MXPA99011095A - Discharge head of liquid manufacturing method of discharge head of liquid, head cartridge, and liquid discharge apparatus - Google Patents
Discharge head of liquid manufacturing method of discharge head of liquid, head cartridge, and liquid discharge apparatusInfo
- Publication number
- MXPA99011095A MXPA99011095A MXPA/A/1999/011095A MX9911095A MXPA99011095A MX PA99011095 A MXPA99011095 A MX PA99011095A MX 9911095 A MX9911095 A MX 9911095A MX PA99011095 A MXPA99011095 A MX PA99011095A
- Authority
- MX
- Mexico
- Prior art keywords
- liquid
- discharge head
- flow passage
- liquid discharge
- separation film
- Prior art date
Links
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Abstract
A liquid discharge head has a plurality of first liquid flow passages connected to outlets for discharging the discharge liquid, a plurality of second liquid flow passages having an element board with heating elements to generate a bubble in the liquid forming bubbles and corresponding to the first fluid flow passages, and mobile separation films that substantially and mutually separate the first liquid flow passages and the second fluid flow passages all the time, where the films of mobile separation are mutually independent individual separation films for each of the second liquid flow passages. It is possible to directly provide a flow passage wall by configuring a side wall of a first liquid flow passage in the element board by low temperature bonding using surface activation since the mobile separation films are individual separation films. The connection of the flow passage wall with the panel of elements is carried out safely and the dispersion of discharge characteristics depending on the batch of the products can be limited
Description
LIQUID DISCHARGE HEAD, METHOD OF MANUFACTURING LIQUID DISCHARGE HEAD, HEAD CARTRIDGE, AND LIQUID DISCHARGE APPARATUS BACKGROUND OF THE INVENTION Field of the Invention The present invention relates to a method of manufacturing a discharge head of the invention. Liquid that discharges a desired liquid by using the production of bubbles caused by the application of thermal energy on the liquid, a liquid discharge head, a head cartridge employing the liquid discharge head, and a discharge device Furthermore, the present invention is an invention that can be applied to a device such as, for example, a printer, a copying machine, a fax machine with a communication system, or a word processor with a part of printer, and in addition, an industrial recording device combined with several types of processors, which performs the registration on a recording medium such as, for example, paper, thread, fiber, cloth, leather, metal, plastic, glass, wood, ceramics. The term "record" in the present invention refers not only to providing a meaningful image such as, for example, a character or a number to a recording medium, but also to providing a meaningless image such as, for example, a design. BACKGROUND OF RELATED ART The ink jet recording method, known as a bubble jet recording method, is known wherein a change of state accompanying a rapid volume change (bubble generation) is caused in the ink by the application of thermal energy or similar to the ink, and the ink is discharged from an outlet by means of the force acting on the basis of this change of state, and said ink is applied on a recording medium, in such a way that the formation of an image is carried out. A recording apparatus using said bubble jet recording method generally has an outlet to discharge the ink, an ink flow passage connected to this outlet, and a heating element (a substance that converts the electrothermal energy) that is found in the ink flow passage as a power generation device for discharging the ink as disclosed in Japanese Patent Publication Number 61-59911 and in Japanese Patent Publication 61-59914. By using the aforementioned registration method, a high quality image can be recorded at high speed and with a low noise level, and meanwhile, since the outlets for downloading the ink can be placed with high density, a head that This method of registration has many advantages, for example, the advantage that a high resolution image can be obtained, and in addition, a color image can also be easily obtained through a small device. Consequently, recently, this method of recording bubble jets has been used in many office machines, such as printers, copying machines, or telefaxes, and is also being used in industrial systems such as, for example, devices of impression. On the other hand, in a conventional bubble jet recording method, the heating is repeated in the state in which the heating element is in contact with the ink, and consequently, some cases occur in which they occur. deposits caused by the burning of ink on the surface of the heating element. Furthermore, in the case in which the liquid to be discharged is a liquid that can be easily degraded by heat, or in the case in which the liquid to be discharged is a liquid in which it is difficult to obtain a sufficient number of liquids. bubbles, there are cases in which a preferred discharge can not be obtained through the formation of bubbles by direct heating employing the aforementioned heating element. In contrast to this, the applicant has proposed a method in which the bubble formation liquid forms bubbles by the application of thermal energy to discharge the discharge liquid through a flexible film that separates the liquid forming bubbles and the liquid of bubbles in the open Japanese Patent Application No. 55-81172. The configuration of the flexible film and the bubble-forming liquid in this method is a constitution in which the flexible film is provided in a part of a nozzle, but in contrast to this, a constitution that employs a large film to separate the total of the head in an upper part and in a lower part is disclosed in Japanese Patent Application Laid-open No. 59-26270. This large film is supplied for the purpose of preventing liquids in two liquid flow passages from mixing together, because they are held between two sheet members forming the liquid flow passage. On the other hand, as a constitution in which the bubble-forming liquid itself has characteristics and characteristics of bubble formation are considered, a constitution is disclosed in Japanese Patent Application Laid-open No. 5-229122 and employs a liquid with a boiling point lower than the boiling point of the discharge liquid or a construction which is disclosed in Japanese Laid Open Patent Application No. 4-329148 and employs a conductive liquid as a liquid for bubble formation. However, when the present inventor and others examined to actually manufacture a liquid discharge head using a separation film, the following problems were encountered. Since the separation film is placed between a base board having a plurality of heating elements and an upper board to form a common liquid chamber, there is concern that a film mounting device has become complicated or that the Film may be damaged when the film is mounted, in the case of the independent handling of a deformable separation film. Furthermore, it is difficult to adhere the film in the desired positions in the ink flow passage provided in one head and the heater, and to securely secure the area other than the moving portion of the film, and the dispersion is considered to be The discharge performance according to the products can be increased. In addition, since the discharge of liquid caused by the formation of bubbles by application of thermal energy is carried out through the displacement of the separation film, there is concern in the sense that the efficiency of the discharge can be decreased. Accordingly, in case of using the structure of a film for which a patent was requested by the present inventor and others to achieve a discharge of liquid at a higher level while retaining the effect created by the separation function of a separation film, it is necessary to solve that problem through a simple method. In addition, from another perspective, the present inventor and others have found a new technological problem that did not exist previously, in the case of carrying out a liquid discharge based on the formation of bubbles caused by boiling of film using an organic film. and using a heating element. That is to say, a technological problem is found when considering the thermal factor in the displacement of the separation film accompanied by a series of changes of generation of bubbles - growth - deformation, or considering the practically probable situation of improving the durability for a simple substance separation film or an ink jet head. SUMMARY OF THE INVENTION It is a first object of the present invention to provide a liquid discharge head which solves the above problems and which has a small dispersion in terms of its discharge performance which depends on products and which has a high reliability and which can register an image with many details.
It is a second object of the present invention to provide a liquid discharge head which solves the above problems and which further improves the liquid discharge efficiency by a simple constitution while retaining the effect on the basis of the separation function of a film of separation. It is a third object of the present invention to provide a method of manufacturing a liquid discharge head which solves the above problems and which has a small dispersion in terms of discharge performance according to the products and which has a high reliability. It is a fourth object of the present invention to provide a method of manufacturing a liquid discharge head in which damage to a moving film in the manufacturing step or the like is avoided by eliminating the step of independently handling a moving film. It is a further object of the present invention to provide various related inventions that will be described later in a method of manufacturing a liquid discharge head, a liquid discharge head, a head cartridge, a liquid discharge device or the like which have been created by the present inventor and others in the course of solving the aforementioned problems. A liquid discharge head of the present invention for solving the aforementioned problems is a liquid discharge head comprising: a plurality of first liquid flow passages connected to outlets for discharging a discharge liquid; a plurality of second liquid flow passages having an element board with heating elements to generate bubbles in bubble formation liquid and corresponding to the aforementioned first liquid flow passages; and mobile separation films that substantially and mutually separate the first preceding liquid flow passages and the aforementioned second corresponding liquid flow passages all the time, where the mobile separation films are mutually independent individual separation films for the second passages of respective liquid flow. In accordance with the aforementioned liquid discharge head, it is possible to directly provide a flow passage wall which forms a side wall of a first passage of liquid flow on the element board by joining at low temperature (normal temperature) by the use of surface activation since the mobile separation films are individual separation films. Accordingly, the connection of the flow passage wall with the element board is carried out safely and the dispersion in terms of the discharge characteristics may be limited according to the batch of products or the like. In addition, a liquid discharge head of the present invention is a liquid discharge head comprising: a first fluid flow passage connected to an outlet for discharging discharge liquid; a second liquid flow passage having an element board with a heating element for generating bubbles in a bubble formation liquid and corresponding to the aforementioned first liquid flow passage; and a movable separating film that substantially and mutually separates the aforementioned first liquid flow passage and the second corresponding liquid flow passage mentioned above all the time, wherein the liquid discharge head further comprises a seat on which physically or chemically bonds the above moving separation film, and the above moving separation film is not physically or chemically bonded to the end portion on the aforementioned heating element side of the previous seat. In accordance with the above liquid discharge head, since the mobile separation film is attached on the seat but is not joined on the end portion on the heating element side of this seat, it is possible to expand the mobile area of the mobile separation film. Accordingly, the displacement amount of the mobile separation film based on the generation of bubbles in the second liquid flow passage increases, and the discharge efficiency of the discharge liquid improves. In addition, a liquid discharge head of the present invention is a liquid discharge head comprising: a plurality of first liquid flow passages connected to outlets for discharging discharge liquid; a plurality of second liquid flow passages having an element board with heating elements to generate bubble formation bubbles and corresponding to the first previous liquid flow passages; and an organic mobile separation film that substantially and mutually separates the first preceding liquid flow passages and the corresponding second liquid flow passages all the time, which further comprises a seat on which the organic film of the physical or chemical bond is physically or chemically bound. movable separation mentioned above, wherein the tip portion of the flow passage wall provided for dividing the aforementioned plurality of first liquid flow passages is pressed towards the bonding area of the aforementioned movable separation organic film attached to the seat, and the width Wl of the aforementioned tip portion is less than the width W2 of the aforementioned joint area.
According to the above liquid discharge head, the position of the end portion of the contact area with the flow passage wall of the movable separating organic film is displaced from the position of the fixed end (end portion of the joint area on the seat), of the movable area of the movable separating organic film, and when the movable member is displaced towards the first flow passage side of liquid accompanied with the generation of bubbles, the force by the end portion of the wall flow passage is not applied on the mobile separation film, therefore the durability of the mobile separation film is improved. In addition, a liquid discharge head of the present invention is otherwise a liquid discharge head comprising: a first fluid flow passage connected to an outlet for discharging discharge liquid; a second liquid flow passage having an element board with a heating element for generating bubbles in bubble formation liquid and corresponding to the aforementioned first fluid flow passage; and a movable separating film that substantially and mutually separates the aforementioned first fluid flow passage and the second corresponding liquid flow passage mentioned above all the time. It further comprises a seat on which the aforementioned movable separation film is attached, wherein the aforementioned movable separation film is adhered through a shaped adhesive area to suit the previous seat. In accordance with the aforementioned liquid discharge head, since the mobile separation film adheres on the panel of elements through an adhesive area formed on the aforementioned seat, the adhesive force of the fixing portion of the film of mobile separation is reinforced. As a result of this situation, since it is possible to cause the fixed part and the mobile part of the mobile separation film to function as a fixed portion and a movable portion, the action of the mobile separation film becomes stable and as a result , a stable discharge characteristic can be obtained. Further, since the adhesive area is formed by shaping on the seat, the leakage of adhesives towards the unnecessary part is prevented and the mobile range of the movable member is secured in a highly accurate manner, and the discharge characteristics are stabilized. In addition, by using a silane coupling agent as an adhesive, the durability of the adhering part is improved. A method of manufacturing a liquid discharge head of the present invention is a method of manufacturing a liquid discharge head comprising: a first fluid flow passage connected to an outlet for discharging a liquid; a second passage of liquid flow having a heating element to generate bubbles in liquid; and a movable separating film that substantially and mutually separates the first preceding liquid flow passage and the second anterior liquid flow passage all the time, comprising the steps of: forming a seat to support the aforementioned mobile separation film with a clearance in relation to the aforementioned heating element, in a panel of elements where the aforementioned heating element is formed; the formation of a sacrificial layer at least in a position that will be the slack of the aforementioned element board; the formation of the aforementioned mobile separation film on the previous seat covering the aforementioned sacrificial layer; carrying out a chemical attack from the back of the aforementioned board of elements and forming a through hole in the aforementioned board of elements to allow the aforementioned sacrificial layer to be a chemical attack blocking layer; and removing the aforementioned sacrificial layer through the aforementioned through-hole and forming the aforementioned second liquid flow passage. In accordance with the aforementioned manufacturing method of a liquid discharge head, since the mobile separation film can be provided integrally on the element board, no independent handling of an extremely thin mobile separation film occurs in the step of manufacturing, and the risk of damage of the mobile separation film is eliminated. Accordingly, a liquid discharge head is manufactured having a first dispersion in terms of discharge characteristics caused by the damage of the mobile separation film and has a high reliability. A method of manufacturing a liquid discharge head of the present invention is otherwise a method of manufacturing a liquid discharge head comprising: a first passage of liquid flow connected to a liquid discharge liquid; a second passage of liquid flow having a heating element to generate bubbles in liquid; and a movable separating film that substantially and mutually separates the aforementioned first liquid flow passage and the second aforementioned liquid flow passage, all the time, comprising the steps of: forming a sacrificial layer in a position that it will be the second passage of liquid flow mentioned above in a panel of elements where the aforementioned heating element is formed; forming adhesives covering the aforementioned sacrificial layer in the upper part of the aforementioned element board where the aforementioned sacrificial layer is formed; forming the aforementioned movable separation film on top of the aforementioned adhesives; performing a chemical attack from the back of the aforementioned element board and forming a through hole in the aforementioned board of elements that allows the aforementioned sacrificial layer to be a chemical etch blocking layer; removing the aforementioned sacrificial layer through the through-hole previously mentioned; and removing the aforementioned exposed adhesives by removing the aforementioned sacrificial layer, through the aforementioned through-hole and forming the aforementioned second liquid flow passage. In accordance with the aforementioned manufacturing method of a liquid discharge head, the adhesives for adhering the mobile separation film on the element board are precisely shaped while leaving only the fixed part of the mobile separation film. Accordingly, a liquid discharge head is manufactured in which leakage of adhesives or adhesion failure does not occur and the mobile range of the mobile separation film is secured in a highly accurate manner and the dispersion of the discharge characteristics is little. In addition, since the mobile separation film is provided integrally in the element board, no independent handling of the mobile separation film occurs, the risk of damaging the mobile separation film is eliminated. As a result of this, a liquid discharge head having a small dispersion in discharge characteristics, caused by the damage of the mobile separation film and having high reliability is manufactured. In addition, the present invention offers a head cartridge having the aforementioned liquid discharge head, and a liquid discharge device. Furthermore, as mentioned above, the present invention includes an invention based on the recognition of new problems created in the case of using an organic film as a material of the aforementioned separation film and this invention will be understood through an example that it will be described later. The expressions "upstream" and "downstream" which are used in the description of the present invention are used as expressions related to the flow direction of the liquid leaving the outlet through the bubble generation area (or the mobile member) from the liquid supply source or in relation to the address in this configuration. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is an enlarged perspective illustration of a liquid discharge head of a first embodiment of the present invention; Figure 2 is a cross-sectional view along the direction of liquid flow passage of the liquid discharge head illustrated in Figure 1; Figure 3 is a cross-sectional view along a direction of positioning of the heating elements of the liquid discharge head illustrated in Figure 1; Figures 4 (A), 4 (B) and 4 (C) are figures showing the manufacturing step of an upper board that configures the liquid discharge head of a first embodiment of the present invention; Figures 5 (A), 5 (B), 5 (C), 5 (D) and 5 (E) are cross-sectional views along the direction of the liquid flow passage showing the step of manufacturing a liquid. liquid discharge head substrate that configures the liquid discharge head of the first embodiment of the present invention; Figures 6 (A), 6 (B), 6 (C), 6 (D) and 6 (E) are seen in cross section along the direction of placement of the heating elements showing the manufacturing step of the liquid discharge head substrate that configures the liquid discharge head of the first embodiment of the present invention; Figures 7 (A), 7 (B), 7 (C), 7 (D) and 7 (E) are schematic cross-sectional views in the direction of flow passage to describe the state of liquid discharge from the head of liquid discharge of the first embodiment of the present invention in series; Figure 8 is a cross-sectional view along the liquid flow passage direction of the liquid discharge head of a second embodiment of the present invention; Figure 9 is a cross-sectional view along the direction of positioning of the heating elements of the liquid discharge head of the second embodiment of the present invention; Figures 10 (A), 10 (B), 10 (C), 10 (D), 10 (E) and 10 (F) are cross-sectional views along the direction of liquid flow passage showing the step of manufacturing a liquid discharge head substrate that configures the liquid discharge head of the second embodiment of the present invention; Figures 11 (A), 11 (B), 11 (C), 11 (D), 11 (E) and 11 (F) are cross-sectional views along the direction of placement of the heating elements showing the manufacturing step of a liquid discharge head substrate that configures the liquid discharge head of the second embodiment of the present invention; Figure 12 is a cross-sectional view along the liquid flow passage direction of the liquid discharge head of a third embodiment of the present invention; Figure 13 is a cross-sectional view along the direction of positioning of the heating elements of the liquid discharge head of the third embodiment of the present invention; Figures 14 (A), 1 (B), 14 (C), 14 (D), and 14 (E) are cross-sectional views along the direction of liquid flow passage showing the manufacturing step of a liquid discharge head substrate that configures the liquid discharge head of the third embodiment of the present invention; Figures 15 (A), 15 (B), 15 (C), 15 (D) and 15 (E) are seen in cross-section along the direction of placement of the heating elements showing the manufacturing step of a liquid discharge head substrate that configures the liquid discharge head of the third embodiment of the present invention; Figure 16 is an enlarged perspective illustration of a liquid discharge head which is the third embodiment of the present invention; Figure 17 is a cross-sectional view along the liquid flow passage direction of the liquid discharge head illustrated in Figure 16; Figure 18 is a cross-sectional view along the direction of positioning of the heating elements of the liquid discharge head illustrated in Figure 16; Figures 19 (A), 19 (B), 19 (C), 19 (D), 19 (E), 19 (F), 19 (G) and 19 (H) are seen in cross section along the fluid flow passage direction shown by the step of manufacturing a liquid discharge head substrate that configures the liquid discharge head of a fourth embodiment of the present invention; Figures 20 (A), 20 (B), 20 (C), 20 (D), 20 (E), 20 (F), 20 (G) and 20 (H) are seen in cross section along the direction of placement of the heating elements showing the step of manufacturing a liquid discharge head substrate that forms the liquid discharge head of the fourth embodiment of the present invention; Figures 21 (A), 21 (B), 21 (C), 21 (D) and 21 (E) are cross-sectional views in the direction of flow passage to describe the basic discharge pattern to improve the efficiency of discharge by the liquid discharge head of the present invention; Figures 22 (A), 22 (B), 22 (C), 22 (D) and 22 (E) are cross-sectional views in the direction of flow passage to describe the basic discharge pattern to improve efficiency discharge by the liquid discharge head of the present invention;
Figures 23 (A), 23 (B) and 23 (C) are cross-sectional views in the direction of flow passage to describe the moving step of the mobile separation film to improve the efficiency of discharge at the head of discharge of liquid of the present invention; Figure 24 is an enlarged perspective view of a liquid discharge head cartridge to which the present invention can be applied; and Figure 25 is a schematic illustration of a liquid discharge device to which the present invention can be applied. DETAILED DESCRIPTION OF THE PREFERRED MODALITIES The embodiments of the present invention will now be described with reference to the drawings. (First embodiment) The figure is an enlarged perspective illustration of a head of discharge of liquid of a first embodiment of the present invention. In addition, Figure 2 is a cross-sectional view which is made by cutting the liquid discharge head illustrated in Figure 1 along the direction of liquid flow passage, and Figure 3 is a view in cross-section. cross section along the direction of placement of the heating elements of the liquid discharge head illustrated in figure 1. As shown in figure 1 to figure 3, a liquid discharge head of the present embodiment comprises a liquid discharge head substrate 1 in which a plurality of heating elements 2 are provided to respectively provide power to generate bubbles to the liquid, in parallel, an upper board 6 of integral type of liquid flow passage joined in this liquid discharge head substrate 1, and an attached orifice plate 10 covering a front end face 1 (a) of the liquid discharge head substrate 1 and a face of front end 6 (a) of the top board 6. The liquid discharge head substrate 1 is a substance in which an elastic movable separating film 5 is provided in an element board 3 where the heating element 2 is formed, through a seat 4. An opposite part of each heating element 2 of the movable separation film 5 is a movable portion 5 (a) which is not in contact with the seat 4 but is supported with a clearance, on the panel of elements 3 and each, the bubble formation liquid is supplied by the element board 3, the seat 4, and the mobile separation film 5, and a plurality of second liquid flow passages 14 is configured of corresponding to the respective heating elements 2 by using the element board 3 as the bottom wall, the seat 4 as the side wall, and the mobile separation film 5 as the top wall. In the element board 3, a supply orifice 15 is formed for supplying bubble-forming liquid to a second liquid flow passage 14 and a discharge orifice 16 for discharging the bubble-forming liquid supplied to the second flow passage of liquid 14 from the second liquid flow passage 14. Further, in the element board 3, a wiring (not shown) is connected to each heating element 2, and an external contact attenuator 9 is provided to constitute an input terminal of an electrical signal from the outside, and it is possible to separately activate each heating element 2 by applying voltage to a desired heating element 2 through the wiring from the external contact attenuator 9. The board upper 6 is a board for forming a plurality of first passages of liquid flow 12 to which respectively liquid of d is supplied. is charged and corresponding to the respective heating elements 2, and a common liquid chamber 13, and is made by the integral formation of flow passage walls 7 to divide the first respective liquid flow passages 12, and a liquid chamber structure 8 that configures the common liquid chamber 13 to temporarily preserve the discharge liquid to be supplied to the first respective liquid flow passages 12. In the orifice plate 10, several connected outlets 11 are formed. respectively the first respective liquid flow passages 12. The first liquid flow passage 12 and the second liquid flow passage 14 are completely divided by the mobile separation film 5, and the discharge liquid in the first passage of flow of liquid 12 and the liquid of formation of bubbles in the second flow passage of liquid 14 are supplied using different delivery routes, respectively. The discharge liquid is supplied to the common liquid chamber 13 from an ink tank which will be described below or the like, and discharged from the outlets 11 through the first liquid flow passage 12. The forming liquid of bubbles is supplied to the second liquid flow passage 14 from the supply orifice 15 in such a manner that the second liquid flow passage 14 can be filled, and discharged from the discharge orifice 16 accompanied by the production of liquid. bubbles by the action of the heating element 2. In the present embodiment, a supply orifice 15 is provided on the upstream side of the heating element 2 in relation to the flow direction of the discharge liquid in the first flow passage of above-mentioned liquid 12, and the discharge orifice 16 is provided on the downstream side of the heating element 2. Accordingly, the bubble-forming liquid it flows in the same direction as the flow direction of the liquid discharges into the first liquid flow passage 12 as shown by the arrow in Figure 2, and travels or circulates using a liquid motion path-not illustrated. In the following, the shape of a moving separation film 5 will be described in detail with reference to Fig. 2 and Fig. 3. The movable separation film 5 is joined on the upper part of the seat 4, and the seat 4 has a shape in which wherein an area that configures each of the second liquid flow passages 14 is hollow, and a portion that covers this area is the mobile portion 5 (a). The movable portion 5 (a) has a shape which is as follows: the movable separation film 5 rises towards the first fluid flow passage side 12 from the end portion of the part fixed on the seat 4, and, after this, it is bent to return on the board side of elements 3, and in this way, the area opposite the heating element 2 is convex towards the heating element 2, and the peripheral portion thereof, i.e. the area in the part fixed on the seat 4 and the area opposite the heating element 2 has a convex shape towards the first flow passage side of liquid 12. In the second flow passage of liquid 14, the area between the part opposite the heating element 2 of the mobile separation film 5 and the heating element 2 is called a bubble generation area. Next, the method of manufacturing a liquid discharge head of the present embodiment will be described. First, the method of manufacturing an upper board 6 will be briefly described with reference to figures 4 (A) to 4 (C). As shown in Figure 4 (A), first, a film of SI02 22 with a thickness of about 1 cm is formed by thermal oxidation on both sides of a silicon wafer (Si board) 21, and thereafter, the part that will become the aforementioned common liquid chamber is shaped by the use of a well-known method such as, for example, photolithography. Then, on this, a SiN 23 film with a thickness of approximately 30μm is formed to make a flow passage wall by the Microwave CVD method (hereinafter referred to as the μW-CVD method). HereAs a gas used in the formation of a SiN 23 film by means of the μW-CVD method, a mixed gas of monosilane (SiH), nitrogen (N2), argon (AR) is used. It is also possible to combine disilane (Si2H6), ammonia (NH3) or the like in addition to the above substances as a component of the gas that can be employed. In the present embodiment, the SiN 23 film was formed under a high vacuum of 5 [mTorr] by supplying a microwave (2.45 GHz) with a power of 1.5 [kW] and a flow rate of SiH / N2 / Ar = 100/100/40 [sccm]. In addition, it is also to form the SiN 23 film through a CVD method using the RF energy source or the like, and another relationship between components. Then, as shown in Figure 4, the part that will be the flow passage wall 7 of the SiN 23 film and the part that will be the common liquid chamber were shaped by the use of a well-known method such as example, photolithography, and were recorded to have the structure of channels through the use of a chemical etching device using a dielectric bonding plasma. After this, as shown in Figure 4 (C), by the use of tetramethylammonium hydroxide (below TMAH), the open part of the common liquid chamber of the silicon wafer 21 is subjected to chemical attack from silicon plate penetration, so that a top board 6 integrated with the flow passage wall 7 and the liquid chamber structure 8 can be manufactured. Next, with reference to FIGS. 5 (A) to 5 ( E) and with reference to Figures 6 (A) to 6 (E), the method of manufacturing the liquid discharge head substrate integrated with the mobile separation film will be described. In the following description, steps "a" to "e" correspond to figures 5 (A) to 5 (E) and to figures 6 (A) to 6 (E), respectively. Step a: To the total of the upper part of the element board 3 where the heating element two and an external contact attenuator 9 (see Figure 1) or the like are formed, a TiW film with a thickness of about 5 is formed, 000 Á by using 1 electronic deposit method as a protective layer to protect the external contact attenuator 9. Then, in the TiW film, a SiN film with a thickness of approximately 10 μm is formed by the CVD method of plasma, and the area except for the part that will be the second liquid flow passage of this SiN film and the area where the external contact attenuator 9 is formed is formed by the use of a well-known method, such as photolithography, and the seat 4 is formed. The board of elements 3 is made of silicon and the heating element 2 is formed on this silicon by the use of the semiconductor manufacturing process.
Since the thickness of the SiN film determines the height of the second liquid flow passage, it is preferable to have a value such that the effect of the movable portion can be greater in terms of the total balance of the flow passage in accordance with the mode of liquid supply to the second flow passage of liquid or the like. In addition, SiN is generally used for the semiconductor process, and is excellent in terms of alkali resistance and chemical stability. Step b: On the upper part of the panel of elements 3 where the seat 4 is formed, an Al film of a thickness of approximately 5μm is formed by the electronic deposit method, and the area except the part that will be the second passage of The liquid flow and the peripheral portion thereof is formed by the use of a well-known method, for example photolithography and a sacrificial layer 32 is formed. The sacrificial layer 32 is formed in such a way as to have a convex shape in the state in which the peripheral portion thereof reaches the seat 4. Step c: In the upper part of the seat 4 and the sacrificial layer 32, a silane coupling agent is applied to be adhesive in a state in shape of sheet. Step d:
On top of the adhesive 35, a poly-para-xylylene film is formed to be the mobile separation film 5 with a thickness of approximately 2um, by means of the CVD method. The fundamental structure, method of manufacture, polymerization method or the like of poly-para-xylylene employed in the present invention appears in U.S. Patent No. 3379803, in Japanese Patent Publication No. 44-21353, in Japanese Patent Publication Number 52. -37479 or similar. The coating obtained is excellent in terms of thermal resistance, and is excellent in terms of resistance to chemical agents such as acids or alkalis that cover various types of organic solvents and is excellent in barrier properties of various types of substrates, and is excellent in terms of expansion and contraction. Furthermore, since the formation of the coating is carried out by means of the vapor phase polymerization method, the conformation coating (uniform) is also possible in details and in the case of a part with a complex shape. Step e: After the formation of a Si02 film with a film thickness of -about 1 μm on the back of the element board 3 by thermal oxidation, the opening portions of the supply port 15 and the discharge orifice 16 are formed by the use of a well-known method such as for example photolithography. Then, the cylindrical supply orifice 15 and the discharge orifice 16 with a diameter of 10 to 50 μm are formed copper the back of the board of elements 3 by chemical attack of a channel structure by the use of a chemical etching device using the plasma of union-- dielectric. At this time, since the sacrificial layer 32 acts as a chemical attack blocking barrier, the mobile separation film is not recorded. After this, the sacrificial layer 32 is removed by the use of a mixture of phosphoric acid, acetic acid, and hydrochloric acid, and in addition, the adhesive 35 is removed in such a way that the second liquid flow passage can be formed. When the adhesive 35 is removed, the feel 4 acts as a solvent mask, and the solvent acts on the part where the sacrificial layer 32 is removed and the adhesive exposed. As a result of this, the solvent does not act on the area between the seat 4 and the movable separation film 5, and therefore the adhesive 35 remains only in the area that will be the portion fixed on the seat 4 of the the mobile separation film 5, and the contact area-with-the portion 5 (a) of the mobile separation film 5 is safely removed. That is to say, through this step in the adhesive 36, an area in contact with the mobile portion 5 (a) of the mobile preparation is formed. Accordingly, in the mobile separation film 5, only the part that will be the fixed portion is fixed on the seat 4 through the adhesive 35, and this does not occur for the adhesive 35 that remains in the mobile portion 5 (a). Furthermore, since the movable separation film 5 is fixed on the seat 4 through the adhesive 35, the fixing force of the movable separation film 5 is stronger than the fixing force in the case of a direct fixing of the movable separation film on seat 4. Accordingly, the fixed portion of the movable separation film 5 is securely fixed on the seat 4, and as a result the action of the movable portion 5 (a) which will be described below is carried out in a stable manner in such a way that the discharge properties. In the case of the fixing of the mobile separation film 5 which forms the second flow passage of the liquid 14 by adhesives, when the leakage of adhesives or adhesion failure occurs, the action of the mobile separation film 5 that is will describe later becomes unstable. Especially when a dispersion occurs the form of permanence of adhesives, a dispersion occurs in the mobile range of the mobile separation film 5, and as a result, a dispersion occurs in the discharge properties such as, for example, the discharge amount. Accordingly, in accordance with the present invention, after the formation of the mobile separation film 5 on the adhesive 5, this adhesive 35 is removed from the back side (second flow side of liquid flow) of the mobile separation film. 5 so that only the part unnecessary for the adhesion of the mobile separation film 5 can be eliminated and shaped, and consequently the mobile range of the mobile separation film 5 can be secured with high precision. In this way, the dispersion of the discharge properties becomes small. Especially, by using a silane coupling agent as adhesives, the durability of the adhesion part is further increased. There are some cases in which the adhesive 35 at the end portion of the attachment area of the moving overcoming film 5 and seat 4 is slightly removed, but even when it is removed, only the coated adhesive 35 is removed with a thickness of one level (approximately 5000A), and consequently the width (W2 in FIG. 3) of the joining area is practically unaffected. The silane coupling agent employed in the present embodiment is A = 187 (manufactured by Nihon Única Corporation). A-187 combines a part that has a reactivity with an inorganic material and a part (epoxides) that has a lot of reactivity with an organic matter in a molecule and that has an excellent property as an adhesive of an organic matter and an inorganic matter. In accordance with the present embodiment, by allowing the second liquid flow passage 14 to be the path of liquid movement and by providing a plurality of through holes of supply ports 15 and discharge orifices 16 in the element board 3, it can be promoting the elimination of sacrificial layer 32 and adhesive 35. As mentioned above, in accordance with the method of manufacturing a liquid discharge head substrate 1 integrated with the mobile separation film 5, since no handling occurs independent of an extremely thin mobile separation film 5 with a thickness of approximately 2um, the complication of a film fixing device and the risk of damaging the film when the film is fixed can be avoided. Accordingly, dispersions in terms of the discharge properties caused by the damage of the mobile separation film 5 decrease, and a liquid discharge head with high reliability can be obtained. further, since the mobile separation film 5 is provided by integration with the element board 3 having the heating element 2, the positioning on the heating element 2 of the mobile portion 5 (a) is carried out in a more efficient manner. It is necessary in such a way that the dispersion in terms of discharge properties depending on the batch of products or the like can be limited. In addition, since the second liquid flow passage 14 is formed by using the semiconductor manufacturing process, it is possible to narrow the gap between flow passages from 10 to 20um, and a high nozzle density can be easily obtained. Next, the connection between the upper board 6 and the liquid discharge head substrate 1 will be described. In the present embodiment, the upper board 6 and the liquid discharge head substrate 1 are fixed by the pressure of the upper board 6 alone or by mutual pressure using a spring not illustrated. At this time, the flow passage wall 7 forming the first liquid flow passage 12 is adhered to the mobile separation film 5 made of poly-para-xylylene as an organic resin film provided on the top of the side wall of the corresponding second liquid flow passage 14 and accordingly, the seal performance of the first mutually adjacent liquid flow passages 12 is improved. In the case of the present embodiment as shown in the cross-sectional view of Figure 3, the width W2 of the attachment area of the mobile separation film 5 by the "adhesive 35 on the seat 40 forming the second passage of liquid flow 14 is wider than the width Wl of the contact area with the movable separating film 5 of the flow passage wall 7 which forms the second liquid flow passage 12 of the upper board 6. Therefore, the position from the end portion 5 (b) of the contact area with the flow passage wall 7 of the movable separation film 5 is displaced from the position of part 5 (c) (end portion of the attachment area) which will be the fixed end of the portion 5 (a) of the movable separation film 5, and consequently, it is possible to provide a movable separation film 5 with excellent durability.It is especially preferable from the perspective of durability to employ poly-para -xyxylene, material of the mobile separation film 5. By eliminating the intermediate part of the mobile separation film 5 (poly-para-xylylene film) that exists in the joining portion on the upper board 6 of the head substrate 1 liquid discharge in the form of a modality to be described below, it is possible to carry out the union between the liquid discharge head substrate and the upper board 6 by joining at low temperature (normal temperature) using surface activation (a then known simply as binding at normal temperature). At this time, the normal temperature binding device employed comprises two vacuum chambers of a preparation chamber and a pressure welding chamber, and the degree of vacuum is 1 to 10 [Pa]. Then in the preparation chamber, the alignment positions for the positioning of the parts for attaching the liquid discharge head substrate 1 and the upper board 6 are performed in a set state by the use of image processing. After this, while they retain their state, they are transferred to the pressure welding chamber, and the energy particles are radiated onto the surface of the SiN film of the part to be joined by the use of the high-speed electronic beam. of chair field type. After activation of the surface by this radiation the liquid discharge head substrate 1 and the upper board 6 are joined. At this time, in order to increase the resistance, the heating can be carried out at a temperature of 200 or less degrees or pressurization can be carried out. As the elimination area of poly-para-xylylene, the area to be joined on the top board 6 is sufficient in the case of a low density of nozzle lines, but in the case of a high density nozzle line arrangement, it is preferable to carry out the elimination with a clearance of nozzles. about 5 to 10um in addition to the area to be joined on top board 6 from the perspective of precision when the top board 6 and the liquid discharge head substrate 1 are adhered (or joined together). Also, as the joining method above, it is also possible to employ a method in which a glass of water (sodium silicate) of a thin film (3000A) is coated on the attachment part on the liquid discharge head substrate 1 and after forming , it is heated to a temperature of approximately 100 ° for the bonding on the upper board 6, or a method in which after the coating of adhesives either on the liquid discharge head substrate 1 or With the upper board 6 through the use of a transfer method or the like, the joint is carried out by heating and applying pressure. After the adhesion or bonding of the liquid discharge head substrate 1 and upper board 6, an orifice plate 10 is attached in such a way that a liquid discharge head can be achieved. The orifice plate 10 is also made of a material of the silicon family, and, for example, is formed by cutting a silicon board where outlets 11 of a thickness of about 10 to 150 μm are formed. The orifice plate 10 is not always necessary for the constitution of the present invention, and it is also possible to make a top board with outlets in such a way that instead of providing a plate of holes 10, a wall with a size thickness is left of the orifice plate 10 on the tip face of the upper board 10 when the flow passage wall 7 is formed in the upper board 6, and the outlets 11 are formed in this part. Next, the discharge of liquid in a liquid discharge head of the present embodiment will be described with reference to FIGS. 7 (A) to 7 (E). Figures 7 (A) to 7 (E) are schematic cross-sectional views in the direction of flow passage to describe the liquid discharge condition of the liquid discharge head illustrated in Figure 1 to Figure 3 in the form of the time series. In Figures 7 (A) to 7 (E), the adhesive 35 (see Figure 2 or similar) is omitted to fix the movable preparation film 5 on the seat 4. In Figures 7 (A) to 7 (E) , the first liquid flow passage 12 connected directly to the outlet 11 is filled with the discharge liquid supplied from a common liquid chamber 13, and in addition, the second liquid flow passage 14 having the generation area of bubbles is filled with the bubble generation liquid whose bubbles receive thermal energy through the heating element 2. In the initial state illustrated in Figure 7 (A), the discharge liquid in the first liquid flow passage 12 it is pulled towards the vicinity of exit 11 by capillary force. In the present embodiment, the outlet 11 is placed on the downstream side in relation to the direction of flow of the liquid in the first passage of liquid flow 12 relative to the projection area towards the first passage of liquid flow 12 of the element 2. The bubbling liquid flows and moves in the direction illustrated by the arrow in the second liquid flow passage 14 in accordance with the above. In this state, when the thermal energy is delivered to the heating element 2, the heating element 2 is rapidly heated, and the bubble-forming liquid is heated to form bubbles by the surface in contact with the liquid forming bubbles in the bubble generation area (Figure 7 (B)). The bubble 17 created by this heating and bubble formation is a bubble based on a film boiling phenomenon in accordance with that described with the North American patent number 4, 723,129, and is created in the total area of the surface of the heating element 2 accompanied with an extremely high pressure at the same time, the pressure generated at this moment is transmitted through the liquid forming bubbles in the second flow passage of liquid 14 in the form of a pressure wave, and acts on the movable separation film 5, and consequently, the movable portion 5 (a) of the movable separation film 5 is displaced, and the discharge of the discharge liquid into the first passage of liquid flow 12 begins. When the bubble 17 created on the entire surface of the heating element 2 grows rapidly, it becomes a film type (FIG. 7 (C)). The expansion of the bubble 17 by an extremely high pressure at the beginning of the generation further displaces the moving portion 5 (a) and, consequently, the discharge of the discharge liquid into the first liquid flow passage 12 from the outlet 11 advances. After this, when the bubble 17 further grows, the displacement of the mobile portion 5 (a) in the (figure 7 (D)) increases, and after that, when the bubble is destroyed, the mobile portion 5 (a ) is also displaced to return to the initial state illustrated in Figure 7 (A) by restoring the force itself (Figure 7 (E)). As mentioned above, in the liquid discharge head of the present embodiment, the movable separation film 5 is supported on the element board 3 by the seat 4, and the movable portion 5 (a) thereof is convex at relationship with the second flow side of liquid flow 14 and faces the heating element 2. Accordingly, since the movable portion 5 (a) is arranged near the heating element 2, the pressure based on the production of the bubble 17 acts on mobile portion 5 (a) more efficiently. Accordingly, even if the pressure accompanied by the occurrence of the bubble 17 is transmitted to the discharge liquid through the mobile separation film 5, the discharge liquid can be displaced with a high discharge efficiency. Further, since the movable portion 5 (a) is projected in advance towards the second liquid flow passage side 14, the amount of displacement when the movable portion 5 (a) is shifted to guide the pressure transmission direction of the bubble 17 towards the outlet direction is increased by the pressure based on the production of the bubble 17, and this also contributes greatly to the improvement of the discharge efficiency of the discharge liquid. As for the amount of displacement of this movable portion 5 (a), in the present embodiment, the movable separation film 5 is not joined on the end portion on the heating element side 2 of the seat 4, and, for Consequently, the structure is made in such a way that the area of the movable portion 5 (a) can be enlarged and the displacement area of the movable portion 5 (a) can be further increased. Further, since the movable portion 5 (a) of the movable separating film 5 has a shape such that the peripheral portion can be convex relative to the side of the first liquid flow passage 12, at least there are 2 pieces of portions. bent between the attachment portion with the seat 4 of the movable separation film 5 and the area opposite the heating element 2. Accordingly, when the movable portion 5 (a) of the movable separation film 5 is displaced, the force applied on the joint portion on the seat 4 can be decreased or eliminated and the durability of the joint portion is improved. As a result of this, as mentioned above, the mobile separation film 5 is fixed on the seat 4 through the adhesive 35, and in addition to this, by combining the improvement of the assembly precision in manufacturing, it is possible to causing the movable portion 5 (a) of the movable separation film 5 and the fixed portion to function safely as the movable portion and the fixed portion, respectively, in such a way that an extremely fine and stable output image can be obtained. In addition to this, in the present embodiment, since the upper board 6 is made of a material containing a silicon element, the heat radiation efficiency of the head is improved compared to what happens in the case in which it is used. makes the top board of resin or similar. In addition, by forming the flow passage wall 7 which configures the first liquid flow passage 12 from SiN, the ink resistance is further raised. By means of such an additional structure, the prior effect of the present method of stably obtaining a very fine output image becomes excellent in a synergistic manner. (Second embodiment) Figure 8 and Figure 9 are cross-sectional views of a liquid discharge head which is a second embodiment of the present invention, and Figure 8 shows a cross-sectional view along the direction of liquid flow passage and figure 9 shows a cross-sectional view along the direction of placement of heating elements. The liquid discharge head of the present embodiment also has the same basic constitution as the liquid discharge head of the first embodiment. That is, in a panel of elements 103 where a plurality of heating elements 102 are provided in parallel, a seat 104 is provided to support a movable separation film 105, and in this seat 104, a movable separation film 105 is adhered. through an adhesive 135, such that a discharge head substrate having a plurality of second liquid flow passages 114 corresponding to the heating elements 102 can be configured. Then, over this, a board is attached upper 106 where several flow passage walls 107 are integrally provided between two respective heating elements 102, so that first liquid flow passages 112 corresponding to the second liquid flow passages 114. can be configured. an orifice plate 110 that covers the front of the liquid discharge head substrate and the front of the top board is attached. or 106. In the orifice plate 110, several outlets 111 respectively connected to the first respective liquid flow passages 112 are formed. The mobile separation film 105 which completely separates the first liquid flow passages 112 and the second liquid flow passages 114 is formed in a manner similar to the first embodiment, and the mobile portion 105 (a) opposes the element. of heating 102 is convex to the second liquid flow passage side 114. However, the amount of projection greater than that of the first embodiment, and the distance between the heating element 103 and the movable portion 105 (a) It is greater than in the first modality. Next, the method of manufacturing a liquid discharge head of the present embodiment will be described. The liquid discharge head of the present embodiment produces in a manner similar to the first embodiment in such a way that where the upper board 106 is attached on the liquid discharge head substrate, the orifice plate 110 is attached. that the manufacturing method of the upper board 106 and the orifice plate 110 is similar to that of the first embodiment, its description will be omitted, and the method of manufacturing the liquid discharge head substrate will be described below with reference to the Figures 10 (A) to 10 (F) and Figures 11 (A) to 11 (F). In the following description, steps "a" to "f" correspond to figures 10 (A) to 10 (F) and to figures 11 (A) to 11 (F), respectively. Step a: Throughout the entire top of the element board 103, where the heating element 102 and an external contact attenuator (not shown) or the like are formed, a TiW film with a film thickness of about 5000A is formed by using the electronic deposit method as a protective layer to protect an external contact attenuator. Then, in the TiW film, a SiN film with a thickness of approximately 10 μm is formed by the CVD plasma method, and the area except for the part that will be the second liquid flow passage of this SiN film and the area where the external contact attenuator is formed is formed by the use of a well-known method, such as for example photolithography, in such a way that the seat 107 can be formed. The element board 103 is made of silicon, and the heating element 102 is formed by the use of the silicon semiconductor manufacturing process. Step b: An Al film with a thickness of approximately 5μm is integrated into a part that will be the second flow passage of liquid, and a sacrificial first layer 131 is formed. Step c: In the upper part of the seat 104 and the first sacrificial layer 131, an Al film with a thickness of approximately 5μm is formed by the electronic deposit method, and the area except the part that will be the second liquid flow passage and the peripheral portion thereof is formed by the use of a well-known method such as for example photolithography to form a second sacrificial layer 132. At this time, a level difference between the first sacrificial layer 131 and the seat 104 is created, and the height of the seat 104 is greater that the height of the first sacrificial layer 131, and consequently, the second sacrificial layer 132 is formed convexly in the state in which the peripheral portion thereof is in contact with the I feel 104. Step b: In the upper part of the seat 104 and the second sacrificial layer 132, a silane coupling agent is applied which will be an adhesive 135. Step e: In the upper part of the adhesive layer 135, it is formed a poly-para-xylylene film to be a mobile separation film 105 with a film thickness of approximately 2 μm, by the CVD method. Step f: After the formation of a Si02 film, with a film thickness of about 1 μm at the rear of the element board 103 by thermal oxidation, the opening portions of the supply orifice and the discharge orifice are formed by the use of a well-known method such as for example photolithography. Then, a cylindrical supply orifice and a discharge orifice with a diameter of 10 to 50μ are formed towards the rear of the element board 103 by the chemical attack of a channel structure by the use of a chemical etching device that employs plasma of dielectric union. At this time, since the first sacrificial layer 131 acts as a chemical etch blocking layer, the mobile separation film 105 is not recorded. After this, the first sacrificial layer 131 and the second sacrificial layer 132 are removed by the use of a mixture of phosphate, acetic acid, and hydrochloric acid, and in addition, the adhesive 135 is removed in such a way that it can be formed the second liquid flow passage 114. Accordingly, similarly to the first embodiment, the adhesive 135 remains only in the fixed part of the movable separation film 104 on the seat 104, and does not remain in the movable portion 105 ( to) . As mentioned above, a liquid head discharge substrate is obtained where a movable separation film 105 is formed with a distance from the surface of the element board 103 to the movable portion 105 (a) of about 10Om. In the liquid discharge head employing a liquid discharge head substrate of this type, similar to the first embodiment, no independent handling of the mobile separation film 105 occurs, and consequently, a defect related to the fixing of a film can be prevented, and in addition, there is an effect of improving the discharge efficiency and of being able to stably obtain an extremely fine output image due to the shape of the movable portion 105 (a ) of the mobile separation film 105. Furthermore, in the liquid discharge head of the present embodiment, when the mobile separation film 105 is formed, the sacrificial layer is made in such a way that it has a two-layer structure, and consequently, it is possible to have a certain distance between the movable portion 105 (a) and the heating element 102 while the movable separation film 105 is made, so that the movable portion 105 (a) thereof can be convex to the second liquid flow passage 114. Accordingly, the influence of the heat on the movable portion 105 (a) decreases in the course of bubble production when the liquid is discharged for the destruction of bubbles. That is, when a material of the mobile separation film 105 is selected the limit in terms of thermal resistance is released, and consequently, the range of selection of a material for the mobile separation film 105 can be extended. In the present embodiment, the distance between the movable portion 104 (a) and the heating element 102 is enlarged by supplying a plurality of sacrificial layers, but it is also possible to extend the distance between the movable portion 105 (a) and the heating element. 102 by a single sacrificial layer with a large film thickness. However, in the case of a shape of the peripheral portion of the movable portion 105 (a) convex relative to the first liquid flow passage side 112 as in the present embodiment, the height of the peripheral portion of the portion mobile 105 (a) also becomes higher when the film thickness of the sacrificial layer is increased. In the case where the distance between the upper board 106 and the board of elements 103 is constant, the height of the peripheral portion of the moving portion 105 (a) becomes larger a disorder can easily occur in the liquid flow in the first liquid flow passage 112, and there is a tendency for the discharge of liquid or the filling (liquid complementation from the upstream side in the first liquid flow passage 112) is unstable. Accordingly, in the case where the movable portion 105 (a) has the shape shown in the present embodiment, it is preferable to form the sacrificial layer separately through a plurality of operations in such a manner that the height of the peripheral portion of the moving portion 105 (a) is not too high. (Third embodiment) Fig. 12 and Fig. 13 are cross-sectional views of a liquid discharge head according to a third embodiment of the present invention, and Fig. 12 shows a cross-sectional view along the direction of liquid flow passage, and Figure 13 shows a cross-sectional view along the direction of placement of the heating elements. The liquid discharge head of the present embodiment also has the same basic constitution as in the first embodiment. That is, in a panel of elements 203 where several heating elements 202 are located in parallel, a seat 204 is provided, and in this seat 204, a movable separation film 205 is formed through an adhesive 235, and is configured a liquid discharge head substrate having a plurality of second liquid flow passages 214 corresponding to heating elements 202. Then, above this, an upper board 206 is joined where several flow passage walls 207 are provided. placed between the respective heating elements 202, and the first liquid flow passages 212 corresponding to the second liquid flow passages 214 are configured., an orifice plate 210 is connected which covers the front part of the liquid discharge head substrate and the front of the upper board 206. In the orifice plate 210, several outlets 211 are formed connected respectively to the first flow passages of liquid 212 respectively. Here, the mobile separation film 205 which completely separates the first liquid flow passages 212 and the second liquid flow passages 214 is formed as a flat film, and the distance between the surface of the element board 203 and the movable portion 205 (a) is equal to the height of the seat 204. Next, the method of manufacturing a liquid discharge head of the present embodiment will be described. The liquid discharge head of the present embodiment is also similarly manufactured to the first embodiment in such a way that the upper board 206 is attached to the liquid discharge head substrate and in addition, the orifice plate 210 is attached here, since the method of manufacturing top board 206 and orifice plate 210 is similar to that of the first embodiment, the description thereof will be omitted, and the method of manufacturing the liquid discharge head substrate will be described below with reference to Figures 14 (A) to 14 (E) and Figures 15 (A) to 15 (E). In the following description, steps "A? correspond to Figures 14 (A) to 14 (E) and Figures 15 (A) to 15 (E), respectively Step A: Over the entire top of the element board 203 where the heating element is formed 202 and an external contact attenuator (not shown) or the like, a TiW film with a film thickness of about 5000 A is formed by using the electronic deposit method as a protective layer to protect the external contact attenuator. , it is formed by the CVD plasma method, on the TiW film, a SiN film with a thickness of approximately lOμn, and the area, except for the part that will be the second liquid flow passage of this SiN film and the The area where the external contact attenuator is formed is formed by the use of a well known method such as for example photolithography, in such a way that the seat 204 can be formed.The element board 203 is made of silicon, and the element of Heating 202 is formed by using the silicon semiconductor manufacturing process. Step b: An Al film with a thickness of about 10 μm is integrated into the part that will be the second flow passage of liquid, and a sacrificial layer 231 is formed. Then, the part that will be the second flow passage is totally integrated, and the surface of the seat 203 and the surface of the sacrificial layer 231 become the same flat surface. Step c: On the upper part of the seat 204 and the sacrificial layer 231, a silane coupling agent is applied in the form of an adhesive 235. Step d: At the top of the adhesive 235, a polyvinylchloride film is formed. para-xylylene to be the mobile separation film 205 with a film thickness of approximately 2μm, through the CVD method. Step e: After the formation of a Si02 film with a film thickness of about 1 μm on the back of the element board 203 by thermal oxidation, the opening portions of the supply orifice and the discharge orifice are formed by the use of a well-known method such as for example photolithography. Then, the cylindrical supply orifice and the discharge orifice with a diameter of 10 to 50 μm are formed on the back of the element board 203 by chemical attack of the channel structure by the use of a chemical etching device employing the plasma of dielectric union. At this time, since the sacrificial layer 231 acts as a chemical etch blocking layer, the mobile separation film 205 is not recorded. After that, the sacrificial layer 231 is removed by the use of a mixture of phosphate, acetic acid and hydrochloric acid, and in addition, the adhesive 235 is removed in such a way that the second liquid flow passage 214 can be formed. similarly to the first embodiment, the adhesive 235 is left only in the fixed part of the mobile separation film 205 to the seat 204, and is not left in the moving part 205 (a). As mentioned above, a liquid discharge head substrate having a flat movable separation film 205 supported by the seat 204 is obtained. In the present embodiment, since the movable separation film 205 has a simple shape, the step of formation of the sacrificial layer 231 which determines the shape of the mobile separation film 205 is simplified as a result, it is possible to easily fabricate a liquid discharge head substrate integrated with the mobile separation film 205. This is effective, especially in the case in which the material of the mobile separation film 205 can be easily affected by the temperature, and it is necessary to extend the heating distance 202. (Fourth embodiment) Figure 16 is an enlarged perspective illustration in a head of liquid discharge which is a fourth embodiment of the present invention. In addition, Figure 17 is a cross-sectional view of the liquid discharge head illustrated in Figure 16 cut along the liquid flow passage direction, and Figure 18 is a cross-sectional view along the length of the liquid flow passage. of the direction of placement of the heating elements of the liquid discharge head illustrated in Figure 16. As shown in Figures 16 to 18, similarly to the first embodiment, the liquid discharge head of the present embodiment also comprises a liquid discharge head substrate 301, an upper board 306, and an orifice plate 310. The liquid discharge head substrate 301 has an element board 303 where a plurality of heating elements 302 are provided. to provide energy respectively for the creation of bubbles to the liquid and to the seat 304 provided in the upper part thereof through the adhesive 335, a plurality of film the mutually independent individual spacing elements 305 corresponding to the respective heating elements 302 are supported in opposite manner to the respective heating elements with a clearance, respectively. Accordingly, second liquid flow passages 314 corresponding to the respective heating elements 302 are formed in the liquid discharge head substrate 301. The shape of the part except for the connection portion with the seat 304 of the Separation film 305 is similar to that of the first mode. In addition, in the element board 303, similar to the first embodiment, a supply orifice is formed to supply bubble-forming liquid to the second liquid flow passage 314 and a discharge orifice to discharge the liquid forming liquid. bubbles supplied to the second liquid flow passage 314 from the second liquid flow passage 314. Further, in the liquid discharge head substrate 301 of the present embodiment, on the upper part of the seat 304, walls of the liquid flow are formed. flow passage 307 which form a plurality of first liquid flow passages 312 corresponding to the second passages of liquid flow 314 and a liquid chamber structure 308 which forms a common liquid chamber 313, in an integral manner. Thus, since the flow passage walls 307 and the liquid chamber structure 308 are provided in the liquid discharge head substrate 301, the upper board 306 is formed in the form of a plate-like member where it is formed the opening of the common liquid chamber 313. As for the other points such as for example the point of completely separating the first liquid flow passage 312 and the second liquid flow passage 314 by the single separation film 305, the point of providing a plurality of outlet 311 connected to the first respective liquid flow passages 312 in the orifice plate, or the point of providing an external contact attenuator or similar to the element board 303, the present embodiment is similar to the first modality. Next, the method of manufacturing a liquid discharge head of the present embodiment will be described. First, the top board 306 can be made in a manner similar to the first embodiment such that a silicon wafer is employed and by forming the common liquid chamber opening 313 on said wafer by etching or the like. In addition, the occupation plate 310 can also be processed in a manner similar to the first embodiment. Next, with reference to Figures 19 (A) to 19 (H) and with reference to Figures 20 (A) to 20 (H), the method of manufacturing a liquid discharge head substrate will be described. Thus, in the following description, steps "a" to "h" correspond to figures 19 (A) to 19 (H) and to figures 20 (A) to 20 (H). Step a: On the entire upper part of the element board 303 where the heating element 302 and the external contact attenuator or the like are formed, a TiW film with a film thickness of about 5,000 A is formed by the use of the electronic deposit method as a protective layer to protect the external contact attenuator. Then, in the TiW film, a SiN film with a thickness of approximately 10 μm is formed by the CVD plasma method, and the area except for the part which will be the second flow passage of liquid of this film of SiN and the area where the external contact attenuator is formed is formed by the use of a well known method, for example photolithography, in such a way that the seat 304 can be formed. In this way, the element board 303 is elaborated of silicon, and the heating element 302 is formed by the use of the silicon semiconductor manufacturing process. Step b: On the upper part of the element board 303 where the seat 304 is formed, an Al film with a thickness of approximately 5μm is formed by the electronic deposit method, and the area except the part that will be the second passage of The liquid flow and the peripheral portion thereof is formed by the use of a well known method such as for example photolithography to form a sacrificial layer 332. Then, the sacrificial layer 332 is formed convexly in the state in which the peripheral portion thereof comes into contact with the seat 302. Step c: On the upper part of the seat 304 and the sacrificial layer 332, a silane coupling agent is applied to make an adhesive 335. Step d: Above the top of the adhesive 335, a poly-para-xylylene film with a film thickness of about 2μm is formed by the CVD method, and is removed by leaving only the parts of the seat 304 on the ca sacrificial pad 332 and around, and several mutually independent individual separation films 305 are formed corresponding to the respective heating elements 302.
Step e: On the element board 303 where the individual separation films are formed, an Al film is formed by the electronic deposit method, and this film is formed by a well-known method such as for example photolithography, and the individual separation film 305, a chemical etch blocking layer 333 is formed when a flow passage wall 307 is formed which will be described later. ~~ Step f: In the element board 303 where the etchant blocking layer 333 is formed a SiN 334 film with a film thickness of approximately 50μm through the μW-CVD method covering the blocking layer of chemical attack 333 and the seat 304. After this, on the upper part of the SiN 334 film, an Al film is formed by the electronic deposit method, and the part which will be the liquid flow passage 308 and the part which will be the structure of the liquid chamber 308 (see FIG. 16), are formed by a well-known method, such as for example photolithography and a mask 335 is formed. Step g: By the laser absolution processing performed by the radiation of inductor laser from the face where the mask 335 is formed to the SiN 334 film, the part that will be the first liquid flow passage of the SiN 334 film and the part that will be the common liquid chamber will be The flow passage wall 307 and the liquid chamber structure 308 are formed, and at this time, since the etchant blocking layer 333 exists at the bottom of the part where the Si film is removed. ? 334, the individual separation film 305 is not eliminated. After this, the chemical etch blocking film and the mask 335 are etched out. The area 307 (a) near the individual separation film 305 of the flow passage wall 307 formed in this manner has a shape dug by the chemical attack protection layer 333 above. Step h: After the formation of a Si02 film with a film thickness of about 1 μm on the back of the element board 303 by thermal oxidation, the opening portions of the supply orifice and the discharge orifice are formed by the use of a well-known method such as for example photolithography. Then, the cylindrical supply orifice and the discharge orifice with a diameter of 10 to 50 μm are formed on the back of the element board 303 by the chemical attack of the channel structure by the use of a chemical etching device that employs the dielectric union plasma. At this time, since the sacrificial layer 332 acts as a protection layer against chemical attack, the individual separation film 305 is not recorded. After this, the sacrificial layer 332 is removed by the use of a mixture of phosphate, acetic acid, and hydrochloric acid, and in addition, the adhesive 335 is removed, so that the second liquid flow passage can be formed. 314. Accordingly, similarly to the first embodiment, the adhesive 335 is left only in the fixed part of the single separation film 305 on the seat 304, and is not left in the movable portion. As mentioned above, a liquid discharge head substrate 301 is obtained integrated with the flow passage walls 307 which configure the first liquid flow passage 312. Thus, since the flow passage walls 307 that make up the first liquid flow passage 312 are provided integrally with the liquid discharge head substrate 301, the positional displacement of the first liquid flow passage 312 relative to the second liquid flow passage 314 does not occur and, consequently, It is possible to provide a liquid discharge head which has a small dispersion in terms of discharge properties and which has high reliability. further, it is possible that the upper board 306 has a simple plate-like shape, and it is possible to position both when the upper board 306 is attached on the liquid discharge head substrate 301, not requiring an accuracy similar to that of the modalities 1 to 3 mentioned above. As a result of this situation, the step regarding the positioning of the upper board 306 and the liquid discharge head substrate 301 can be simplified. As previously mentioned, in the present embodiment, an example of forming an individual separation film 305 with a shape in which the opposite part to the heating element 302 is convex towards the second liquid flow passage 314 by the use of a sacrificial layer of a single layer has been shown, but it is also possible to extend the distance between the individual separation film 305 and the heating element 302 by forming the sacrificial layer separately by a number of times similar operations to the second mode, or else leave the mobile separation film to be a flat mobile separation film as in the third embodiment. In these cases, it is possible to obtain an integral liquid discharge head substrate with the flow passage walls by performing the treatments of step "d" and described later in the present embodiment, after the formation of the film of mobile separation.
Furthermore, in the above respective examples, an adhesive is used when fixing the movable separation film on the seat, but it is also possible to directly fix the movable separation film on the seat in the case where it is not required to Adhesive resistance, or according to the material of the seat. (Other embodiments) as mentioned above, the embodiment of the main portion of the present invention has been described, and other embodiments capable of being applied to the respective embodiments of the present invention and other modified examples of the respective embodiments will be described below. In the following description when there is no specific indication, the application is possible in the respective modalities mentioned above. < Basic principle of discharge of a liquid discharge head to improve liquid discharge efficiency > Next, a basic discharge concept to achieve a higher discharge efficiency, in relation to two examples, will be described in a liquid discharge head employing a mobile separation film such as that of the present invention. Figures 21 (A) to 21 (E) and figures 23 (A) to the figures
23 (C) are figures that describe examples of the discharge method by the aforementioned liquid discharge head, and the outlet is arranged in the area of the end portion of the first liquid flow passage, and on the upstream side (as regards the flow direction of the discharge liquid in the first flow of liquid flow of the outlet) there is a displacement area of the mobile separation film capable of being displaced, which is displaced in accordance with the growth of the bubbles generated. In addition, the second liquid flow passage contains a bubble formation liquid or is filled with the bubble formation liquid (preferably, complementation is possible, and more preferably, the movement of the bubble formation liquid is possible), and has a bubble generation area. In the present example, this bubble generation area is also positioned correspondingly to the upstream area from the outlet side as regards the aforementioned flow direction of the discharge liquid. In addition, the separation film is longer than the electrothermal energy conversion substance that forms the bubble generation area, and has a moving area, and has a fixed portion not illustrated between the upstream side end portion of the electrothermal energy conversion substance and the liquid chamber common to the first liquid flow passage in relation to the aforementioned flow direction, preferably, in the upstream side end portion. Accordingly, the substantial mobile range of the separation film can be understood through Figures 21 (A) to 21 (E) and 23 (A) to 23 (C). The state of the mobile separation film in these figures is a factor representing the total obtained from the elasticity of the mobile separation film itself, thickness, or other additional structures. [First discharge principle] Figures 21 (A) to 21 (E) are cross-sectional views in the direction of flow passage to describe a first discharge method (in the case of having the displacement step of the present invention of the discharge passage half) using the liquid discharge head of the present invention. In this example, as shown in Figures 21 (A) to 21 (E), the first fluid flow passage 703 directly connected to the outlet 711 is filled with the first liquid supplied from the common liquid chamber, and further, the second liquid flow passage 704 having the bubble generation area 707 is filled with the forming liquid which is expanded by supplying thermal energy by use of the heating element 702. Between the first flow passage of liquid 703 and the second passage of liquid flow 704, the movable separation film 705 is provided to mutually separate the first liquid flow passage 7u03 and the second liquid flow passage 704. In addition, the movable separation film 705 and the orifice plate 709 are mutually bonded and fixed and here, liquids in the respective liquid flow passages do not mix. The mobile separation film 705 normally has no direction when it is displaced by the bubbles generated in the bubble generation area 707, or there are some cases where the displacement advances towards the common camera side with a high degree of freedom of movement . In the present application example, attention is paid to this movement of the mobile separation film 705, and a means is provided that acts directly or indirectly on the movable separation film 705 itself to regulate the direction of travel, and of this In this manner, the displacement (movement, expansion or extension or the like) generated by the bubbles of the mobile separation film 705 has been directed towards the exit direction. In the initial state illustrated in Figure 21 (A), the liquid in the first liquid flow passage 703 is attracted near the outlet 711 by capillary force. In the present embodiment, the outlet 711 is positioned on the downstream side in relation to the liquid flow direction of the first liquid flow passage 703 in relation to the projection area toward the first liquid flow passage 703 of the liquid flow element 703. heating 702. In this state, when heat energy is supplied to the heating element 702 (in the present embodiment, a heating resistor with a shape of 40μm x 105μm), the heating element 702 is heated rapidly, and the surface in contact with the second liquid in the hot bubble generating area 707 and expanding the second liquid (Figure 21 (B)). The bubble 706 generated by this heating and this expansion is a bubble based on a film boiling phenomenon in accordance with that described in U.S. Patent No. 4,723,129, and is generated at the same time in the total surface area of the heating element accompanied with extremely high pressure. The elevated pressure at this time is transmitted through the second liquid in the second liquid flow passage 704 as a pressure wave, and acts on the movable separation film 705, and consequently, the movable separation film 705 is displaced, and discharge of the first liquid is initiated in the first liquid flow passage 703. When the bubble 706 created on the entire surface of the heating element 702 grows rapidly, it becomes very thin (FIG. 21 (C)) the expansion of the bubble 706 by an extremely high pressure at the beginning of the generation further displaces the movable separation film 705, and consequently, the discharge of the first liquid in the first liquid flow passage 703 from the outlet 701 proceeds. After this, when the bubble 706 continues to grow, the displacement of the mobile separation film 705 increases (FIG. 21 (D)). Up to the state illustrated in Fig. 21 (D), the mobile separation film 705 continues to expand such that in relation to the central portion 705 (C) of the area opposite the heating element 702 of the mobile separation film 705, the displacement of the upstream side portion 705 (A) and the displacement of the downstream side portion 705 (B) may be approximately equal. After this, when the bubble 706 further grows, the bubble 706 and the mobile separation film 705 continue their displacement, the downstream side portion 705 moves in the direction of the outlet relatively more than the upstream side portion. 705 (A), respectively, and accordingly, the first liquid in the first liquid flow passage 703 is displaced directly in the direction of the outlet 701 (FIG. 21 (E)).
Thus, since there is a step in which the mobile separation film 705 is displaced in the discharge direction on the downstream side to directly move the liquid in the direction of the outlet, the discharge efficiency is improved. Furthermore, the movement of the liquid towards the upstream side is relatively diminished, and this effectively acts upon the filling of the liquid (complementation from the upstream side) in the nozzle, especially in the displacement area of the mobile separation film 705 Further, as illustrated in Figure 21 (D) and Figure 21 (E), in the case in which the mobile separation film 705 itself is also displaced in the direction of the exit as the change of the figure 21 (D) to FIG. 21 (E), the discharge efficiency and filling efficiency can be improved, and meanwhile the transport and movement in the direction of the first liquid outlet of the projection area of the filter element is caused. heating 702 in the first liquid flow passage 703, so that an improvement in the amount of the discharge can be obtained. [Second principle of discharge] Figures 22 (A) to 22 (E) are sectional views in the direction of flow passage to describe a second discharge method (example of having the displacement step of the present invention from the initial stage) by using the liquid discharge head of the present invention. Since the present example also has a constitution basically similar to the constitution in the first discharge principle mentioned above, the description will be carried out using the same reference numerals. In the initial stage illustrated in Figure 22 (A), similarly to Figure 21 (A), the liquid in the first liquid flow passage 713 is attracted near the outlet by capillary force. In the present embodiment, the outlet 711 is on the downstream side relative to the projection area for the first liquid flow passage 713 of the heating element 712. In this state, when thermal energy is delivered to the heating element 702 , the heating element 702 is heated rapidly, and the surface in contact with the second liquid of the bubble generating area 707 heats and expands the second liquid (FIG. 22 (B)). The pressure generated at this time is transmitted through the second liquid in the second liquid flow passage 704 as a pressure wave, and acts on the movable separation film 705, and accordingly, the movable separation film 705 is displaced , and discharge of the first liquid in the first liquid flow passage is initiated. When the bubble 706 created in the total surface of the heating element 702 grows rapidly, it becomes a film type (FIG. 22 (C)). The expansion of the bubble 706 by means of an extremely high pressure at the beginning of the generation further displaces the movable separation film 705 and, consequently, the discharge of the first liquid in the first liquid flow passage 703 from the outlet 711 advances. At this time, as shown in Fig. 22 (C), in the mobile separation film 705, the downstream side portion 715 (B) is displaced relatively more than the upstream side portion 715 (A) in the mobile area from the initial stage. Accordingly, the first liquid in the first liquid flow passage 703 can be moved efficiently to the outlet 711 from the beginning. After this, when the bubble 706 further grows, the displacement of the mobile separation film 705 and the growth of the bubbles are promoted in relation to the state of Figure 22 (C), and consequently, along with this, it increases. also the displacement of the mobile separation film 705 (FIG. 22 (B)). Especially, since the downstream side portion 715 (B) of the movable area is displaced in the direction of the outlet in higher media than the upstream side portion 715 (A) and the central portion 715 (C), the first liquid in the first "liquid flow passage 703 is displaced while accelerating directly in the direction of the outlet and meanwhile the movement of the liquid in the upstream direction is decreased because the displacement of the side portion upstream 715 (A) is lower in all stages, therefore, the discharge requirement, especially the discharge velocity, can be improved, and is also helpful for filling the nozzle liquid and stabilizing the volume of the drop After that, when the bubble 706 continues to grow, the downstream side portion 715 (B) of the mobile separation film 705 and the central portion 715 (C) is displaced and further extended in the direction of the output, and the aforementioned effect, that is, the improvement of discharge efficiency and discharge velocity can be achieved
(Figure 22 (E)). Especially, in the form of the mobile separation film 705 in this case, not only the size shown by the transverse shape but also the displacement and extension in the widthwise direction of the liquid flow passage increases, and consequently , the movement area of the first liquid in the first liquid flow passage 703 in the direction of the outlet is increased, and the discharge efficiency is synergistically improved. Especially, the displacement shape of the mobile separation film 705 at this time is known as a nose shape since it resembles the shape of a human nose. This nose shape includes the shape of [S] in which as shown in Figure 22 (E), point B positioned on the upstream side in the initial state is placed on the downstream side from point A positioned on the downstream side in the initial state, or the way in which it appears in Figure 21 (C), these points A, B exist in the same position [Example of the displacement mode of a mobile separation film] Figures 23 (A) to 23 (C) are cross-sectional views in the direction of flow passage to describe the displacement step of the movable separating film during the discharge action by the liquid discharge head of the present invention . Here, especially, since the description is carried out while intending to be in the moving range in the moving separation film and in the displacement shift, the bubble illustrations, the first fluid flow passage, and the outputs are omit, but in each figure, as a basic configuration, the area near the projection area ~ of the heating element 702 in the second liquid flow passage 704 is the bubble generation area 707, and the second liquid flow passage 704 and the first liquid flow passage 703 are substantially separated by the movable separation film 705 all the time, i.e., through the displacement from the beginning. Further, the outlet is provided on the downstream side by allowing the end portion of the downstream side (line H in the figure) of the heating element 702 to be the limit, and the first liquid supply portion on the side is provided. Upstream. The terms "upstream side" and "downstream side" have the meanings in relation to the direction of liquid flow in the flow passage when viewed from the central part of the mobile range of the mobile separation film. In the step illustrated in Fig. 23 (A), the mobile separation film 705 is displaced in the order of (1), (2) and (3) in the figure from the initial state, and has a step in which the downstream side is displaced to a greater extent than the upstream side, from the beginning, and especially, since there is an action of creating a movement for the displacement of the downstream side to push the first liquid in the first flow passage of 703 liquid in the output direction while the discharge efficiency is raised, you can obtain the improvement of the discharge speed. In Figure 23 (A), the previous mobile range is substantially constant. In the step illustrated in Figure 23 (B), the mobile range of the mobile separation film 705 is displaced or expanded towards the exit side, since the mobile separation film 705 is displaced in the order of (1), (2), and (3) in the figure. In this mode, in the aforementioned moving range, the upstream side is fixed. Here, while the downstream side of the movable separation film 705 is displaced to a greater extent than the upstream side, the growth itself of the bubble can also be achieved in the direction of the exit, and therefore, can still be increased. plus the discharge efficiency. In the step illustrated in Figure 23 (C) in the mobile separation film 705, the upstream side and the downstream side are equally displaced or the upstream side is displaced a little further from the initial state (1) towards the state illustrated by (2) in the figure, but when the bubble grows even more as shown by
(3) to (4) in the figure, the downstream side is displaced to a greater extent than the upstream side. Accordingly, the first liquid in the upper part of the movable area can also be displaced in the direction of the outlet, and the amount of discharge can be increased while the discharge efficiency can be improved. Further, in the step illustrated by (4) in Figure 23 (C), since a certain point U of the mobile separation film 705 is moved to the exit side from a point D positioned on the downstream side thereof. in the initial state, the discharge efficiency is further improved by this part expanded and projected towards the exit side. This shape is known as a nose shape as mentioned above. Liquid discharge methods having such steps as those described above are included in the present invention, but each step illustrated in Figures 23 (A) to 23 (C) is not always independent but a step having the respective components is also included in the present invention. In addition, the step having a nose shape can be introduced not only in the passage illustrated in Figure 23 (C) but also in the steps illustrated in Figure 23 (A) and Figure 23 (B). In addition, the thickness of the mobile separation film in the figure has no special significance in terms of size. < Liquid discharge head cartridge and liquid discharge recording device > Next, a liquid discharge head cartridge will be described where a liquid discharge head according to the above embodiment is mounted and a liquid discharge recording apparatus will be offered with reference to Figures 24 and 25. Figure 24 is a schematic sectional perspective view of a liquid discharge head cartridge including the aforementioned liquid discharge head, and the liquid discharge head cartridge comprises approximately and mainly a liquid discharge head portion and a liquid container 1140. The liquid discharge head portion comprises the aforementioned liquid discharge head 1200, the liquid supply member 1130, an aluminum base plate (support) 1120 or the like. The holder 1120 is a substance for supporting the liquid discharge head 1200 or the like, and on this support 1120, a printed wiring board 1123 connected to the liquid discharge head 1200 is further provided to supply an electrical signal and an attenuator contact 1124 connected to device side to carry out the exchange of electrical signals with the device side. The liquid container 1140 contains a liquid supplied to the liquid discharge head 1200. In the
- External part of the liquid container 1140, a positioning portion 1144 is provided for placing a connecting member that carries out the connection between the liquid discharge head portion and the liquid container 1140, and a fixing shaft 1145 to fix the connection member. The liquid is supplied through the liquid supply routes 1142, 1143 of the liquid container 1140 through a supply route of the connection member to the liquid supply routes 1131, 1132 of the liquid supply member 1130, and is supplied through the liquid supply routes 1133, 1129, 1153 (C) of the respective members to a common liquid chamber of the liquid discharge head 1200. Here, the liquid supply from the liquid container liquid 1140 to the liquid supply member 1130 is carried out by dividing it into two routes, but division is not always necessary. It is also possible to use this liquid container 1140 by filling it with liquid after consumption of the liquid. For this purpose, it is preferable to offer a liquid inlet in the liquid container 1140. In addition, it is also possible that the liquid discharge head portion and the liquid container 1140 are integrated, and it is also possible that they can be divided. Figure 25 shows an approximate configuration of a liquid discharge device where the aforementioned liquid discharge head is mounted. In the current mode, specifically, a description will be offered by using the IJRA ink discharge recording apparatus using ink as the discharge liquid. On the HC carriage of the liquid discharge device, a head cartridge is mounted, to which and from which the liquid container 1400 containing ink and the liquid discharge head portion 2000 can be installed and removed, and displaced back and forth across the width (direction illustrated by arrows A, B) of a recording medium 1700 such as recording paper transferred by a recording medium transfer device. The liquid container and the liquid discharge head portion are configured to be mutually divisible. In FIG. 25, when a pulse signal is supplied from a pulse signal supply device not illustrated to the liquid discharge device in the carriage HC, recording liquid is discharged from the liquid discharge portion. 2000 to the record means 1700 in accordance with this signal. In addition, the liquid discharge device of the present invention comprises a motor 1610 as a power source for driving the recording medium transfer device and the carriage HC, gears 1620, 1630 for transmitting the driving energy from the power source of the vehicle. drive towards the HC car and a 1640 car tree or similar. A material registered with a preferred image can be obtained by discharging liquid onto recording media by the use of this recording apparatus. (Preferred technical perspective of separation film) The present invention has found a preferred condition for the aforementioned separation film, based on the fact that the poly-para-xylylene separation film (then PPX) employed from the first The aforementioned embodiment up to the fourth embodiment can also be applied to another liquid discharge head having a separation film other than the separation film of the present invention. Especially, when examining the physical properties of the aforementioned poly-para-xylylene film, the following novel practical knowledge was found (especially decomposition temperature of an organic film). In the following description, the expression "surface layer of a heating element" is used to express "the surface of a film of the upper layer" in the case in which a protective film is formed to protect the heating element and a cavitation-resistant film on the surface of the element board and the "surface of the heating element" in the case in which no protective film of this type is provided. That is, this expression is used to show the part where the bubble is created by heating the heating element. <; Relationship between mobile separation film of surface layer of heating element > in the case of a normal dye family ink, generally, in boiling of film to form bubbles, the initial temperature of bubble formation is a temperature that can be obtained by a sudden rise in temperature (on the surface layer of the film element). heating, for example, 300 ° C or more, and practically, approximately 350 ° C), and in some cases, the maximum temperature in bubble formation reaches approximately 600 ° C in the surface layer of the heating element. This temperature occurs during a period of the order of microseconds, and does not continue for a long time. Then when the bubbles fall apart, the temperature in the surface layer of the heating element becomes about 180 ° C (practically about 200 ° C). Under these conditions, in case of using a separation film, in some cases, a part where the properties of a separation film were suddenly lowered suddenly occurred, or a broken part was observed. After continuing this, a preferred condition required for a separation film was found. That is, in the case of the formation of a mobile separation film by stacking organic materials by a chemical reaction method in the vapor phase or in the plasma polymerization reaction, it is sufficient that at the temperature of the film of mobile separation, the temperature of thermal decomposition in these reaction steps is greater than the conditional temperature at which the mobile separation film is exposed. Furthermore, even if the temperature of the mobile separation film becomes temporarily higher than the melting point (lower than the temperature of thermal decomposition) of the mobile separation film for a short time of an order of tens of jitter seconds to several minutes , it is unnecessary to consider it. Accordingly, in some cases, the ratio offered between the separation film and the temperature on the surface layer of the aforementioned heating element a. The moment of the download is as follows. The effective conditions in these cases will be offered below. (1) Case of a single discharge action First, it will be considered a case of the discharge of a drop of liquid from the initial state (or a continuous discharge action where the time interval towards the next discharge action is long (for example, tens of milliseconds to several seconds or more)). At this time, during time from the onset of the bubble formation to bubble growth, usually, the mobile separation film is fixed through the second flow passage wall, and is separated from the surface layer of the element. of heating through the liquid (bubble formation liquid) for a specific distance, and therefore, it is unnecessary to directly consider the influence given to the mobile separation film by the temperature of the surface layer of the heating element. When the liquid is discharged from the outlet and the bubble is undone, it is assumed that the mobile separation film approaches or comes into contact with the surface layer of the heating element by cavitation.In this case, after disposing of the bubble the mobile separation film tries to return to the position of the initial state immediately by filling the liquid with f bubble formation or similar and, therefore, it is sufficient to consider instantaneous thermal resistance. Accordingly, when the thermal decomposition temperature of material used for the separation film is greater than the surface layer temperature of the heating element at the moment of disposing of the bubble, the mobile separation film is not decomposed even if the mobile separation film comes into contact with the surface layer of the heating element. (2) Case of a continuous discharge action The following shall be considered a case of a continuous discharge action at a time interval of tens to hundreds of microseconds. When the interval of the discharge action is short like this, it is necessary to consider the possibility that the mobile separation film will adhere on the surface layer of the heating element at the time of the start of the formation of bubbles instead of at the moment of disintegrating the bubble, if the filling of bubble-forming liquid it is carried out in such a manner that the bubble formation liquid of a desired amount can exit in the bubble generation area when required. In this case, when a very small bubble is generated by heating the heating element, the bubble leaves between the moving separation film and the surface layer of the heating element, and therefore, while the bubble continues to grow, it does not occur that the distance between the surface layer of the heating element and the separation film becomes shorter than at the time of the start of the bubble formation. Accordingly, it is sufficient to consider the surface layer temperature of the heating element at the time of the onset of bubble formation, and in addition, the time that the removable separation film is in contact with the surface layer of the heating element is extremely short. as mentioned above, and consequently, when the temperature of thermal decomposition of the material used for the mobile separation film is higher than the surface layer temperature of the heating element at the time of initiation of bubble formation, similar to the time of deformation mentioned above, the mobile separation film does not decompose even when the mobile separation film comes into contact with the surface layer of the heating element. Furthermore, in the situation in which the continuous discharge situation is carried out over a long period, for example, several minutes to tens of minutes, there are some cases in which it is necessary to consider the maximum temperature of the surface layer of the element of heating not only to the initial time of bubble formation but also during the formation of bubbles. In this case, it is preferable to emphasize the fact that the mobile separation film is not decomposed by thermal application even in the case in which the thermal radiation of the liquid discharge head is not sufficiently carried out by the continuous discharge action. That is, since the temperature of the liquid discharge head does not exceed the above-mentioned maximum temperature of the surface layer of the heating element during the formation of the bubbles, there is no possibility that the mobile separation film is thermally decomposed when the The thermal decomposition temperature of the material used for the mobile separation film is greater than the maximum temperature of the surface layer of the heating element. (3) Case of an abnormal action Next, the case of an abnormal action will be presented in which the bubble formation liquid is insufficient (or does not exist) in the bubble generation area of the second liquid flow passage due to insufficient filling of bubble formation liquid or similar. In such a case, the possibility is increased that a mobile separation film provided to the corresponding nozzle will adhere to the surface layer of the heating element, and meanwhile, a phenomenon occurs in which the liquid is not discharged from the corresponding output. In a normal liquid discharge head or in a liquid discharge apparatus to which the head is mounted, a detection portion is provided for detecting said non-discharge state, and it is possible to return to the normal state by restoring the passage of liquid flow formation of bubbles (and the flow passage of discharge liquid, if necessary) through a well-known restoration device or similar based on the detected results. In case of having a restoration device of this type, the condition required for the film is different according to the moment when the restoration action is carried out after the occurrence of the abnormality or what is the amount of bubble formation liquid that comes out in the bubble generation area. For example, in the case in which the aforementioned restoration action is carried out in a time of tens of seconds to several minutes after the occurrence of the abnormality, it is unnecessary to consider the melting point of the mobile separation film. , and it is sufficient to consider the temperature of thermal decomposition. Furthermore, in the case in which, when removing the bubbles, the mobile separation film is adhered on the surface layer of the heating element and the filling of the bubble-forming liquid is not carried out and it is left as it is. finds, or in the case in which at the time of the aforementioned continuous discharge action the filling of the bubble formation liquid is insufficient and at the time of deformation, a condition for the moving separation film to frequently come into contact with the surface layer of the heating element proceeding for a long period of tens of minutes or more, it is preferable to emphasize the fact that the melting point of the mobile separation film is higher than the surface layer temperature of the heating element moment of deformation. On the other hand, in the case where a state of near absence of bubble formation liquid in the bubble generation area continues for a long period of tens of minutes or more, it is preferable to emphasize the fact that the melting point of the mobile separation film is higher than the surface layer temperature of the heating element at the time of the formation of the bubbles. <Examples of PPX > The present inventor and others paid attention to a material that fulfills the aforementioned relationship between the mobile separation film and the surface layer temperature of the heating element. Here, the basic structure, method of manufacture and polymerization method or the like of PPX's in the present invention appear in the publications described in the respective embodiments mentioned above, and specifically, are defined by the following chemical formulas (A) to (F) (provided that n is an integer number of 5000 or more), and can be used independently or as a combination.
(A) (B) (C) (D) (E) (F)
In addition, the following points can be mentioned as common characteristics of these PPX 's. PPX does not contain ionic impurities, and is a high purity crystalline polymer with a crystallinity of approximately 60% and a molecular weight of approximately 500,000, and is excellent in its action of rejection to water and gas barrier performance. In addition, it is insoluble in all organic solvents at a temperature of 150 ° C or lower, and has resistance to almost all corrosive liquids such as acids and alkaline substances. In addition, it presents an excellent stability against repeated displacement. Furthermore, the precise control of the thickness when forming a film is easy and it is possible to form a film having a shape that exactly conforms to the shape of the attached substance, and meanwhile, it is possible to form a film without holes according to the substance fixed even if the thickness is 2μm. In addition, since the mechanical stress caused by the effect stress or a thermal stress due to thermal deformation is not applied to the attached substance, it is excellent in adhesive stability for the attached substance after the formation of the film. Accordingly, as for the materials illustrated in formulas (A), (B) and (C), an integrated head substrate was prepared with the movable preparation film by the manufacturing method illustrated in FIGS. 5 (A) a 5 (E) of the first embodiment mentioned above (provided that the film formation itself of the mobile separation film is carried out by means of the steam polymerization method, and provided it is selected, as in the case of the sacrificial layer, an appropriate material (for example, Al) that can reach a selection ratio with the mobile separation film and the element board through a velocity of attack solvent), and after its union on the integrated upper board with a liquid flow passage illustrated in figure 4, by the use of adhesives or the like, an orifice plate was joined and, consequently, a liquid discharge head was prepared. The results of the examination of the physical properties and respective basic characteristics, and qualities in relation to the vaporization at the time of the formation of films «
they appear in the following table 1. [Table 1] Sample A (the composition is shown in formula (A)) Melting point 405 ° C Qualities * colorless and transparent ^ excellent in permeability with small clearance * the coating film is soft * excellent electrical characteristics Constant dielectric characteristics - illustrated in each frequency area * high insulating capacity
Sample B (the composition is shown in formula (B)) Melting point 280 ° C Qualities * colorless and transparent * excellent to prevent the penetration of water vapor and gas * can form a thin film without - holes ^ excellent characteristics Electrical Sample (the composition is shown in formula (C)) 5 Melting point 350 ° C Qualities * colorless and transparent * slightly hard coating film * excellent chemical resistance ^ excellent thermal resistance 10 Sample AB Steam tank a bit slow good Regular
The thermal decomposition temperature of these samples is 15 of 680 ° C in one example, and of is of about 700 ° C in
and each sample, and the thermal decomposition temperature is higher than any of the surface layer temperatures of the heating element at the moment of the bubble deformation and the maximum achievable temperature of the surface layer of the heating element, at the moment of the onset of film boiling by the aforementioned heating element. In addition, the melting point of any of the samples is higher than the surface layer temperature of the element
of heating at the time of the disappearance of the bubbles. For the comparison between the melting point of each sample and the surface layer temperature of the heating element at the time of initiation of film boiling by the heating element, the melting points of the samples (A), (C) they are higher than the surface layer temperature of the heating element at the time of the start of the film boil, respectively. In any of the liquid discharge heads employing the aforementioned samples as a mobile separation film, it was confirmed that the number of times of liquid droplet discharge in each nozzle is greatly increased compared to what is obtained in a liquid discharge head which uses, as a mobile separation film, other organic materials such as for example polyimides previously known as a preparation film, and which not only increased the durability of the head but also made it possible to return to the normal state immediately carrying out a recovery treatment when no change was detected. In addition, corrosion caused by ink or the like was not found. Even in the case of the use of the aforementioned separation film, since both the head substrate and the top board are configured through a material of the silicon family, the property of thermal radiation of the head is excellent and by consequently the effect of making the aforementioned head have a long life becomes even better. Here, in the above manufacturing step, a further description will be provided regarding the vapor deposition of the PPX film with reference to the following chemical formulas (G) to (I).
(G) (H) (I)
Each of the formulas (G) to (I) is an explanatory figure showing the change of material in the reaction step in the case of vapor deposition in the case of the preparation of a separation film only by PPX (sample A) illustrated in formula (A). First, di-para-xylylene is vaporized from a solid dimer to be a material illustrated in formula (G) under the circumstance of a temperature of about 100 ° C to 200 ° C. Afterwards, the creation of a monomer is carried out. stable of di-radical-for-xylylene under the aforementioned circumstances of a temperature of approximately 700 ° C by thermal decomposition of a dimer illustrated in formula (H). Then, the absorption and polymerization of the di-radical-para-xylylene is carried out on members such as head substrates on which a sacrificial layer is applied or on a plate of Yes at the same time, and a mobile film of poly-para-xylylene at room temperature. Here, especially, by changing the state of formula (H) to the state of formula (I), and by performing mobile film formation in vacuum degree of 0.1 [Torr] or less, the penetration of the details of the Di-radical-for-xylylene which is a thermal decomposition product of a dimer created in the vapor phase state is promoted, and by forming chemically stable bond with the fixed portion of the movable film, adhesion can be improved between the fixed portion (seat, fluid flow passage or the like) of the moving film and the moving film. < Additional technical problems and effects > In the present invention, the substance prepared taking into account the situation that can arise practically in the aforementioned case, the discharge of liquid based on the formation of bubbles by boiling of film is carried out using an organic film and using an element of heating that exceeds the conventional thermal level and is an effective invention. The conventional technical level is a level in which there are some substances that have the problem of improving the efficiency of discharge, but in front of them there are numerous simple substances that are separation films to simply separate the liquid from the formation of bubbles and the discharge liquid. From this perspective, the recognition of the above problem of the present invention is "the improvement of the durability of the separation film itself and of the ink jet head taking into account the thermal factor in the displacement of the separation film together with the series of generation-growth-bubble-disappearing changes of the separation film of the present invention, and is a novelty. Accordingly, in the respective descriptions mentioned that have solved this problem, the very cause of the aforementioned problem is eliminated, and it is possible to return immediately through a recovery processing even in the case of an abnormal action. Accordingly, the period during which each separation film can be used without breaking is considerably greater than the period of duration of a liquid discharge head having a conventional separation film, and the head itself is made in such a way that have a long life and there is also an effect to avoid partial damage to the head having a plurality of nozzles. Each invention is carried out independently and an excellent effect can be obtained by the combination.
Claims (3)
- CLAIMS 1. A liquid discharge head comprising: a plurality of first liquid flow passages that are connected to outlets for discharging discharge liquid; t a plurality of second liquid flow passages having an element board with heating elements to generate a bubble in the bubble formation liquid and corresponding to said first 10 fluid flow passages; and mobile separation films that substantially and mutually separate said first liquid flow passages and said corresponding second liquid flow passages at all times, wherein said separation films are mutually independent individual separation films for said second flow passages of respective liquid.
- 2. The liquid discharge head according to claim 1, wherein said mobile separation film 20 is made in such a way that an area opposite said heating element can be convex towards said heating element.
- 3. The liquid discharge head according to claim 2, wherein said mobile separation film 25 is provided to a seat positioned in said second liquid flow passage, and an area of a fixing portion on said seat to an area opposite said heating element is convex toward said first liquid flow passage. The liquid discharge head according to claim 3, wherein said seat forms a side wall of said second liquid flow passage. The liquid discharge head according to claim 1, comprising an upper board member to which is provided in an integrated manner a flow passage wall forming said first liquid flow passage, wherein said passage wall is joined without said mobile separation film. The discharge head of liquid according to claim 1, wherein a flow passage wall forming a side wall of said first liquid flow passage providing integrally with said element board and a top board member of the type plate is attached on an upper end of said flow passage wall. The liquid discharge head according to claim 1, wherein said mobile separation film is an organic film formed by an accumulation method that employs a chemical vapor phase reaction or an accumulation method that employs a polymerization reaction of plasma. The liquid discharge head according to claim 7, wherein said mobile separation film contains poly-para-xylylene. 9. A liquid discharge head comprising: a first fluid flow passage connected to an outlet for discharging discharge liquid; a second liquid flow passage having an element board with a heating element for generating a bubble in the bubble formation liquid, and corresponding to said first liquid flow passage; and a movable separation film separating substantially and mutually said first liquid flow passage and said second corresponding liquid flow passage all the time, further comprising a seat over which said movable separation film is physically or chemically bonded, wherein said mobile separation film is not physically or chemically attached to an end portion on said heating element side of said seat. The liquid discharge head according to claim 9, wherein said movable separation film has a shape such that an area opposite said heating element may have a convex shape towards said heating element. . The liquid discharge head according to claim 9, wherein said movable separating film is provided to a seat placed in said second liquid flow passage, and an area from a fixing portion on said seat to an area opposite said heating element is convex towards said first liquid flow passage. . The liquid discharge head according to claim 9, wherein said seat forms a side wall of said second liquid flow passage. . The liquid discharge head according to claim 9, comprising an upper board member on which a flow passage wall forming said first liquid flow passage is integrally provided, wherein said flow passage wall is joined without said mobile separation film. . A liquid discharge head according to claim 9, wherein said mobile separation film is an organic film formed by an accumulation method that employs a chemical reaction in vapor phase or an accumulation method employing polymerization reaction of plasma. . The liquid discharge head according to claim 14, wherein said mobile separation film contains poly-para-xylylene. . A liquid discharge head comprising: a plurality of first fluid flow passages connected to outlets for discharging a discharge liquid; a plurality of second liquid flow passages having an element board with heating elements to generate a bubble in bubble formation liquid and corresponding to said first liquid flow passages; and an organic movable separation film that substantially and mutually separates said first liquid flow passages and said corresponding second liquid flow passages all the time, further comprising a seat over which said movable separation organic film is physically or physically bound. chemically, wherein a tip portion of a flow passage wall provided for dividing said plurality of first fluid flow passages is depressed toward a bonding area of said movable separation organic film attached thereto, and the width Wl of said tip portion is less than the width W2 of said joint area. . The liquid discharge head according to claim 16, wherein said movable separating film is neither physically nor chemically bound on an end portion on said heating element side of said seat. 18. The liquid discharge head according to claim 16, wherein said movable separating film is provided to a seat placed in said second liquid flow passage, and an area from a fixing portion to said seat. an area opposite said heating element is convex toward said first liquid passage. 19. The liquid discharge head according to claim 16, wherein said mobile separation film is an organic film formed by an accumulation method that employs chemical vapor phase reaction or an accumulation method that employs a reaction of plasma polymerization. 20. A liquid discharge head comprising: a first fluid flow passage connected to an outlet for discharging discharge liquid; a second liquid flow passage having an element board with a heating element for generating a bubble in a bubble formation liquid and corresponding to said first liquid flow passage and a mobile separation film separating substantially and each said first liquid flow passage and said second corresponding liquid flow passage all the time further comprising a seat onto which said mobile separation film is joined, wherein said mobile separation film is adhered through an adhesive area formed on said seat. The liquid discharge head according to claim 20, wherein said adhesive area is provided only in a fixed portion on said element board of said movable separation film by means of said shaping. 22. The liquid discharge head according to claim 20, wherein said adhesive area is formed from a silane coupling agent. 23. The liquid discharge head according to claim 20, wherein said movable separation film is made in such a way that an area opposite said heating element is convex towards said heating element and a peripheral portion of the area opposite to said heating element. said heating element is convex towards said first liquid flow passage, in a movable portion that is fixed on said element board. The liquid discharge head according to claim 20, wherein a flow passage wall forming a side wall of said first liquid flow passage is integrally provided with said element board and a board member upper plate is attached on an upper end of said flow passage wall. 25. The liquid discharge head according to claim 20, wherein said mobile separation film is an organic film formed by an accumulation method employing a chemical vapor phase reaction or an accumulation method employing a plasma polymerization reaction. 26. The liquid discharge head according to claim 25, wherein said mobile separation film contains poly-para-xylylene. 27. The liquid discharge head according to claim 20, wherein said mobile member is an organic film and wherein said seat comprises an inorganic member of a silicon family and said adhesive is a silane coupling agent. 28. A head cartridge comprising a liquid discharge head according to any of claims 1 to 27 and an ink tank for containing the liquid discharged by the liquid discharge head. 9. A liquid discharge device comprising: a liquid discharge head according to any of claims 1 to 27; an ink tank to keep the liquid discharged by the liquid discharge head; and a mounting portion for mounting said liquid discharge head. 30. A method of manufacturing a liquid discharge head comprising: a first fluid flow passage connected to an outlet to discharge the liquid; a second liquid flow passage having a heating element for generating a bubble in the liquid; and a movable separating film separating substantially and mutually said first liquid flow passage and said second liquid flow passage all the time, comprising the steps of: forming a seat for supporting said movable separation film with a clearance in relation to said heating element, in a panel of elements where said heating element is formed; forming a sacrificial layer at least in a position that will be said clearance of said element board; forming said mobile separation film in said seat covering said sacrificial layer; re-attacking a chemical attack from the back of said element board and forming a through hole in said element board allowing said sacrificial layer to be a chemical attack blocking layer; and removing said sacrificial layer through said orifice and forming said second passage of liquid flow. . The method of manufacturing a liquid discharge head according to claim 30, wherein the thickness of said sacrificial layer is formed to be thinner than the thickness of said assent in the step of forming said sacrificial layer. . The method of manufacturing a liquid discharge head according to claim 30, wherein said sacrificial layer is formed in a state in which a peripheral portion reaches said seat in the step of forming said sacrificial layer. - -. The method of manufacturing a liquid discharge head according to claim 30, wherein the step of forming said sacrificial layer comprises the step of forming a first sacrificial layer with a thickness less than the thickness of said seat which will be the slack and a step to form a second sacrificial layer in said first sacrificial layer in a state in which a peripheral portion reaches said seat. . The method of manufacturing a liquid discharge head according to claim 30, wherein said sacrificial layer is formed by forming an Al film after the formation of the Al film by means of a deposition method. electronic. 35. The method of manufacturing a liquid discharge head according to claim 30, comprising a step of forming a flow passage wall by forming a side wall of said first liquid flow passage, in an upper portion of said board of elements. 36. The method of manufacturing a liquid discharge head according to claim 35, wherein the step of forming said flow passage wall comprises: a step of forming a chemical etch blocking layer on said mobile separation film; a step of forming a silicon nitride film covering said seat and said chemical attack blocking layer on said element board; a step of removing a part that will be said first passage of liquid flow from said silicon nitride film; and a step of removing said chemical attack blocking layer. 37. The method of manufacturing a liquid discharge head according to claim 30, wherein the step of forming said mobile separation film comprises a reaction step for forming said mobile separation film from an organic material by means of a accumulation method that includes a chemical reaction in the vapor phase or an accumulation method using a plasma polymerization reaction. . The method of manufacturing a liquid discharge head according to claim 37, wherein said mobile separation film contains poly-para-xylylene as the organic material. A method of manufacturing a liquid discharge head comprising: a first passage of liquid flow connected to an outlet to discharge the liquid; a second passage of liquid flow having a heating element to generate a bubble in the liquid; and a movable separating film separating substantially and mutually said first liquid flow passage and said second liquid flow passage all the time, comprising the steps of: forming a sacrificial layer in a position that will be said second passage of liquid flow in a panel of elements, where said heating element is formed; forming adhesives that cover said sacrificial layer in an upper part of said panel of elements where said sacrificial layer is formed; forming said mobile separation film on a top of said adhesives; performing a chemical attack from the back of said panel of elements and forming a through hole in said panel of elements allowing said sacrificial layer to be a layer of chemical attack blocking; removing said sacrificial layer through said hole; and removing said exposed adhesives by removing said sacrificial layer, through said through hole and forming said second liquid flow passage. 40. The method of manufacturing a liquid discharge head according to claim 39, wherein said adhesives are formed from a silane coupling agent. 41. The method of manufacturing a liquid discharge head according to claim 39, wherein said sacrificial layer is formed in such a way that the height of a peripheral portion of an area opposite said heating element is greater than the height of an area opposite said heating element in the path of formation of said sacrificial layer. 42. The method of manufacturing a liquid discharge head according to claim 39, wherein said sacrificial layer is formed by forming an Al film after the formation of the Al pei-lus by the electronic deposit method . 43. The method of manufacturing a discharge head according to claim 39, comprising the step of forming a flow passage wall by forming a side wall of said first liquid flow passage in an upper part of said flow board. elements. 44. The method of manufacturing a liquid discharge head according to claim 39, wherein the step of forming said mobile separation film comprises a reaction step for forming said mobile separation film from an organic material by a accumulation method using chemical reaction in vapor phase or a method of accumulation using plasma polymerization reaction. 45. The method of manufacturing a liquid discharge head according to claim 44, wherein said mobile separation film contains poly-para-xylene as the organic material.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10-344752 | 1998-12-03 | ||
| JP344753 | 1998-12-03 | ||
| JP344752 | 1998-12-03 | ||
| JP10-344753 | 1998-12-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MXPA99011095A true MXPA99011095A (en) | 2000-12-06 |
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