Yu et al., 2002 - Google Patents
Electroless plating of copper on polyimide films modified by surface grafting of tertiary and quaternary amines polymersYu et al., 2002
- Document ID
- 3313974975349653442
- Author
- Yu Z
- Kang E
- Neoh K
- Publication year
- Publication venue
- Polymer
External Links
Snippet
Argon plasma-pretreated polyimide (PI, Kapton® HN) films were subjected to UV-induced surface graft copolymerization with N, N′-(dimethylamino) ethyl methacrylate (DMAEMA) and 2-(trimethylammonium) ethyl methacrylate chloride (TMMAC). The DMAEMA graft …
- 239000010949 copper 0 title abstract description 72
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pre-treatment of the material to be coated
- C23C18/20—Pre-treatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pre-treatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pre-treatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pre-treatment of the material to be coated
- C23C18/20—Pre-treatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/22—Roughening, e.g. by etching
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/12—Chemical modification
- C08J7/16—Chemical modification with polymerisable compounds
- C08J7/18—Chemical modification with polymerisable compounds using wave energy or particle radiation
Similar Documents
Publication | Publication Date | Title |
---|---|---|
Yu et al. | Electroless plating of copper on polyimide films modified by surface grafting of tertiary and quaternary amines polymers | |
Iroh et al. | Electrochemical synthesis: a novel technique for processing multi-functional coatings | |
Wencheng et al. | Effects of electrochemical process parameters on the synthesis and properties of polypyrrole coatings on steel | |
Kang et al. | Surface modifications of polyaniline films by graft copolymerization | |
Wang et al. | Electroless plating of copper on polyimide films modified by plasma graft copolymerization with 4-vinylpyridine | |
Ma et al. | Electroless plating of palladium and copper on polyaniline films | |
Yang et al. | Surface graft copolymerization of poly (tetrafluoroethylene) films with N-containing vinyl monomers for the electroless plating of copper | |
JP5360963B2 (en) | Catalyst-free metallization method on dielectric substrate surface and dielectric substrate with metal film | |
Yang et al. | Electroless deposition of copper on polyimide films modified by surface graft copolymerization with nitrogen-containing vinyl monomers | |
CN101103138A (en) | Metal film and formation method of metal film | |
Zhang et al. | Electroless plating of copper and nickel on surface-modified poly (tetrafluoroethylene) films | |
Wang et al. | Electroless plating of copper on fluorinated polyimide films modified by surface graft copolymerization with 1‐vinylimidazole and 4‐vinylpyridine | |
Yang et al. | Electroless deposition of copper and nickel on poly (tetrafluoroethylene) films modified by single and double surface graft copolymerization | |
Zhang et al. | Electroless plating of copper and nickel via a Sn-free process on polyimide films modified by surface graft copolymerization with 1-vinylimidazole | |
Yang et al. | Electroless deposition of nickel on fluoropolymers modified by surface graft copolymerization | |
Kang et al. | Surface modification of polymers for adhesion enhancement | |
TWI438301B (en) | Metal plated article of molded form and method for producing it | |
Li et al. | Electroless plating of copper on polyimide films modified by surface-initiated atom-transfer radical polymerization of 4-vinylpyridine | |
Yu et al. | Electroless plating of copper via a Sn-free process on dielectric SiLK surface modified by UV-induced graft copolymerization with 4-vinylpyridine and 1-vinylimidazole | |
Zhang et al. | Surface modification of poly (tetrafluoroethylene) films by low energy Ar+ ion-beam activation and UV-induced graft copolymerization | |
Pigois-Landureau et al. | XPS study of layer-by-layer deposited polypyrrole thin films | |
Inagaki et al. | Improvement in the adhesion between copper metal and polyimide substrate by plasma polymer deposition of cyano compounds onto polyimide | |
Wu et al. | Surface modification of poly (tetrafluoroethylene) films by double graft copolymerization for adhesion improvement with evaporated copper | |
Girginer et al. | A method for polyaniline coatings on solid polystyrene surfaces and electroless copper deposition | |
Wang et al. | Polyaniline–palladium composite coatings for metallization of polyethylene substrate |