MX2011008787A - Composicion limpiadora microelectronica basada en solvente organico acido multiproposito. - Google Patents
Composicion limpiadora microelectronica basada en solvente organico acido multiproposito.Info
- Publication number
- MX2011008787A MX2011008787A MX2011008787A MX2011008787A MX2011008787A MX 2011008787 A MX2011008787 A MX 2011008787A MX 2011008787 A MX2011008787 A MX 2011008787A MX 2011008787 A MX2011008787 A MX 2011008787A MX 2011008787 A MX2011008787 A MX 2011008787A
- Authority
- MX
- Mexico
- Prior art keywords
- cleaning composition
- multipurpose
- acidic
- organic solvent
- solvent based
- Prior art date
Links
- 238000004140 cleaning Methods 0.000 title abstract 5
- 238000004377 microelectronic Methods 0.000 title abstract 2
- 230000002378 acidificating effect Effects 0.000 title 1
- 239000003960 organic solvent Substances 0.000 title 1
- -1 fluoride compound Chemical class 0.000 abstract 2
- ABLZXFCXXLZCGV-UHFFFAOYSA-N Phosphorous acid Chemical compound OP(O)=O ABLZXFCXXLZCGV-UHFFFAOYSA-N 0.000 abstract 1
- 239000002253 acid Substances 0.000 abstract 1
- 125000000217 alkyl group Chemical group 0.000 abstract 1
- 150000001412 amines Chemical class 0.000 abstract 1
- 230000000536 complexating effect Effects 0.000 abstract 1
- 150000001875 compounds Chemical class 0.000 abstract 1
- 230000007797 corrosion Effects 0.000 abstract 1
- 238000005260 corrosion Methods 0.000 abstract 1
- 239000006184 cosolvent Substances 0.000 abstract 1
- 239000003112 inhibitor Substances 0.000 abstract 1
- 229910021645 metal ion Inorganic materials 0.000 abstract 1
- 150000003839 salts Chemical class 0.000 abstract 1
- 150000003966 selones Chemical class 0.000 abstract 1
- 239000002904 solvent Substances 0.000 abstract 1
- 150000003457 sulfones Chemical class 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
- G03F7/422—Stripping or agents therefor using liquids only
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/02—Inorganic compounds
- C11D7/04—Water-soluble compounds
- C11D7/08—Acids
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/50—Solvents
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/261—Alcohols; Phenols
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/34—Organic compounds containing sulfur
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/50—Solvents
- C11D7/5004—Organic solvents
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
- H01L21/0206—Cleaning during device manufacture during, before or after processing of insulating layers
- H01L21/02063—Cleaning during device manufacture during, before or after processing of insulating layers the processing being the formation of vias or contact holes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
- H01L21/02068—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
- C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/36—Organic compounds containing phosphorus
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Emergency Medicine (AREA)
- Health & Medical Sciences (AREA)
- Inorganic Chemistry (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Detergent Compositions (AREA)
Abstract
Una composición limpiadora para limpiar dispositivos microelectrónicos o nanoelectrónicos, la composición limpiadora que tiene HF como el único ácido y el único compuesto de fluoruro en la composición, al menos un solvente primario seleccionado del grupo que consiste de sulfonas y selenonas, al menos un co-solvente de alcohol polihidroxil-alquílico o -arílico que tiene sitios de unión o formación de complejos de iones metálicos, y agua, y opcionalmente al menos un compuesto inhibidor de corrosión de ácido fosfónico y en donde la composición limpiadora está libre de aminas, bases y otras sales.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15530909P | 2009-02-25 | 2009-02-25 | |
PCT/US2010/020974 WO2010098899A1 (en) | 2009-02-25 | 2010-01-14 | Multipurpose acidic, organic solvent based microelectronic cleaning composition |
Publications (1)
Publication Number | Publication Date |
---|---|
MX2011008787A true MX2011008787A (es) | 2011-09-29 |
Family
ID=42077359
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MX2011008787A MX2011008787A (es) | 2009-02-25 | 2010-01-14 | Composicion limpiadora microelectronica basada en solvente organico acido multiproposito. |
Country Status (16)
Country | Link |
---|---|
US (1) | US8557757B2 (es) |
EP (1) | EP2401655B1 (es) |
JP (1) | JP2014132094A (es) |
KR (1) | KR101831452B1 (es) |
CN (1) | CN102334069B (es) |
AU (1) | AU2010218426A1 (es) |
BR (1) | BRPI1007989A2 (es) |
CA (1) | CA2753399A1 (es) |
IL (1) | IL214728A (es) |
MX (1) | MX2011008787A (es) |
MY (1) | MY152051A (es) |
RU (1) | RU2011139104A (es) |
SG (1) | SG173834A1 (es) |
TW (1) | TWI500760B (es) |
WO (1) | WO2010098899A1 (es) |
ZA (1) | ZA201106933B (es) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8754021B2 (en) | 2009-02-27 | 2014-06-17 | Advanced Technology Materials, Inc. | Non-amine post-CMP composition and method of use |
JP5868155B2 (ja) * | 2010-12-13 | 2016-02-24 | ローム アンド ハース エレクトロニック マテリアルズ エルエルシーRohm and Haas Electronic Materials LLC | 半導体の電気化学エッチング |
EP2768920A4 (en) * | 2011-10-21 | 2015-06-03 | Advanced Tech Materials | AMIN FREE POST-KMP COMPOSITION AND METHOD OF USE THEREOF |
US8951950B2 (en) * | 2012-03-12 | 2015-02-10 | Ekc Technology | Aluminum post-etch residue removal with simultaneous surface passivation |
TW201713751A (zh) * | 2015-10-06 | 2017-04-16 | 聯華電子股份有限公司 | 酸槽補酸系統與方法 |
CN108251895A (zh) * | 2016-12-29 | 2018-07-06 | 江苏鲁汶仪器有限公司 | 一种氟化氢气相腐蚀设备及方法 |
KR20230052123A (ko) * | 2021-10-12 | 2023-04-19 | 삼성전자주식회사 | 반도체 패키지 제조 방법 |
CN115799063A (zh) * | 2023-01-31 | 2023-03-14 | 广州粤芯半导体技术有限公司 | 一种氧化物层的刻蚀方法 |
Family Cites Families (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3629124A (en) * | 1969-08-27 | 1971-12-21 | Monsanto Co | Bleaching sterilizing disinfecting and deterging compositions |
US4215005A (en) | 1978-01-30 | 1980-07-29 | Allied Chemical Corporation | Organic stripping compositions and method for using same |
US6368421B1 (en) | 1998-07-10 | 2002-04-09 | Clariant Finance (Bvi) Limited | Composition for stripping photoresist and organic materials from substrate surfaces |
US6562726B1 (en) | 1999-06-29 | 2003-05-13 | Micron Technology, Inc. | Acid blend for removing etch residue |
US6531436B1 (en) | 2000-02-25 | 2003-03-11 | Shipley Company, L.L.C. | Polymer removal |
ATE330250T1 (de) * | 2000-04-24 | 2006-07-15 | Nitto Denko Corp | Flüssigkristallanzeige mit o- und e-typ polarisatoren |
WO2001081525A1 (fr) * | 2000-04-26 | 2001-11-01 | Daikin Industries, Ltd. | Composition de detergent |
JP4959095B2 (ja) * | 2000-07-10 | 2012-06-20 | イーケイシー テクノロジー インコーポレーテッド | 半導体デバイスの有機及びプラズマエッチング残さの洗浄用組成物 |
US6799589B2 (en) * | 2000-11-08 | 2004-10-05 | Sony Corporation | Method and apparatus for wet-cleaning substrate |
CN1659481A (zh) * | 2002-06-07 | 2005-08-24 | 马林克罗特贝克公司 | 包含氧化剂和有机溶剂的微电子清洁组合物 |
CN1659480A (zh) * | 2002-06-07 | 2005-08-24 | 马林克罗特贝克公司 | 用于微电子基底的清洁组合物 |
JP2004029346A (ja) | 2002-06-25 | 2004-01-29 | Mitsubishi Gas Chem Co Inc | レジスト剥離液組成物 |
US7166419B2 (en) * | 2002-09-26 | 2007-01-23 | Air Products And Chemicals, Inc. | Compositions substrate for removing etching residue and use thereof |
EP1664935B1 (en) * | 2003-08-19 | 2007-10-17 | Mallinckrodt Baker, Inc. | Stripping and cleaning compositions for microelectronics |
JP4620680B2 (ja) * | 2003-10-29 | 2011-01-26 | マリンクロッド・ベイカー・インコーポレイテッド | ハロゲン化金属の腐食阻害剤を含有するアルカリ性のプラズマエッチング/灰化後の残渣の除去剤およびフォトレジスト剥離組成物 |
BRPI0418529A (pt) * | 2004-02-11 | 2007-05-15 | Mallinckrodt Baker Inc | composições de limpeza para microeletrÈnicos contendo ácidos de halogênio oxigenados, sais e derivados dos mesmos |
JP4633785B2 (ja) * | 2004-03-01 | 2011-02-16 | アバンター・パフォーマンス・マテリアルズ・インコーポレイテッド | ナノエレクトロニクスおよびマイクロエレクトロニクスの洗浄組成物 |
US7825078B2 (en) * | 2004-07-15 | 2010-11-02 | Mallinckrodt Baker, Inc. | Non-aqueous microelectronic cleaning compositions containing fructose |
JP2006041446A (ja) * | 2004-07-30 | 2006-02-09 | Sumitomo Chemical Co Ltd | 電子部品洗浄液 |
US8178482B2 (en) * | 2004-08-03 | 2012-05-15 | Avantor Performance Materials, Inc. | Cleaning compositions for microelectronic substrates |
KR20060064441A (ko) * | 2004-12-08 | 2006-06-13 | 말린크로트 베이커, 인코포레이티드 | 비수성 비부식성 마이크로전자 세정 조성물 |
BRPI0518420A2 (pt) * | 2004-12-10 | 2008-11-25 | Mallinckrodt Baker Inc | composiÇÕes de limpeza de microeletrânicos nço-aquosas, nço-corrosivas, contendo inibidores de corrosço polimÉricos |
US7659203B2 (en) | 2005-03-18 | 2010-02-09 | Applied Materials, Inc. | Electroless deposition process on a silicon contact |
KR101251594B1 (ko) * | 2006-03-23 | 2013-04-08 | 주식회사 동진쎄미켐 | 레지스트 스트리퍼 제거용 케미칼 린스 조성물 |
WO2009032460A1 (en) * | 2007-08-02 | 2009-03-12 | Advanced Technology Materials, Inc. | Non-fluoride containing composition for the removal of residue from a microelectronic device |
-
2010
- 2010-01-14 AU AU2010218426A patent/AU2010218426A1/en not_active Abandoned
- 2010-01-14 KR KR1020117022263A patent/KR101831452B1/ko not_active Application Discontinuation
- 2010-01-14 RU RU2011139104/04A patent/RU2011139104A/ru unknown
- 2010-01-14 US US13/138,467 patent/US8557757B2/en active Active
- 2010-01-14 MY MYPI2011003956 patent/MY152051A/en unknown
- 2010-01-14 EP EP10704029.7A patent/EP2401655B1/en not_active Not-in-force
- 2010-01-14 CA CA2753399A patent/CA2753399A1/en not_active Abandoned
- 2010-01-14 SG SG2011061033A patent/SG173834A1/en unknown
- 2010-01-14 CN CN2010800093059A patent/CN102334069B/zh active Active
- 2010-01-14 MX MX2011008787A patent/MX2011008787A/es active IP Right Grant
- 2010-01-14 BR BRPI1007989A patent/BRPI1007989A2/pt not_active Application Discontinuation
- 2010-01-14 WO PCT/US2010/020974 patent/WO2010098899A1/en active Application Filing
- 2010-01-28 TW TW099102451A patent/TWI500760B/zh active
-
2011
- 2011-08-18 IL IL214728A patent/IL214728A/en not_active IP Right Cessation
- 2011-09-22 ZA ZA2011/06933A patent/ZA201106933B/en unknown
-
2014
- 2014-04-14 JP JP2014082906A patent/JP2014132094A/ja not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
RU2011139104A (ru) | 2013-04-10 |
US20110306534A1 (en) | 2011-12-15 |
KR20110136820A (ko) | 2011-12-21 |
US8557757B2 (en) | 2013-10-15 |
BRPI1007989A2 (pt) | 2016-03-01 |
MY152051A (en) | 2014-08-15 |
EP2401655B1 (en) | 2014-03-12 |
KR101831452B1 (ko) | 2018-02-22 |
IL214728A (en) | 2015-10-29 |
ZA201106933B (en) | 2012-05-30 |
WO2010098899A1 (en) | 2010-09-02 |
JP5730790B2 (ja) | 2015-06-10 |
JP2014132094A (ja) | 2014-07-17 |
TWI500760B (zh) | 2015-09-21 |
EP2401655A1 (en) | 2012-01-04 |
JP2012518715A (ja) | 2012-08-16 |
AU2010218426A1 (en) | 2011-10-20 |
TW201035308A (en) | 2010-10-01 |
CA2753399A1 (en) | 2010-09-02 |
CN102334069B (zh) | 2013-07-10 |
CN102334069A (zh) | 2012-01-25 |
IL214728A0 (en) | 2011-11-30 |
SG173834A1 (en) | 2011-09-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FG | Grant or registration |