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MY159628A - Method and device for the wet-chemical treatment of material to be treated - Google Patents

Method and device for the wet-chemical treatment of material to be treated

Info

Publication number
MY159628A
MY159628A MYPI2012002862A MYPI2012002862A MY159628A MY 159628 A MY159628 A MY 159628A MY PI2012002862 A MYPI2012002862 A MY PI2012002862A MY PI2012002862 A MYPI2012002862 A MY PI2012002862A MY 159628 A MY159628 A MY 159628A
Authority
MY
Malaysia
Prior art keywords
treated
wet
chemical treatment
treatment
treatment vessel
Prior art date
Application number
MYPI2012002862A
Inventor
Andreas Skupin
Helmut Bruckner
Christian Lowinski
Original Assignee
Atotech Deutschland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland Gmbh filed Critical Atotech Deutschland Gmbh
Publication of MY159628A publication Critical patent/MY159628A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/187—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating means therefor, e.g. baths, apparatus
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/003—Electroplating using gases, e.g. pressure influence
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0621—In horizontal cells
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/086—Using an inert gas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Automation & Control Theory (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Chemically Coating (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Treating Waste Gases (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Treatment Of Fiber Materials (AREA)
  • Gas Separation By Absorption (AREA)

Abstract

A DEVICE (1) FOR THE WET-CHEMICAL TREATMENT OF MATERIAL TO BE TREATED (10), IN PARTICULAR OF FLAT MATERIAL TO BE TREATED (10), COMPRISES A TREATMENT VESSEL (2) FOR TREATING THE MATERIAL TO BE TREATED (10) WITH A TREATMENT LIQUID (9), A TRANSPORT DEVICE (24) FOR TRANSPORTING THE MATERIAL TO BE TREATED (10) THROUGH THE TREATMENT VESSEL (2), AND A FEED DEVICE (11) FOR FEEDING AN INERT GAS (16) INTO THE TREATMENT VESSEL (2). (FIG. 1)
MYPI2012002862A 2009-12-28 2010-12-28 Method and device for the wet-chemical treatment of material to be treated MY159628A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102009060676.9A DE102009060676B4 (en) 2009-12-28 2009-12-28 Process and device for wet-chemical treatment of items to be treated

Publications (1)

Publication Number Publication Date
MY159628A true MY159628A (en) 2017-01-13

Family

ID=43827796

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2012002862A MY159628A (en) 2009-12-28 2010-12-28 Method and device for the wet-chemical treatment of material to be treated

Country Status (10)

Country Link
US (1) US20120298515A1 (en)
EP (1) EP2520140B1 (en)
JP (1) JP5763100B2 (en)
KR (1) KR101503377B1 (en)
CN (1) CN102687602B (en)
BR (1) BR112012015928A2 (en)
DE (1) DE102009060676B4 (en)
MY (1) MY159628A (en)
TW (1) TWI554656B (en)
WO (1) WO2011079950A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102013207343B3 (en) * 2013-04-23 2014-08-28 Atotech Deutschland Gmbh Apparatus and method for wet-chemical treatment of flat material to be treated
US20160040292A1 (en) * 2014-08-08 2016-02-11 Gary P. Wainwright Roll-to-roll electroless plating system with low dissolved oxygen content
US9719171B2 (en) 2014-09-12 2017-08-01 Eastman Kodak Company Roll-to-roll electroless plating system with spreader duct
EP3016486B1 (en) * 2014-10-29 2017-08-16 ATOTECH Deutschland GmbH Desmear module of a horizontal process line and a method for separation and removal of desmear particles from such a desmear module
CN106793499B (en) * 2015-11-23 2019-07-16 宇宙电路板设备(深圳)有限公司 Printed circuit board wet-chemical treatment equipment and printed circuit board Wet chemical processing method
TWI689455B (en) * 2019-07-30 2020-04-01 群翊工業股份有限公司 Nitrogen box capable of preventing board deviation from continuous passage
EP4108804A1 (en) * 2019-10-10 2022-12-28 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Method and apparatus for performing immersion tin process or copper plating process in the production of a component carrier

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3023827C2 (en) * 1980-06-25 1985-11-21 Siemens AG, 1000 Berlin und 8000 München Plant for the galvanic deposition of aluminum
US4759831A (en) * 1986-07-04 1988-07-26 Siemens Aktiengesellschaft Electroplating apparatus particularly for electro-deposition of aluminum
JPS63221693A (en) * 1987-03-10 1988-09-14 日立化成工業株式会社 Conveyer treatment of nonelectrolytic pre-treatment solution
CA2083196C (en) 1991-11-27 1998-02-17 Randal D. King Process for extending the life of a displacement plating bath
US5304297A (en) * 1993-02-26 1994-04-19 Rockwell International Corporation Reducing agent regeneration system
US5605719A (en) * 1995-03-03 1997-02-25 Rockwell International Corporation Method of transporting and applying a surface treatment liquid using gas bubbles
US5676716A (en) * 1995-10-30 1997-10-14 The Babcock & Wilcox Company Apparatus for mixing a tank and improving air/liquid contact in an oxidized system
DE19736350C1 (en) * 1997-08-21 1999-08-05 Atotech Deutschland Gmbh Process for regulating the concentration of substances in electrolytes and device for carrying out the process
JP2000169970A (en) 1998-12-07 2000-06-20 Yoshinobu Abe Plating method in inert atmosphere
DE10132478C1 (en) 2001-07-03 2003-04-30 Atotech Deutschland Gmbh Process for depositing a metal layer and process for regenerating a solution containing metal ions in a high oxidation state
US20090238979A1 (en) * 2008-03-21 2009-09-24 William Decesare Method of Applying Catalytic Solution for Use in Electroless Deposition

Also Published As

Publication number Publication date
EP2520140B1 (en) 2018-12-26
CN102687602A (en) 2012-09-19
BR112012015928A2 (en) 2020-09-15
JP5763100B2 (en) 2015-08-12
EP2520140A1 (en) 2012-11-07
DE102009060676A1 (en) 2011-06-30
KR20130008515A (en) 2013-01-22
US20120298515A1 (en) 2012-11-29
JP2013515858A (en) 2013-05-09
CN102687602B (en) 2015-07-01
DE102009060676B4 (en) 2015-07-23
TW201137182A (en) 2011-11-01
TWI554656B (en) 2016-10-21
WO2011079950A1 (en) 2011-07-07
KR101503377B1 (en) 2015-03-24

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