MY135343A - Novel binderless diamond grinding wheel for fine finishing of i.c. chip packaging for failure analysis and for machining small areas in brittle materials like silicon and glass - Google Patents
Novel binderless diamond grinding wheel for fine finishing of i.c. chip packaging for failure analysis and for machining small areas in brittle materials like silicon and glassInfo
- Publication number
- MY135343A MY135343A MYPI20030326A MY135343A MY 135343 A MY135343 A MY 135343A MY PI20030326 A MYPI20030326 A MY PI20030326A MY 135343 A MY135343 A MY 135343A
- Authority
- MY
- Malaysia
- Prior art keywords
- grinding
- silicon
- novel
- glass
- grinding wheel
- Prior art date
Links
Landscapes
- Polishing Bodies And Polishing Tools (AREA)
Abstract
THE GRINDING FACE OF A GRINDING COMPONENT IS A CONTINUOUS LAYER OF ABRAISE GRAINS ADHERING TO THE SUBSTRATE OF THE GRIDING COMPONENT. SAID ABRAISE GRAINS, PREFERABLY DIAMOND GRAINS ADHERES TO EACH OTHER AND THE SUBSTRATE IN ABSENCE OF BONDS AS FOUND IN BONDED GRINDING WHEELS. THE ABRASIVE LAYER HAS FINE GRIT, PREFERABLY 10 UM AND 5 UM AND ALMOST NON-EXISTENT POROSITY. THE EDGE OF THE DEPOSITED ABRASIVE LAYER HAS FACETTED GRAINS WHICH ACTS AS CUTTING EDGE IN DEFINE DELAYERING WORK. SAID GRINDING COMPONENT MAY BE EMBODIED AS ROTATING GRINDING COMPONENTS OR STATIONARY GRINDING COMPONENTS.FIG.1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| MYPI20030326 MY135343A (en) | 2003-01-30 | 2003-01-30 | Novel binderless diamond grinding wheel for fine finishing of i.c. chip packaging for failure analysis and for machining small areas in brittle materials like silicon and glass |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| MYPI20030326 MY135343A (en) | 2003-01-30 | 2003-01-30 | Novel binderless diamond grinding wheel for fine finishing of i.c. chip packaging for failure analysis and for machining small areas in brittle materials like silicon and glass |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MY135343A true MY135343A (en) | 2008-03-31 |
Family
ID=45891131
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MYPI20030326 MY135343A (en) | 2003-01-30 | 2003-01-30 | Novel binderless diamond grinding wheel for fine finishing of i.c. chip packaging for failure analysis and for machining small areas in brittle materials like silicon and glass |
Country Status (1)
| Country | Link |
|---|---|
| MY (1) | MY135343A (en) |
-
2003
- 2003-01-30 MY MYPI20030326 patent/MY135343A/en unknown
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