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MX2013009014A - Composicion de soldadura sin plomo. - Google Patents

Composicion de soldadura sin plomo.

Info

Publication number
MX2013009014A
MX2013009014A MX2013009014A MX2013009014A MX2013009014A MX 2013009014 A MX2013009014 A MX 2013009014A MX 2013009014 A MX2013009014 A MX 2013009014A MX 2013009014 A MX2013009014 A MX 2013009014A MX 2013009014 A MX2013009014 A MX 2013009014A
Authority
MX
Mexico
Prior art keywords
weight
lead
solder composition
free solder
composition
Prior art date
Application number
MX2013009014A
Other languages
English (en)
Other versions
MX344239B (es
Inventor
John Pereira
Jennie S Hwang
Alexandra M Mackin
Joseph C Golsalves
Original Assignee
Antaya Technologies Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Antaya Technologies Corp filed Critical Antaya Technologies Corp
Publication of MX2013009014A publication Critical patent/MX2013009014A/es
Publication of MX344239B publication Critical patent/MX344239B/es

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
    • B60R16/00—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for
    • B60R16/02—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
    • C03C27/04—Joining glass to metal by means of an interlayer
    • C03C27/042—Joining glass to metal by means of an interlayer consisting of a combination of materials selected from glass, glass-ceramic or ceramic material with metals, metal oxides or metal salts
    • C03C27/046—Joining glass to metal by means of an interlayer consisting of a combination of materials selected from glass, glass-ceramic or ceramic material with metals, metal oxides or metal salts of metals, metal oxides or metal salts only
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/02—Making non-ferrous alloys by melting
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C28/00—Alloys based on a metal not provided for in groups C22C5/00 - C22C27/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60Y—INDEXING SCHEME RELATING TO ASPECTS CROSS-CUTTING VEHICLE TECHNOLOGY
    • B60Y2410/00—Constructional features of vehicle sub-units
    • B60Y2410/115—Electric wiring; Electric connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Metallurgy (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Conductive Materials (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Photovoltaic Devices (AREA)

Abstract

Una composición de soldadura incluye aproximadamente 4% a aproximadamente 25% en peso de estaño, aproximadamente 0.1% a aproximadamente 8% en peso de antimonio, aproximadamente 0.03% a aproximadamente 4% en peso de cobre, aproximadamente 0.03% a aproximadamente 4% en peso de níquel, aproximadamente 66% a aproximadamente 90% en peso de indio, y aproximadamente 0.5% a aproximadamente 9% en peso de plata; la composición además puede incluir aproximadamente 0.2% a aproximadamente 6% en peso de zinc, e, independientemente, aproximadamente 0.01% a aproximadamente 0.3% en peso de germanio; la composición se puede usar para soldar un conector eléctrico a una superficie de contacto eléctrico en un componente de vidrio.
MX2013009014A 2011-02-04 2012-02-01 Composicion de soldadura sin plomo. MX344239B (es)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161439538P 2011-02-04 2011-02-04
US201161540213P 2011-09-28 2011-09-28
PCT/US2012/023492 WO2012106434A1 (en) 2011-02-04 2012-02-01 Lead-free solder composition

Publications (2)

Publication Number Publication Date
MX2013009014A true MX2013009014A (es) 2013-12-06
MX344239B MX344239B (es) 2016-12-07

Family

ID=45755521

Family Applications (2)

Application Number Title Priority Date Filing Date
MX2016013906A MX356849B (es) 2011-02-04 2012-02-01 Composicion de soldadura sin plomo.
MX2013009014A MX344239B (es) 2011-02-04 2012-02-01 Composicion de soldadura sin plomo.

Family Applications Before (1)

Application Number Title Priority Date Filing Date
MX2016013906A MX356849B (es) 2011-02-04 2012-02-01 Composicion de soldadura sin plomo.

Country Status (9)

Country Link
US (4) US8771592B2 (es)
EP (2) EP2990155B1 (es)
JP (4) JP2014509944A (es)
CN (1) CN103476539B (es)
CA (1) CA2825629A1 (es)
MX (2) MX356849B (es)
PL (2) PL2670560T3 (es)
TW (3) TWI505897B (es)
WO (1) WO2012106434A1 (es)

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CN105473266A (zh) * 2013-07-31 2016-04-06 安塔亚技术公司 包括带焊剂储集部的预焊表面的电气部件
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Also Published As

Publication number Publication date
TW201238696A (en) 2012-10-01
MX356849B (es) 2018-06-15
EP2990155A1 (en) 2016-03-02
US20180207753A1 (en) 2018-07-26
TWI505897B (zh) 2015-11-01
US20140271343A1 (en) 2014-09-18
CN103476539B (zh) 2016-08-17
JP2020040127A (ja) 2020-03-19
WO2012106434A1 (en) 2012-08-09
CA2825629A1 (en) 2012-08-09
PL2670560T3 (pl) 2016-04-29
EP2990155B1 (en) 2017-09-27
JP6928062B2 (ja) 2021-09-01
BR112013019849A2 (pt) 2016-10-11
US20120222893A1 (en) 2012-09-06
US8771592B2 (en) 2014-07-08
US20170190004A1 (en) 2017-07-06
TWI642510B (zh) 2018-12-01
TW201538263A (zh) 2015-10-16
EP2670560B1 (en) 2016-01-13
US10105794B2 (en) 2018-10-23
TWI583481B (zh) 2017-05-21
JP2016052684A (ja) 2016-04-14
TW201726291A (zh) 2017-08-01
US9975207B2 (en) 2018-05-22
JP2014509944A (ja) 2014-04-24
MX344239B (es) 2016-12-07
CN103476539A (zh) 2013-12-25
JP2018039053A (ja) 2018-03-15
JP6243893B2 (ja) 2017-12-06
PL2990155T3 (pl) 2018-01-31
EP2670560A1 (en) 2013-12-11
JP6846328B2 (ja) 2021-03-24

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