MY103155A - Printed circuit boards and method for manufacturing printed circuit boards - Google Patents

Abstract

A PRINTED CIRCUIT BOARD IS DESCRIBED IN WHICH AN ELECTRICALLY INSULATING LAMINATE MATERIAL (40) HAS FIRST AND SECOND SIDES. AN ELECTRICALLY CONDUCTING FIRST CIRCUIT PATTERN (15) IS EMBEDDED IN THE FIRST SIDE OF THE LAMINATE MATERIAL (40) AND AN ELECTRICALLY CONDUCTING SECOND CIRCUIT PATTERN (20) IS EMBEDDED IN THE SECOND SIDE OF THE LAMINATE MATERIAL (40) ELECTRICALLY INSULATED FROM THE FIRST CIRCUIT PATTERN (15) BY THE LAMINATE MATERIAL (40). A SOLID INTERCONNECTION MEMBER (20) EXTENDS THROUGH THE LAMINATE MATERIAL (40) AND ELECTRICALLY CONTACTS BOTH THE FIRST AND SECOND CIRCUIT PATTERNS (15, 20) AT SELECTED LOCATIONS THEREOF. THE METHOD FOR FABRICATING THE BOARD INCLUDES AS A FIRST STEP THE FABRICATION OF A FIRST BOARD PANEL (10) HAVING A RAISED ELECTRICALLY CONDUCTING FIRST CIRCUIT PATTERN (15) EXTENDING FROM A BASE LAYER (14) OF CONDUCTIVE MATERIAL AND A RAISED ELECTRICALLY CONDUCTING SECOND CIRCUIT PATTERN (20) EXTENDING FROM THE FIRST CIRCUIT PATTERN (15). A SECOND BOARD PANEL (30) IS ALSO FABRICATED HAVING A RAISED ELECTRICALLY CONDUCTING THIRD CIRCUIT PATTERN (35) EXTENDING FROM ANOTHER BASE LAYER (34) OF CONDUCTIVE MATERIAL. THE FIRST BOARD PANEL (10) IS LAMINATED TO THE SECOND BOARD PANEL (30) WITH A LAMINATE INSULATING MATERIAL (40) DISPOSED THEREBETWEEN ELECTRICALLY INSULATING THE FIRST CIRCUIT PATTERN (20) ELECTRICALLY CONTACTING THE FIRST CIRCUIT PATTERN (15) AT SELECTED PORTIONS THEREOF. FINALLY THE BASE LAYERS (14, 34) OF CONDUCTIVE MATERIAL ARE REMOVED FROM THE LAMINATE INSULATING MATERIAL (40). (FIG. 16)