MX9703688A - Adhesivos sensibles a la presion y construcciones de amortiguamiento. - Google Patents
Adhesivos sensibles a la presion y construcciones de amortiguamiento.Info
- Publication number
- MX9703688A MX9703688A MX9703688A MX9703688A MX9703688A MX 9703688 A MX9703688 A MX 9703688A MX 9703688 A MX9703688 A MX 9703688A MX 9703688 A MX9703688 A MX 9703688A MX 9703688 A MX9703688 A MX 9703688A
- Authority
- MX
- Mexico
- Prior art keywords
- pressure sensitive
- sensitive adhesives
- temperature
- whose homopolymer
- ethylenically unsaturated
- Prior art date
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16F—SPRINGS; SHOCK-ABSORBERS; MEANS FOR DAMPING VIBRATION
- F16F9/00—Springs, vibration-dampers, shock-absorbers, or similarly-constructed movement-dampers using a fluid or the equivalent as damping medium
- F16F9/30—Springs, vibration-dampers, shock-absorbers, or similarly-constructed movement-dampers using a fluid or the equivalent as damping medium with solid or semi-solid material, e.g. pasty masses, as damping medium
- F16F9/306—Springs, vibration-dampers, shock-absorbers, or similarly-constructed movement-dampers using a fluid or the equivalent as damping medium with solid or semi-solid material, e.g. pasty masses, as damping medium of the constrained layer type, i.e. comprising one or more constrained viscoelastic layers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
- C08F220/1806—C6-(meth)acrylate, e.g. (cyclo)hexyl (meth)acrylate or phenyl (meth)acrylate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
- C08F220/1808—C8-(meth)acrylate, e.g. isooctyl (meth)acrylate or 2-ethylhexyl (meth)acrylate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
- C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/385—Acrylic polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Vibration Prevention Devices (AREA)
- Laminated Bodies (AREA)
Abstract
Se describen los adhesivos sensibles a la presion, y los adhesivos a la presion expresados, y los materiales viscoelásticos que son el producto de polimerizacíon de un éster de ácido acrílico de un alcohol monohídrico, cuyo homopolímero tiene una Tg menor de 0°C, un monomero no polar etilénicamente insaturado cuyo homopolímero tiene un parámetro de solubilidad no mayor de 10.50 y una Tg mayor de 15°C, y 0-5 partes en peso de un monomero polar etilénicamente insaturado, cuyo homopolímero tiene un parámetro de solubilidad mayor de 10.50 y una Tg mayor de 15°C.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US34324794A | 1994-11-22 | 1994-11-22 | |
US343247 | 1994-11-22 | ||
PCT/US1995/013186 WO1996016134A1 (en) | 1994-11-22 | 1995-10-17 | Pressure sensitive adhesives and damping constructions |
Publications (2)
Publication Number | Publication Date |
---|---|
MXPA97003688A MXPA97003688A (es) | 1997-08-01 |
MX9703688A true MX9703688A (es) | 1997-08-30 |
Family
ID=23345302
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MX9703688A MX9703688A (es) | 1994-11-22 | 1995-10-17 | Adhesivos sensibles a la presion y construcciones de amortiguamiento. |
Country Status (7)
Country | Link |
---|---|
EP (1) | EP0793695B1 (es) |
JP (1) | JP3876299B2 (es) |
AU (1) | AU694287B2 (es) |
CA (1) | CA2205223A1 (es) |
DE (1) | DE69514383T2 (es) |
MX (1) | MX9703688A (es) |
WO (1) | WO1996016134A1 (es) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5604268A (en) * | 1995-02-22 | 1997-02-18 | Minnesota Mining And Manufacturing Company | Glue crayons |
US5817426A (en) * | 1996-12-04 | 1998-10-06 | Avery Dennison Corporation | Acrylic pressure-sensitive adhesives for low-energy surfaces and corrugated board |
US6663978B1 (en) | 2000-06-28 | 2003-12-16 | 3M Innovative Properties Company | High refractive index pressure-sensitive adhesives |
DE69923359T2 (de) * | 1999-10-28 | 2005-12-22 | 3M Innovative Properties Co., Saint Paul | Zusammensetzungen und daraus hergestellte gegenstände |
US6376704B1 (en) | 2000-06-28 | 2002-04-23 | 3M Innovative Properties Company | Naphthyoxyalkyl(meth)acrylates with high refractive indices and low glass transition temperatures |
US7166686B2 (en) | 2000-06-28 | 2007-01-23 | 3M Innovative Properties Company | High refractive index pressure-sensitive adhesives |
WO2008026645A1 (fr) † | 2006-08-30 | 2008-03-06 | Koatsu Gas Kogyo Co., Ltd. | Composition de résine pour un matériau amortisseur et matériau amortisseur |
JP2009256607A (ja) | 2008-03-17 | 2009-11-05 | Nitto Denko Corp | アクリル系粘着剤、アクリル系粘着剤層、アクリル系粘着テープ又はシート |
JP5346220B2 (ja) * | 2009-02-03 | 2013-11-20 | リンテック株式会社 | 粘着剤および粘着シート |
JP5571332B2 (ja) * | 2009-07-10 | 2014-08-13 | スリーエム イノベイティブ プロパティズ カンパニー | 粘弾性ダンパー用プライマー組成物および粘弾性ダンパー |
KR101824274B1 (ko) | 2010-03-25 | 2018-01-31 | 닛토덴코 가부시키가이샤 | 광학용 아크릴계 점착제 조성물 및 광학용 아크릴계 점착 테이프 |
JP5164188B2 (ja) * | 2010-09-28 | 2013-03-13 | 日東電工株式会社 | 粘着剤組成物、粘着シート類および表面保護フィルム |
JP5607565B2 (ja) * | 2011-03-28 | 2014-10-15 | リンテック株式会社 | 粘着剤、及び粘着シート |
WO2013150563A1 (ja) | 2012-04-04 | 2013-10-10 | 日東電工株式会社 | 粘着テープおよびテープロール |
US10350861B2 (en) * | 2015-07-31 | 2019-07-16 | Corning Incorporated | Laminate structures with enhanced damping properties |
CN107245306A (zh) * | 2017-07-08 | 2017-10-13 | 上海晶华胶粘新材料股份有限公司 | 薄型铝箔麦拉胶带及其制备方法 |
JP2020181655A (ja) * | 2019-04-24 | 2020-11-05 | 松本油脂製薬株式会社 | 二次電池正極スラリー用分散剤組成物及びその用途 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4786552A (en) * | 1986-07-07 | 1988-11-22 | Avery International Corporation | Curable arcylic/fumaric pressure-sensitive adhesives |
US5262232A (en) * | 1992-01-22 | 1993-11-16 | Minnesota Mining And Manufacturing Company | Vibration damping constructions using acrylate-containing damping materials |
JP3878205B2 (ja) * | 1993-11-10 | 2007-02-07 | スリーエム カンパニー | 感圧接着剤 |
-
1995
- 1995-10-17 AU AU40006/95A patent/AU694287B2/en not_active Ceased
- 1995-10-17 CA CA002205223A patent/CA2205223A1/en not_active Abandoned
- 1995-10-17 DE DE69514383T patent/DE69514383T2/de not_active Expired - Fee Related
- 1995-10-17 MX MX9703688A patent/MX9703688A/es unknown
- 1995-10-17 JP JP51683396A patent/JP3876299B2/ja not_active Expired - Fee Related
- 1995-10-17 WO PCT/US1995/013186 patent/WO1996016134A1/en not_active Application Discontinuation
- 1995-10-17 EP EP95938742A patent/EP0793695B1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0793695B1 (en) | 2000-01-05 |
CA2205223A1 (en) | 1996-05-30 |
AU4000695A (en) | 1996-06-17 |
WO1996016134A1 (en) | 1996-05-30 |
JPH10509198A (ja) | 1998-09-08 |
JP3876299B2 (ja) | 2007-01-31 |
DE69514383D1 (de) | 2000-02-10 |
EP0793695A1 (en) | 1997-09-10 |
AU694287B2 (en) | 1998-07-16 |
DE69514383T2 (de) | 2000-08-03 |
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