Yin et al., 2020 - Google Patents
Study on cutting PV polysilicon with a new type of diamond abrasives-helix-distribution saw wire based on controlling the subsurface microcrack damage depthYin et al., 2020
- Document ID
- 3327743999125673094
- Author
- Yin Y
- Gao Y
- Li X
- Pu T
- Wang L
- Publication year
- Publication venue
- The International Journal of Advanced Manufacturing Technology
External Links
Snippet
There are large brittle fracture pits on the surface of photovoltaic polysilicon wafer cut by diamond wire saw, because of the problems such as poor flow of cutting fluid and difficulty in chip discharge. At the same time, the anti-corrosion amorphous layer on the wafer surface …
- 238000005520 cutting process 0 title abstract description 114
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GASES [GHG] EMISSION, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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