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MY193023A - Socket for testing electronic components and test site arrangement - Google Patents

Socket for testing electronic components and test site arrangement

Info

Publication number
MY193023A
MY193023A MYPI2017703301A MYPI2017703301A MY193023A MY 193023 A MY193023 A MY 193023A MY PI2017703301 A MYPI2017703301 A MY PI2017703301A MY PI2017703301 A MYPI2017703301 A MY PI2017703301A MY 193023 A MY193023 A MY 193023A
Authority
MY
Malaysia
Prior art keywords
contact spring
socket
force
sense
electronic components
Prior art date
Application number
MYPI2017703301A
Inventor
Gerhard Gschwendtberger
Manuel Petermann
Volker Leikermoser
Gerald Staniszewski
Original Assignee
Multitest Elektronische Systeme Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Multitest Elektronische Systeme Gmbh filed Critical Multitest Elektronische Systeme Gmbh
Publication of MY193023A publication Critical patent/MY193023A/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)
  • Connecting Device With Holders (AREA)

Abstract

A socket for testing electronic components comprises: a plurality of force-sense pairs, each force-sense pair comprising a force contact spring and a sense contact spring, wherein the force contact spring and the sense contact spring are lying adjacent to each other and wherein at least one of the force contact spring and the sense contact spring is coated with an electrically isolating coating where the force contact spring and the sense contact spring abut against each other.
MYPI2017703301A 2016-09-08 2017-09-07 Socket for testing electronic components and test site arrangement MY193023A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP16187905 2016-09-08

Publications (1)

Publication Number Publication Date
MY193023A true MY193023A (en) 2022-09-22

Family

ID=56893823

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2017703301A MY193023A (en) 2016-09-08 2017-09-07 Socket for testing electronic components and test site arrangement

Country Status (3)

Country Link
CN (1) CN107807256B (en)
DE (1) DE102017120837B4 (en)
MY (1) MY193023A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4200621A4 (en) * 2020-08-05 2024-08-21 Equiptest Eng Pte Ltd Multi-beam cantilever style contact pin for ic testing

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11233216A (en) * 1998-02-16 1999-08-27 Nippon Denki Factory Engineering Kk Ic socket for test
JP2005339894A (en) * 2004-05-25 2005-12-08 Three M Innovative Properties Co Socket for testing ball grid array integrated circuit
KR101012712B1 (en) * 2005-06-10 2011-02-09 델라웨어 캐피탈 포메이션, 인코포레이티드 Compliant electrical interconnect and electrical contact probe
CN201141874Y (en) * 2007-05-10 2008-10-29 曹宏国 Ceramic four-side lead wire piece type carrier element aging test jack
CN101334425A (en) * 2007-06-29 2008-12-31 京元电子股份有限公司 Integrated circuit element test jack, socket substrate and test machine platform and method of manufacture
WO2009149949A1 (en) * 2008-06-12 2009-12-17 Multitest Elektronische Systeme Gmbh Contact base
JP5486866B2 (en) 2009-07-29 2014-05-07 ルネサスエレクトロニクス株式会社 Manufacturing method of semiconductor device
CN201955353U (en) * 2010-11-12 2011-08-31 安拓锐高新测试技术（苏州）有限公司 Semiconductor chip test socket
CN202145214U (en) * 2011-06-30 2012-02-15 上海韬盛电子科技有限公司 Semiconductor chip test socket based on Kelvin principle
US9429591B1 (en) * 2013-03-15 2016-08-30 Johnstech International Corporation On-center electrically conductive pins for integrated testing
CN203350289U (en) * 2013-06-28 2013-12-18 中国电子科技集团公司第四十研究所 CQFP packaged element burn-in test socket provided with floating bracket
US9354251B2 (en) * 2014-02-25 2016-05-31 Titan Semiconductor Tool, LLC Integrated circuit (IC) test socket using Kelvin bridge
DE102015117354B4 (en) 2015-10-12 2020-02-20 Multitest Elektronische Systeme Gmbh Cantilever contact spring and method for producing a cantilever contact spring

Also Published As

Publication number Publication date
DE102017120837B4 (en) 2019-10-17
CN107807256B (en) 2021-05-25
DE102017120837A1 (en) 2018-03-08
CN107807256A (en) 2018-03-16

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