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NL7606127A - Halfgeleiderinrichting. - Google Patents

Halfgeleiderinrichting.

Info

Publication number
NL7606127A
NL7606127A NL7606127A NL7606127A NL7606127A NL 7606127 A NL7606127 A NL 7606127A NL 7606127 A NL7606127 A NL 7606127A NL 7606127 A NL7606127 A NL 7606127A NL 7606127 A NL7606127 A NL 7606127A
Authority
NL
Netherlands
Prior art keywords
semi
guide device
guide
Prior art date
Application number
NL7606127A
Other languages
English (en)
Other versions
NL177364B (nl
NL177364C (nl
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of NL7606127A publication Critical patent/NL7606127A/nl
Publication of NL177364B publication Critical patent/NL177364B/nl
Application granted granted Critical
Publication of NL177364C publication Critical patent/NL177364C/nl

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/52Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/532Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
    • H01L23/53204Conductive materials
    • H01L23/53209Conductive materials based on metals, e.g. alloys, metal silicides
    • H01L23/53214Conductive materials based on metals, e.g. alloys, metal silicides the principal metal being aluminium
    • H01L23/53219Aluminium alloys
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/12All metal or with adjacent metals
    • Y10T428/12493Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12736Al-base component
    • Y10T428/1275Next to Group VIII or IB metal-base component
    • Y10T428/12757Fe

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Conductive Materials (AREA)
NLAANVRAGE7606127,A 1975-06-04 1976-06-04 Halfgeleiderinrichting. NL177364C (nl)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50066545A JPS51142988A (en) 1975-06-04 1975-06-04 Semiconductor devices

Publications (3)

Publication Number Publication Date
NL7606127A true NL7606127A (nl) 1976-12-07
NL177364B NL177364B (nl) 1985-04-01
NL177364C NL177364C (nl) 1985-09-02

Family

ID=13318965

Family Applications (1)

Application Number Title Priority Date Filing Date
NLAANVRAGE7606127,A NL177364C (nl) 1975-06-04 1976-06-04 Halfgeleiderinrichting.

Country Status (4)

Country Link
US (1) US4024567A (nl)
JP (1) JPS51142988A (nl)
DE (1) DE2625361C3 (nl)
NL (1) NL177364C (nl)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4142203A (en) * 1976-12-20 1979-02-27 Avx Corporation Method of assembling a hermetically sealed semiconductor unit
DE3023528C2 (de) * 1980-06-24 1984-11-29 W.C. Heraeus Gmbh, 6450 Hanau Aluminium enthaltender Feinstdraht
JPS5928553A (ja) * 1982-08-11 1984-02-15 Hitachi Ltd 耐食性アルミニウム配線材料
US4612805A (en) * 1984-12-24 1986-09-23 International Business Machines Corporation Adhesion characterization test site
US5500301A (en) 1991-03-07 1996-03-19 Kabushiki Kaisha Kobe Seiko Sho A1 alloy films and melting A1 alloy sputtering targets for depositing A1 alloy films
KR0179827B1 (ko) * 1995-05-27 1999-04-15 문정환 반도체 소자의 배선 형성방법
US20160099200A1 (en) * 2014-10-01 2016-04-07 Stmicroelectronics S.R.L. Aluminum alloy lead frame for a semiconductor device and corresponding manufacturing process

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1283970B (de) * 1966-03-19 1968-11-28 Siemens Ag Metallischer Kontakt an einem Halbleiterbauelement
DE1564707C3 (de) * 1966-09-14 1978-06-01 Siemens Ag, 1000 Berlin Und 8000 Muenchen Verfahren zum Herstellen eines mit pn-Übergang versehenen Halbleiterbauelements
CH493938A (de) * 1967-06-29 1970-07-15 Philips Nv Verfahren zur Herstellung einer Halbleitervorrichtung mit einer Legierungselektrode und gemäss dem Verfahren hergestellte Halbleitervorrichtung
US3922385A (en) * 1973-07-02 1975-11-25 Gen Motors Corp Solderable multilayer contact for silicon semiconductor

Also Published As

Publication number Publication date
DE2625361B2 (de) 1980-05-14
JPS51142988A (en) 1976-12-08
US4024567A (en) 1977-05-17
DE2625361A1 (de) 1976-12-09
DE2625361C3 (de) 1981-01-29
NL177364B (nl) 1985-04-01
NL177364C (nl) 1985-09-02

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Legal Events

Date Code Title Description
BC A request for examination has been filed
A85 Still pending on 85-01-01
V1 Lapsed because of non-payment of the annual fee
V1 Lapsed because of non-payment of the annual fee