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MX9703688A - Adhesivos sensibles a la presion y construcciones de amortiguamiento. - Google Patents

Adhesivos sensibles a la presion y construcciones de amortiguamiento.

Info

Publication number
MX9703688A
MX9703688A MX9703688A MX9703688A MX9703688A MX 9703688 A MX9703688 A MX 9703688A MX 9703688 A MX9703688 A MX 9703688A MX 9703688 A MX9703688 A MX 9703688A MX 9703688 A MX9703688 A MX 9703688A
Authority
MX
Mexico
Prior art keywords
pressure sensitive
sensitive adhesives
temperature
whose homopolymer
ethylenically unsaturated
Prior art date
Application number
MX9703688A
Other languages
English (en)
Other versions
MXPA97003688A (es
Inventor
Greggory S Bennett
Christopher A Haak
Craig A Gustafson
Original Assignee
Minnesota Mining & Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Minnesota Mining & Mfg filed Critical Minnesota Mining & Mfg
Publication of MXPA97003688A publication Critical patent/MXPA97003688A/es
Publication of MX9703688A publication Critical patent/MX9703688A/es

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16FSPRINGS; SHOCK-ABSORBERS; MEANS FOR DAMPING VIBRATION
    • F16F9/00Springs, vibration-dampers, shock-absorbers, or similarly-constructed movement-dampers using a fluid or the equivalent as damping medium
    • F16F9/30Springs, vibration-dampers, shock-absorbers, or similarly-constructed movement-dampers using a fluid or the equivalent as damping medium with solid or semi-solid material, e.g. pasty masses, as damping medium
    • F16F9/306Springs, vibration-dampers, shock-absorbers, or similarly-constructed movement-dampers using a fluid or the equivalent as damping medium with solid or semi-solid material, e.g. pasty masses, as damping medium of the constrained layer type, i.e. comprising one or more constrained viscoelastic layers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10Esters
    • C08F220/12Esters of monohydric alcohols or phenols
    • C08F220/16Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
    • C08F220/18Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
    • C08F220/1806C6-(meth)acrylate, e.g. (cyclo)hexyl (meth)acrylate or phenyl (meth)acrylate
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10Esters
    • C08F220/12Esters of monohydric alcohols or phenols
    • C08F220/16Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
    • C08F220/18Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
    • C08F220/1808C8-(meth)acrylate, e.g. isooctyl (meth)acrylate or 2-ethylhexyl (meth)acrylate
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38Pressure-sensitive adhesives [PSA]
    • C09J7/381Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385Acrylic polymers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02Electrically-conducting adhesives
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Vibration Prevention Devices (AREA)
  • Laminated Bodies (AREA)

Abstract

Se describen los adhesivos sensibles a la presion, y los adhesivos a la presion expresados, y los materiales viscoelásticos que son el producto de polimerizacíon de un éster de ácido acrílico de un alcohol monohídrico, cuyo homopolímero tiene una Tg menor de 0°C, un monomero no polar etilénicamente insaturado cuyo homopolímero tiene un parámetro de solubilidad no mayor de 10.50 y una Tg mayor de 15°C, y 0-5 partes en peso de un monomero polar etilénicamente insaturado, cuyo homopolímero tiene un parámetro de solubilidad mayor de 10.50 y una Tg mayor de 15°C.
MX9703688A 1994-11-22 1995-10-17 Adhesivos sensibles a la presion y construcciones de amortiguamiento. MX9703688A (es)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US34324794A 1994-11-22 1994-11-22
US343247 1994-11-22
PCT/US1995/013186 WO1996016134A1 (en) 1994-11-22 1995-10-17 Pressure sensitive adhesives and damping constructions

Publications (2)

Publication Number Publication Date
MXPA97003688A MXPA97003688A (es) 1997-08-01
MX9703688A true MX9703688A (es) 1997-08-30

Family

ID=23345302

Family Applications (1)

Application Number Title Priority Date Filing Date
MX9703688A MX9703688A (es) 1994-11-22 1995-10-17 Adhesivos sensibles a la presion y construcciones de amortiguamiento.

Country Status (7)

Country Link
EP (1) EP0793695B1 (es)
JP (1) JP3876299B2 (es)
AU (1) AU694287B2 (es)
CA (1) CA2205223A1 (es)
DE (1) DE69514383T2 (es)
MX (1) MX9703688A (es)
WO (1) WO1996016134A1 (es)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5604268A (en) * 1995-02-22 1997-02-18 Minnesota Mining And Manufacturing Company Glue crayons
US5817426A (en) * 1996-12-04 1998-10-06 Avery Dennison Corporation Acrylic pressure-sensitive adhesives for low-energy surfaces and corrugated board
US6663978B1 (en) 2000-06-28 2003-12-16 3M Innovative Properties Company High refractive index pressure-sensitive adhesives
DE69923359T2 (de) * 1999-10-28 2005-12-22 3M Innovative Properties Co., Saint Paul Zusammensetzungen und daraus hergestellte gegenstände
US6376704B1 (en) 2000-06-28 2002-04-23 3M Innovative Properties Company Naphthyoxyalkyl(meth)acrylates with high refractive indices and low glass transition temperatures
US7166686B2 (en) 2000-06-28 2007-01-23 3M Innovative Properties Company High refractive index pressure-sensitive adhesives
WO2008026645A1 (fr) 2006-08-30 2008-03-06 Koatsu Gas Kogyo Co., Ltd. Composition de résine pour un matériau amortisseur et matériau amortisseur
JP2009256607A (ja) 2008-03-17 2009-11-05 Nitto Denko Corp アクリル系粘着剤、アクリル系粘着剤層、アクリル系粘着テープ又はシート
JP5346220B2 (ja) * 2009-02-03 2013-11-20 リンテック株式会社 粘着剤および粘着シート
JP5571332B2 (ja) * 2009-07-10 2014-08-13 スリーエム イノベイティブ プロパティズ カンパニー 粘弾性ダンパー用プライマー組成物および粘弾性ダンパー
KR101824274B1 (ko) 2010-03-25 2018-01-31 닛토덴코 가부시키가이샤 광학용 아크릴계 점착제 조성물 및 광학용 아크릴계 점착 테이프
JP5164188B2 (ja) * 2010-09-28 2013-03-13 日東電工株式会社 粘着剤組成物、粘着シート類および表面保護フィルム
JP5607565B2 (ja) * 2011-03-28 2014-10-15 リンテック株式会社 粘着剤、及び粘着シート
WO2013150563A1 (ja) 2012-04-04 2013-10-10 日東電工株式会社 粘着テープおよびテープロール
US10350861B2 (en) * 2015-07-31 2019-07-16 Corning Incorporated Laminate structures with enhanced damping properties
CN107245306A (zh) * 2017-07-08 2017-10-13 上海晶华胶粘新材料股份有限公司 薄型铝箔麦拉胶带及其制备方法
JP2020181655A (ja) * 2019-04-24 2020-11-05 松本油脂製薬株式会社 二次電池正極スラリー用分散剤組成物及びその用途

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4786552A (en) * 1986-07-07 1988-11-22 Avery International Corporation Curable arcylic/fumaric pressure-sensitive adhesives
US5262232A (en) * 1992-01-22 1993-11-16 Minnesota Mining And Manufacturing Company Vibration damping constructions using acrylate-containing damping materials
JP3878205B2 (ja) * 1993-11-10 2007-02-07 スリーエム カンパニー 感圧接着剤

Also Published As

Publication number Publication date
EP0793695B1 (en) 2000-01-05
CA2205223A1 (en) 1996-05-30
AU4000695A (en) 1996-06-17
WO1996016134A1 (en) 1996-05-30
JPH10509198A (ja) 1998-09-08
JP3876299B2 (ja) 2007-01-31
DE69514383D1 (de) 2000-02-10
EP0793695A1 (en) 1997-09-10
AU694287B2 (en) 1998-07-16
DE69514383T2 (de) 2000-08-03

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