NL7700420A - Halfgeleiderinrichting en werkwijze ter ver- vaardiging daarvan. - Google Patents
Halfgeleiderinrichting en werkwijze ter ver- vaardiging daarvan.Info
- Publication number
- NL7700420A NL7700420A NL7700420A NL7700420A NL7700420A NL 7700420 A NL7700420 A NL 7700420A NL 7700420 A NL7700420 A NL 7700420A NL 7700420 A NL7700420 A NL 7700420A NL 7700420 A NL7700420 A NL 7700420A
- Authority
- NL
- Netherlands
- Prior art keywords
- semi
- manufacturing
- conductor device
- conductor
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/0203—Particular design considerations for integrated circuits
- H01L27/0214—Particular design considerations for integrated circuits for internal polarisation, e.g. I2L
- H01L27/0229—Particular design considerations for integrated circuits for internal polarisation, e.g. I2L of bipolar structures
- H01L27/0233—Integrated injection logic structures [I2L]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/033—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/5221—Crossover interconnections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
- H01L23/53204—Conductive materials
- H01L23/53271—Conductive materials containing semiconductor material, e.g. polysilicon
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K19/00—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits
- H03K19/02—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components
- H03K19/08—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components using semiconductor devices
- H03K19/082—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components using semiconductor devices using bipolar transistors
- H03K19/091—Integrated injection logic or merged transistor logic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Computing Systems (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Bipolar Transistors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Bipolar Integrated Circuits (AREA)
- Semiconductor Integrated Circuits (AREA)
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL7700420A NL7700420A (nl) | 1977-01-17 | 1977-01-17 | Halfgeleiderinrichting en werkwijze ter ver- vaardiging daarvan. |
US05/847,723 US4183037A (en) | 1977-01-17 | 1977-11-02 | Semiconductor device |
DE2800363A DE2800363C2 (de) | 1977-01-17 | 1978-01-05 | Halbleiteranordnung und Verfahren zu deren Herstellung |
CA294,799A CA1094692A (en) | 1977-01-17 | 1978-01-12 | Semiconductor device with layer of refractory material |
JP324278A JPS5390779A (en) | 1977-01-17 | 1978-01-14 | Semiconductor and method of producing same |
FR7801216A FR2377705A1 (fr) | 1977-01-17 | 1978-01-17 | Dispositif semi-conducteur, et procede pour sa fabrication |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL7700420A NL7700420A (nl) | 1977-01-17 | 1977-01-17 | Halfgeleiderinrichting en werkwijze ter ver- vaardiging daarvan. |
Publications (1)
Publication Number | Publication Date |
---|---|
NL7700420A true NL7700420A (nl) | 1978-07-19 |
Family
ID=19827780
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NL7700420A NL7700420A (nl) | 1977-01-17 | 1977-01-17 | Halfgeleiderinrichting en werkwijze ter ver- vaardiging daarvan. |
Country Status (6)
Country | Link |
---|---|
US (1) | US4183037A (nl) |
JP (1) | JPS5390779A (nl) |
CA (1) | CA1094692A (nl) |
DE (1) | DE2800363C2 (nl) |
FR (1) | FR2377705A1 (nl) |
NL (1) | NL7700420A (nl) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2816949C3 (de) * | 1978-04-19 | 1981-07-16 | Ibm Deutschland Gmbh, 7000 Stuttgart | Monolithisch integrierte Halbleiteranordnung und deren Verwendung zum Aufbau einer Speicheranordnung |
JPS55138868A (en) * | 1979-04-17 | 1980-10-30 | Toshiba Corp | Bipolar integrated circuit and method of fabricating the same |
US4244001A (en) * | 1979-09-28 | 1981-01-06 | Rca Corporation | Fabrication of an integrated injection logic device with narrow basewidth |
JPS56115560A (en) * | 1980-02-18 | 1981-09-10 | Toshiba Corp | Manufacture of semiconductor device |
JPS5852870A (ja) * | 1981-09-25 | 1983-03-29 | Hitachi Ltd | 半導体集積回路装置 |
JPS58127363A (ja) * | 1982-01-25 | 1983-07-29 | Hitachi Ltd | 半導体集積回路装置 |
JPS594050A (ja) * | 1982-06-30 | 1984-01-10 | Fujitsu Ltd | 半導体装置 |
DE102004015654A1 (de) * | 2003-04-02 | 2004-10-21 | Luk Lamellen Und Kupplungsbau Beteiligungs Kg | Endstufe zum Ansteuern einer elektrischen Maschine |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL6606912A (nl) * | 1966-05-19 | 1967-11-20 | ||
NL7107040A (nl) * | 1971-05-22 | 1972-11-24 | ||
GB1447675A (en) * | 1973-11-23 | 1976-08-25 | Mullard Ltd | Semiconductor devices |
IT1061530B (it) * | 1975-06-12 | 1983-04-30 | Ncr Co | Metodo per la formazione di connessioni elettriche in regioni selezionate di una superficie di un dispositivo semiconduttore a circuito integrato |
US4109275A (en) * | 1976-12-22 | 1978-08-22 | International Business Machines Corporation | Interconnection of integrated circuit metallization |
-
1977
- 1977-01-17 NL NL7700420A patent/NL7700420A/nl not_active Application Discontinuation
- 1977-11-02 US US05/847,723 patent/US4183037A/en not_active Expired - Lifetime
-
1978
- 1978-01-05 DE DE2800363A patent/DE2800363C2/de not_active Expired
- 1978-01-12 CA CA294,799A patent/CA1094692A/en not_active Expired
- 1978-01-14 JP JP324278A patent/JPS5390779A/ja active Pending
- 1978-01-17 FR FR7801216A patent/FR2377705A1/fr active Granted
Also Published As
Publication number | Publication date |
---|---|
FR2377705B1 (nl) | 1983-04-29 |
DE2800363A1 (de) | 1978-07-20 |
JPS5390779A (en) | 1978-08-09 |
US4183037A (en) | 1980-01-08 |
FR2377705A1 (fr) | 1978-08-11 |
CA1094692A (en) | 1981-01-27 |
DE2800363C2 (de) | 1985-02-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
BC | A request for examination has been filed | ||
A85 | Still pending on 85-01-01 | ||
BI | The patent application has been withdrawn |