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MY154860A - Adhesive sheet for wafer bonding and method of processing a wafer by using the same - Google Patents

Adhesive sheet for wafer bonding and method of processing a wafer by using the same

Info

Publication number
MY154860A
MY154860A MYPI2012000033A MYPI2012000033A MY154860A MY 154860 A MY154860 A MY 154860A MY PI2012000033 A MYPI2012000033 A MY PI2012000033A MY PI2012000033 A MYPI2012000033 A MY PI2012000033A MY 154860 A MY154860 A MY 154860A
Authority
MY
Malaysia
Prior art keywords
wafer
adhesive sheet
processing
same
wafer bonding
Prior art date
Application number
MYPI2012000033A
Inventor
Ota Satoshi
Yabuki Akira
Yano Shozo
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Publication of MY154860A publication Critical patent/MY154860A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/50—Additional features of adhesives in the form of films or foils characterized by process specific features
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2453/00—Presence of block copolymer
    • C09J2453/006—Presence of block copolymer in the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Dicing (AREA)

Abstract

AN ADHESIVE SHEET FOR WAFER BONDING, HAVING A BASE MATERIAL RESIN FILM AND A REMOVABLE ADHESIVE LAYER PROVIDED ON THE BASE MATERIAL RESIN FILM, IN WHICH A MINIMUM VALUE OF A LOSS FACTOR IS 0.20 OR MORE, WHICH IS MEASURED BY: USING A SPECIMEN PREPARED BY PROCESSING THE ADHESIVE SHEET TO HAVE A WIDTH OF 5 MM; AND APPLYING A TENSILE STRESS AT A FREQUENCY OF 400 TO 900 HZ AT A TEMPERATURE OF 23°C BY A DYNAMIC VISCOELASTICITY MEASUREMENT APPARATUS, AND A MINIMUM VALUE OF A LOSS FACTOR IS 0.20 OR MORE, WHICH IS MEASURED BY: USING THE SPECIMEN; AND APPLYING A TENSILE STRESS AT A FREQUENCY OF 650 HZ AT A TEMPERATURE OF 15°C TO 40°C BY THE DYNAMIC VISCOELASTICITY MEASUREMENT APPARATUS.
MYPI2012000033A 2009-07-08 2010-07-06 Adhesive sheet for wafer bonding and method of processing a wafer by using the same MY154860A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009162009 2009-07-08

Publications (1)

Publication Number Publication Date
MY154860A true MY154860A (en) 2015-08-14

Family

ID=43429249

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2012000033A MY154860A (en) 2009-07-08 2010-07-06 Adhesive sheet for wafer bonding and method of processing a wafer by using the same

Country Status (6)

Country Link
JP (1) JPWO2011004825A1 (en)
KR (1) KR101336430B1 (en)
CN (1) CN102473617B (en)
MY (1) MY154860A (en)
TW (1) TWI447202B (en)
WO (1) WO2011004825A1 (en)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101883648B1 (en) * 2011-05-17 2018-07-31 린텍 코포레이션 Film and adhesive sheet
JP5546518B2 (en) * 2011-09-28 2014-07-09 古河電気工業株式会社 Adhesive tape for grinding brittle wafer back surface and grinding method using the same
KR101424401B1 (en) * 2012-08-03 2014-07-28 주식회사 엘지화학 Adhesive Film and Encapsulation Method of Organic Electronic Device Using the Same
JP6373251B2 (en) * 2013-02-22 2018-08-15 デンカ株式会社 Method for manufacturing electronic component using adhesive sheet
KR101659057B1 (en) * 2013-09-30 2016-09-22 주식회사 엘지화학 Semiconductor wafer dicing film and dicing die bonding film
JP6264126B2 (en) * 2014-03-20 2018-01-24 日立化成株式会社 Wafer processing tape
JP6068386B2 (en) * 2014-03-31 2017-01-25 日東電工株式会社 Thermosetting die bond film, dicing die bond film, and semiconductor device manufacturing method
JP6280459B2 (en) * 2014-06-27 2018-02-14 株式会社ディスコ Tape expansion unit
JP6436593B2 (en) * 2014-10-20 2018-12-12 積水化成品工業株式会社 Adhesive gel sheet having adhesive application, method for producing the same, method for fixing a pair of adherends, and composite material
JP6445315B2 (en) * 2014-12-12 2018-12-26 日東電工株式会社 Dicing sheet, dicing die-bonding film, and semiconductor device manufacturing method
JP6623639B2 (en) * 2015-09-18 2019-12-25 住友ベークライト株式会社 Temporary fixing tape
CN107995997B (en) * 2016-03-31 2023-11-14 古河电气工业株式会社 Adhesive sheet for semiconductor processing
JP6310492B2 (en) * 2016-03-31 2018-04-11 古河電気工業株式会社 Electronic device packaging tape
KR102355077B1 (en) * 2016-03-31 2022-01-25 후루카와 덴키 고교 가부시키가이샤 Adhesive sheet for semiconductor processing
EP3533852A4 (en) * 2016-10-27 2020-06-17 Mitsui Chemicals Tohcello, Inc. Electronic device production method, adhesive film for electronic device production, and electronic component testing device
CN109906385A (en) 2016-10-27 2019-06-18 三井化学东赛璐株式会社 The manufacturing method of electronic device, electronic device manufacture adherence film and apparatus for electronic device test
CN110036459B (en) * 2016-12-07 2023-07-14 古河电气工业株式会社 Semiconductor processing tape
JP6800062B2 (en) * 2017-03-28 2020-12-16 古河電気工業株式会社 Adhesive tape
JP6535047B2 (en) * 2017-05-12 2019-06-26 古河電気工業株式会社 Adhesive tape for semiconductor processing
JP7400263B2 (en) * 2018-08-23 2023-12-19 東レ株式会社 Film and film manufacturing method
JP7430853B2 (en) * 2019-05-28 2024-02-14 シーカ テクノロジー アクチェンゲゼルシャフト Methods for selecting adhesives, adhesive composites, and methods for manufacturing adhesive composites

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4780828B2 (en) 2000-11-22 2011-09-28 三井化学株式会社 Adhesive tape for wafer processing, method for producing the same and method for using the same
JP2003092273A (en) * 2001-09-19 2003-03-28 Mitsubishi Plastics Ind Ltd Dicing film for semiconductor wafer
JP4851246B2 (en) * 2006-06-12 2012-01-11 古河電気工業株式会社 A dicing tape for laser dicing based on a composition having a phase separation structure obtained by adding a hydrogenated styrene / butadiene copolymer to polypropylene.
JP2008066688A (en) * 2006-08-11 2008-03-21 Furukawa Electric Co Ltd:The Tape for wafer processing
JP5019580B2 (en) * 2006-09-20 2012-09-05 古河電気工業株式会社 Wafer sticking sheet and wafer processing method
WO2009063793A1 (en) * 2007-11-15 2009-05-22 The Furukawa Electric Co., Ltd. Adhesive tape for processing semiconductor wafer
WO2009078440A1 (en) * 2007-12-18 2009-06-25 The Furukawa Electric Co., Ltd. Adhesive sheet for bonding wafer and wafer processing method

Also Published As

Publication number Publication date
WO2011004825A1 (en) 2011-01-13
TW201118146A (en) 2011-06-01
TWI447202B (en) 2014-08-01
JPWO2011004825A1 (en) 2012-12-20
KR101336430B1 (en) 2013-12-04
CN102473617A (en) 2012-05-23
CN102473617B (en) 2015-04-29
KR20120023811A (en) 2012-03-13

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