * 1996-11-27 1999-04-20 Orthodyne Electronics Corporation Integrated pull tester with an ultrasonic wire bonder
EP0857535B1 (de) * 1997-02-06 2003-06-25 F & K Delvotec Bondtechnik GmbH Verbindungskopf für eine Drahtverbindungsvorrichtung
EP0864392B1 (de) * 1997-03-13 2001-08-16 F & K Delvotec Bondtechnik GmbH Bondkopf
EP1023139B1 (de) * 1997-10-13 2004-01-14 Hesse & Knipps GmbH Verfahren zur qualitätskontrolle
JPH11330134A (ja) * 1998-05-12 1999-11-30 Hitachi Ltd ワイヤボンディング方法およびその装置並びに半導体装置
US6237833B1 (en) * 1998-06-15 2001-05-29 Rohm Co., Ltd. Method of checking wirebond condition
US6190497B1 (en) 1999-04-23 2001-02-20 The Hong Kong Polytechnic University Ultrasonic transducer
US6206275B1 (en) 1999-10-13 2001-03-27 F & K Delvotec Bondtechnik Gmbh Deep access, close proximity, fine pitch bonding of large wire
WO2004073914A1 (en) * 1999-11-10 2004-09-02 Asm Technology Singapore Pte Ltd. Force sensing apparatus
US6286747B1 (en) 2000-03-24 2001-09-11 Hong Kong Polytechnic University Ultrasonic transducer
DE10110048A1 (de) * 2001-03-02 2002-09-05 Bosch Gmbh Robert Verfahren zum Prüfen von durch Ultraschall-Drahtbonden hergestellten Verbindungen
JP4202617B2 (ja) 2001-03-16 2008-12-24 矢崎総業株式会社 被覆電線の超音波接合方法およびその方法を用いた超音波接合装置
US6644533B2 (en) 2001-07-03 2003-11-11 Asm Technology Singapore Pte. Ltd. Force sensing apparatus
EP1310319B1 (de) * 2001-11-07 2006-09-06 F & K Delvotec Bondtechnik GmbH Prüfverfahren für Bondverbindungen und Drahtbonder
KR20030066344A (ko) 2002-02-01 2003-08-09 에섹 트레이딩 에스에이 와이어본더로 접합시에 최적의 접합 파라미터들을결정하기 위한 방법
EP1343201A1 (de) 2002-03-08 2003-09-10 F & K Delvotec Bondtechnik GmbH "Verfahren und Anordnung zur Herstellung und Qualitätsprüfung einer Drahtbondverbindung"
DE102004022509A1 (de) * 2004-01-07 2005-08-25 Stapla Ultraschall-Technik Gmbh Verfahren zum Abquetschen und Abdichten eines Rohres
EP1625911B1 (de) * 2004-08-11 2007-10-10 F&K Delvotec Bondtechnik GmbH Drahtbonder mit einer Kamera, einer Bildverarbeitungseinrichtung, Speichermittel und Vergleichermittel und Verfahren zum Betrieb eines solchen
US20060163315A1 (en) * 2005-01-27 2006-07-27 Delsman Mark A Ribbon bonding tool and process
DE102005012992B4 (de) * 2005-03-21 2014-01-02 Infineon Technologies Ag Verfahren, Bondeinrichtung und System zum Bonden eines Halbleiterelementes
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EP0540189A2 (de) 1993-05-05
DE69216761T2 (de) 1997-07-03
US5314105A (en) 1994-05-24
KR930009007A (ko) 1993-05-22
JPH05218147A (ja) 1993-08-27
EP0540189A3 (en) 1993-08-18
DE69216761D1 (de) 1997-02-27
EP0540189B1 (de) 1997-01-15
JP3276421B2 (ja) 2002-04-22

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