[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

MY162495A - Surface treating agent for copper or copper alloy and use thereof - Google Patents

Surface treating agent for copper or copper alloy and use thereof

Info

Publication number
MY162495A
MY162495A MYPI2011000452A MYPI2011000452A MY162495A MY 162495 A MY162495 A MY 162495A MY PI2011000452 A MYPI2011000452 A MY PI2011000452A MY PI2011000452 A MYPI2011000452 A MY PI2011000452A MY 162495 A MY162495 A MY 162495A
Authority
MY
Malaysia
Prior art keywords
copper
surface treating
treating agent
copper alloy
represent
Prior art date
Application number
MYPI2011000452A
Inventor
Hirohiko Hirao
Noriaki Yamaji
Takayuki Murai
Original Assignee
Shikoku Chem
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shikoku Chem filed Critical Shikoku Chem
Publication of MY162495A publication Critical patent/MY162495A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
    • C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
    • C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
    • C23F11/14—Nitrogen-containing compounds
    • C23F11/149—Heterocyclic compounds containing nitrogen as hetero atom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3615—N-compounds
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D233/00—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings
    • C07D233/54—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings having two double bonds between ring members or between ring members and non-ring members
    • C07D233/64—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings having two double bonds between ring members or between ring members and non-ring members with substituted hydrocarbon radicals attached to ring carbon atoms, e.g. histidine
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
    • C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
    • C23C22/48—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 not containing phosphates, hexavalent chromium compounds, fluorides or complex fluorides, molybdates, tungstates, vanadates or oxalates
    • C23C22/52—Treatment of copper or alloys based thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/12—Copper or alloys thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax or thiol
    • H05K2203/124—Heterocyclic organic compounds, e.g. azole, furan

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Preventing Corrosion Or Incrustation Of Metals (AREA)
  • Pharmaceuticals Containing Other Organic And Inorganic Compounds (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Chemical Treatment Of Metals (AREA)
  • Epoxy Resins (AREA)

Abstract

A SURFACE TREATING AGENT FOR COPPER OR A COPPER ALLOY, WHICH CONTAINS AN IMIDAZOLE COMPOUND REPRESENTED THE FORMULA (I): WHEREIN R REPRESENTS A HYDROGEN ATOM OR AN ALKYL GROUP, X1 AND X2 ARE THE SAME OR DIFFERENT AND REPRESENT A CHLORINE ATOM OR A BROMINE ATOM; M AND N REPRESENT AN INTEGER OF 0 TO 3 AND AT LEAST ONE OF M OR N IS 1 OR MORE. THE SURFACE TREATING AGENT IS ALSO USED IN SURFACE TREATING METHODS, IN MAKING PRINTED WIRING BOARDS AND IN SOLDERING METHODS.
MYPI2011000452A 2008-08-08 2009-08-07 Surface treating agent for copper or copper alloy and use thereof MY162495A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2008206119 2008-08-08
JP2008295619 2008-11-19
JP2009124003A JP5313044B2 (en) 2008-08-08 2009-05-22 Surface treatment agent for copper or copper alloy and use thereof

Publications (1)

Publication Number Publication Date
MY162495A true MY162495A (en) 2017-06-15

Family

ID=41259797

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2011000452A MY162495A (en) 2008-08-08 2009-08-07 Surface treating agent for copper or copper alloy and use thereof

Country Status (6)

Country Link
JP (1) JP5313044B2 (en)
KR (1) KR101540143B1 (en)
CN (1) CN102119240B (en)
MY (1) MY162495A (en)
TW (1) TWI464298B (en)
WO (1) WO2010016620A1 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5301218B2 (en) * 2008-08-25 2013-09-25 四国化成工業株式会社 Surface treatment agent for copper or copper alloy and use thereof
JP5260357B2 (en) * 2008-09-17 2013-08-14 四国化成工業株式会社 2- (2,4-dichlorobenzyl) -4-phenyl-5-alkylimidazole compound
JP5260208B2 (en) * 2008-09-22 2013-08-14 四国化成工業株式会社 2- (2,4-Dichlorobenzyl) -4- (halogenated phenyl) imidazole compound
JP5260367B2 (en) * 2008-09-26 2013-08-14 四国化成工業株式会社 2- (Chlorobenzyl) -4-phenylimidazole compound
JP5615227B2 (en) 2011-05-23 2014-10-29 四国化成工業株式会社 Surface treatment agent for copper or copper alloy and use thereof
JP5615233B2 (en) * 2011-06-20 2014-10-29 四国化成工業株式会社 Surface treatment agent for copper or copper alloy and use thereof
KR101555753B1 (en) 2013-11-18 2015-09-30 서울대학교산학협력단 one-step method for preparation of corrosion preventive copper paste and its flexible dipole tag antenna application
CN109048019B (en) * 2018-09-13 2021-01-26 烟台孚信达双金属股份有限公司 Welding process for copper-aluminum composite bar
JP6681566B1 (en) * 2019-05-27 2020-04-15 千住金属工業株式会社 Solder paste and flux
JP6681567B1 (en) * 2019-05-27 2020-04-15 千住金属工業株式会社 Solder paste and flux

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3277025B2 (en) * 1993-05-10 2002-04-22 四国化成工業株式会社 Copper and copper alloy surface treatment agent
TW270944B (en) * 1993-05-10 1996-02-21 Shikoku Kakoki Co Ltd
JPH06329635A (en) * 1993-05-24 1994-11-29 Shikoku Chem Corp New imidazole compound
JP3311858B2 (en) * 1994-03-08 2002-08-05 四国化成工業株式会社 Copper and copper alloy surface treatment agent
JPH08183776A (en) * 1994-12-28 1996-07-16 Hideaki Yamaguchi Surface-protecting agent of metal and production using the same
AR024077A1 (en) * 1999-05-25 2002-09-04 Smithkline Beecham Corp ANTIBACTERIAL COMPOUNDS
US6524644B1 (en) * 1999-08-26 2003-02-25 Enthone Inc. Process for selective deposition of OSP coating on copper, excluding deposition on gold
JP4181888B2 (en) * 2003-02-04 2008-11-19 四国化成工業株式会社 Anticorrosive treatment for silver and silver alloys
DE602004028223D1 (en) * 2003-03-19 2010-09-02 Shikoku Chem SOLDERING PROCEDURE USING AN IMIDAZOL CONNECTION
JP2005068530A (en) * 2003-08-28 2005-03-17 Tamura Kaken Co Ltd Surface-treating agent, printed circuit board, and method for surface-treating metal on printed circuit board
JP4546163B2 (en) * 2004-06-10 2010-09-15 四国化成工業株式会社 Copper or copper alloy surface treatment agent and soldering method
JP2007297685A (en) * 2006-05-01 2007-11-15 Shikoku Chem Corp Surface treatment agent for metal, and its utilization
JP5036216B2 (en) * 2006-05-19 2012-09-26 四国化成工業株式会社 Metal surface treatment agent and use thereof

Also Published As

Publication number Publication date
CN102119240B (en) 2014-07-30
KR20110073421A (en) 2011-06-29
TW201009117A (en) 2010-03-01
KR101540143B1 (en) 2015-07-28
WO2010016620A1 (en) 2010-02-11
JP2010150651A (en) 2010-07-08
TWI464298B (en) 2014-12-11
CN102119240A (en) 2011-07-06
JP5313044B2 (en) 2013-10-09

Similar Documents

Publication Publication Date Title
MY162495A (en) Surface treating agent for copper or copper alloy and use thereof
BRPI0507968A (en) oxidation of organic compounds at high ph
HK1090098A1 (en) Novel imidazole compound and usage thereof
MY145344A (en) Galvanic process for filling through-holes with metals, in particular of printed circuit boards with copper
HK1148110A1 (en) Etching agent, etching method and liquid for preparing etching agent
MX2009008858A (en) Fluorine-containing pyrazolecarbonitrile derivative and method for producing the same, and fluorine-containing pyrazolecarboxylic acid derivative obtained by using the fluorine-containing pyrazolecarbonitrile derivative and method for producing the s
TW200736363A (en) Material for organic electroluminescent device and organic electroluminescent device
MX2010001605A (en) Method for producing fluorinated olefins.
MX2009010823A (en) Hydrazide compound and harmful arthropod-controlling agent containing the same.
EP2239263A4 (en) Cyclic compound, its metal complex, and modified metal complex
MY142821A (en) Polyvinylammonium compound, method of manufacturing same, acidic solution containing said compound and method of electrolytically depositing a copper deposit
TW200643053A (en) Organoaluminum precursor compounds
MY153418A (en) Tin electrolytic plating solution for electronic parts, tin electroplated electronic parts and circuit board comprising tin electroplated electronic parts
MY166771A (en) Surface treating composition for copper and copper alloy and utilization thereof
GEP20115166B (en) 2-ARYLINDOLE DERIVATIVES AS mPGES-I INHIBITORS
NO20090804L (en) Modem suitable for underwater power communication
MX2010009276A (en) Pyrrolopyrimidinecarboxamides.
TW200942602A (en) Polishing composition
MD3655F1 (en) Inhibitor of human myeloid leukemia on base of bis(2-hydroxy-8-phenyl-tricyclo/7.3.1.0.2,7/-tridecane-13-on-thiosemicarbazonato)
TW200621852A (en) Resin composition and its use
GB2452174A (en) A method and composition for selectively stripping nickel from a substrate
MY169359A (en) Epoxy resin composition and electronic component device
WO2011013922A3 (en) Surface treating agent composition, method for preparing same, copper foil for a printed circuit board, and flexible copper clad laminate
MX2012002432A (en) Methylpyrrolopyrimidinecarboxamides.
TW200728272A (en) Compound and method for manufacturing the same, positive resist composition and method for forming resist pattern