NL7609034A - Halfgeleider en werkwijze voor de vervaardiging daarvan. - Google Patents

Halfgeleider en werkwijze voor de vervaardiging daarvan.

Info

Publication number: NL7609034A
Authority: NL; Netherlands
Prior art keywords: semiconductor; manufacture
Prior art date: 1975-08-14

Application number

NL7609034A

Other languages

English (en)

Original Assignee

Gen Instrument Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1975-08-14

Filing date

1976-08-13

Publication date

1977-02-16

Family has litigation

First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=24420755&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=NL7609034(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.

1976-08-13 Application filed by Gen Instrument Corp filed Critical Gen Instrument Corp

1977-02-16 Publication of NL7609034A publication Critical patent/NL7609034A/nl

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/291—Oxides or nitrides or carbides, e.g. ceramics, glass
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/296—Organo-silicon compounds
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3135—Double encapsulation or coating and encapsulation
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/492—Bases or plates or solder therefor
- H01L23/4924—Bases or plates or solder therefor characterised by the materials
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01014—Silicon [Si]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L2924/01015—Phosphorus [P]
- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01023—Vanadium [V]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0103—Zinc [Zn]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01039—Yttrium [Y]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01042—Molybdenum [Mo]
- H—ELECTRICITY
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01047—Silver [Ag]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01051—Antimony [Sb]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01073—Tantalum [Ta]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01074—Tungsten [W]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01075—Rhenium [Re]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12044—OLED
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13062—Junction field-effect transistor [JFET]

Landscapes

Engineering & Computer Science (AREA)
Computer Hardware Design (AREA)
Microelectronics & Electronic Packaging (AREA)
Power Engineering (AREA)
Physics & Mathematics (AREA)
Condensed Matter Physics & Semiconductors (AREA)
General Physics & Mathematics (AREA)
Chemical & Material Sciences (AREA)
Ceramic Engineering (AREA)
Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

NL7609034A 1975-08-14 1976-08-13 Halfgeleider en werkwijze voor de vervaardiging daarvan. NL7609034A (nl)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
US05/604,722 US3996602A (en)	1975-08-14	1975-08-14	Passivated and encapsulated semiconductors and method of making same

Publications (1)

Publication Number	Publication Date
NL7609034A true NL7609034A (nl)	1977-02-16

Family

ID=24420755

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
NL7609034A NL7609034A (nl)	1975-08-14	1976-08-13	Halfgeleider en werkwijze voor de vervaardiging daarvan.

Country Status (12)

Country	Link
US (1)	US3996602A (nl)
JP (1)	JPS5237772A (nl)
BR (1)	BR7605354A (nl)
CA (1)	CA1057420A (nl)
DE (1)	DE2636580A1 (nl)
ES (1)	ES450690A1 (nl)
FR (1)	FR2321192A1 (nl)
GB (1)	GB1510294A (nl)
IE (1)	IE44200B1 (nl)
IT (1)	IT1062666B (nl)
NL (1)	NL7609034A (nl)
SE (1)	SE7608988L (nl)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4187599A (en) *	1975-04-14	1980-02-12	Motorola, Inc.	Semiconductor device having a tin metallization system and package containing same
US4198444A (en) *	1975-08-04	1980-04-15	General Electric Company	Method for providing substantially hermetic sealing means for electronic components
JPS531469A (en) *	1976-06-26	1978-01-09	Hitachi Ltd	Glass seal type semiconductor device
JPS5819125B2 (ja) *	1976-08-11	1983-04-16	株式会社日立製作所	半導体装置の製造方法
US4161746A (en) *	1978-03-28	1979-07-17	Westinghouse Electric Corp.	Glass sealed diode
GB2031223A (en) *	1978-09-22	1980-04-16	Gen Instrument Corp	Method for bonding a refractory metal contact member to a semiconductor body
US4571093A (en) *	1983-11-04	1986-02-18	Burroughs Corporation	Method of testing plastic-packaged semiconductor devices
US4564885A (en) *	1984-09-10	1986-01-14	General Instrument Corporation	Rectifier with slug construction and mold for fabricating same
USRE32829E (en) *	1984-09-10	1989-01-10	General Instrument Corp.	Rectifier with slug construction and mold for fabricating same
NL8503023A (nl) *	1985-11-05	1987-06-01	Philips Nv	Diode en metalen stud daarvoor.
US4745455A (en) *	1986-05-16	1988-05-17	General Electric Company	Silicon packages for power semiconductor devices
US4888634A (en) *	1987-07-24	1989-12-19	Linear Technology Corporation	High thermal resistance bonding material and semiconductor structures using same
US4987476A (en) *	1988-02-01	1991-01-22	General Instrument Corporation	Brazed glass pre-passivated chip rectifier
US5151118A (en) *	1988-07-08	1992-09-29	Kabushiki Kaisha Goto Seisakusho	Method for producing a package-type semiconductor assembly
US5008735A (en) *	1989-12-07	1991-04-16	General Instrument Corporation	Packaged diode for high temperature operation
US5304429A (en) *	1992-03-24	1994-04-19	General Instrument Corporation	Semiconductor devices having copper terminal leads
US5439849A (en) *	1994-02-02	1995-08-08	At&T Corp.	Encapsulation techniques which include forming a thin glass layer onto a polymer layer
US6099783A (en) *	1995-06-06	2000-08-08	Board Of Trustees Operating Michigan State University	Photopolymerizable compositions for encapsulating microelectronic devices
US5751061A (en) *	1995-12-18	1998-05-12	Motorola, Inc.	Semiconductor diode device with non-planar heatsink and method of manufacture
US6111316A (en) *	1997-08-29	2000-08-29	Motorola, Inc.	Electronic component encapsulated in a glass tube
DE102007041229A1 (de) *	2007-08-31	2009-03-05	Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.	Schaltungsanordnung und ein Verfahren zum Verkapseln derselben
US11584673B2 (en) *	2017-07-31	2023-02-21	Corning Incorporated	Laminate article having a non-glass core and glass envelope and methods thereof

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3505571A (en) *	1965-09-30	1970-04-07	Gen Electric	Glass covered semiconductor device
US3913127A (en) *	1971-10-01	1975-10-14	Hitachi Ltd	Glass encapsulated semiconductor device containing cylindrical stack of semiconductor pellets
US3844029A (en) *	1972-02-02	1974-10-29	Trw Inc	High power double-slug diode package
JPS4970858U (nl) *	1972-10-04	1974-06-20
DE2261302A1 (de) *	1972-12-15	1974-07-04	Licentia Gmbh	Halbleiteranordnung aus einem halbleiterbauelement

1975
- 1975-08-14 US US05/604,722 patent/US3996602A/en not_active Expired - Lifetime
1976
- 1976-08-10 CA CA258,818A patent/CA1057420A/en not_active Expired
- 1976-08-11 SE SE7608988A patent/SE7608988L/xx unknown
- 1976-08-12 IT IT50866/76A patent/IT1062666B/it active
- 1976-08-13 DE DE19762636580 patent/DE2636580A1/de not_active Ceased
- 1976-08-13 IE IE1789/76A patent/IE44200B1/en not_active IP Right Cessation
- 1976-08-13 ES ES450690A patent/ES450690A1/es not_active Expired
- 1976-08-13 GB GB33887/76A patent/GB1510294A/en not_active Expired
- 1976-08-13 FR FR7624745A patent/FR2321192A1/fr active Granted
- 1976-08-13 NL NL7609034A patent/NL7609034A/nl active Search and Examination
- 1976-08-14 JP JP51097396A patent/JPS5237772A/ja active Pending
- 1976-08-16 BR BR7605354A patent/BR7605354A/pt unknown

Also Published As

Publication number	Publication date
JPS5237772A (en)	1977-03-23
AU1678376A (en)	1978-02-16
DE2636580A1 (de)	1977-02-17
IE44200B1 (en)	1981-09-09
US3996602A (en)	1976-12-07
GB1510294A (en)	1978-05-10
IT1062666B (it)	1984-10-20
BR7605354A (pt)	1977-08-16
IE44200L (en)	1977-02-14
CA1057420A (en)	1979-06-26
FR2321192B1 (nl)	1979-03-02
FR2321192A1 (fr)	1977-03-11
SE7608988L (sv)	1977-02-15
ES450690A1 (es)	1977-12-01

Publication	Publication Date	Title
NL7609034A (nl)	1977-02-16	Halfgeleider en werkwijze voor de vervaardiging daarvan.
NL7702849A (nl)	1977-09-20	Hentriakontapeptiden en werkwijze voor de bereiding daarvan.
NL7510868A (nl)	1976-03-18	Membraan en werkwijze voor de vervaardiging daar- van.
NL7610293A (nl)	1977-03-24	Laminaten en werkwijze ter vervaardiging daarvan.
NL7613641A (nl)	1977-06-15	Werkwijze voor waterbehandeling.
NL7701119A (nl)	1977-08-04	Halfgeleiderinrichting en werkwijze voor de ver- vaardiging daarvan.
NL7612771A (nl)	1977-05-24	Biologisch actieve verbindingen en werkwijze voor de bereiding daarvan.
NL7605872A (nl)	1976-12-02	Werkwijze en inrichting voor de vervaardiging van vacuumbeton.
NL161301B (nl)	1979-08-15	Halfgeleiderinrichting en werkwijze voor de vervaar- diging daarvan.
NL7601762A (nl)	1976-08-24	Tetralon- en indanonderivaten en werkwijze voor de bereiding hiervan.
NL7413599A (nl)	1975-04-18	Handschoen en werkwijze voor het vervaardigen daarvan.
NL185044C (nl)	1990-01-02	Halfgeleider-component en werkwijze voor het vervaardigen daarvan.
NL7609856A (nl)	1977-03-14	Ritssluiting en werkwijze en inrichting voor de vervaardiging daarvan.
NL7608410A (nl)	1977-02-03	Kunsthaar en werkwijze voor de vervaardiging daarvan.
NL7512496A (nl)	1976-04-27	Penicillinen en werkwijze voor de bereiding daarvan.
NL7804542A (nl)	1978-10-31	Vaginamembraan alsmede werkwijze voor de vervaardiging daarvan.
NL7609315A (nl)	1977-02-22	Fotogeleidend element en werkwijze voor de ver- vaardiging daarvan.
NL7600062A (nl)	1976-07-13	Komplementaire transistorstruktuur en werkwijze ter vervaardiging daarvan.
NL7609600A (nl)	1977-03-31	Zalffoelie, werkwijze voor het vervaardigen daarvan en werkwijze voor het toepassen daar- van.
NL7501210A (nl)	1975-08-05	Laminaat en werkwijze voor de vervaardiging rkwijze voor de toepassing daarvan.
NL7607540A (nl)	1977-01-25	Monolithisch geintegreerde schakeling en werkwijze voor de vervaardiging daarvan.
NL7602862A (nl)	1976-09-23	Fluorprostaglandinen en werkwijze ter bereiding ervan.
NL7504587A (nl)	1976-10-19	Cellulose-entcopolymeer alsmede werkwijze voor het bereiden daarvan.
NL7503253A (nl)	1975-09-23	Pyrrolodiazepinen en werkwijze voor de berei- ding daarvan.
NL7701450A (nl)	1977-08-16	Houder en werkwijze voor de vervaardiging ervan.

Legal Events

Date	Code	Title	Description
1979-08-27	BC	A request for examination has been filed
1983-08-01	BN	A decision not to publish the application has become irrevocable