Wang et al., 2011 - Google Patents
Development of epoxy/BN composites with high thermal conductivity and sufficient dielectric breakdown strength partI-sample preparations and thermal conductivityWang et al., 2011
- Document ID
- 2562446734932760534
- Author
- Wang Z
- Iizuka T
- Kozako M
- Ohki Y
- Tanaka T
- Publication year
- Publication venue
- IEEE Transactions on Dielectrics and Electrical Insulation
External Links
Snippet
The aim of this research is to find a way to achieve the epoxy composites with both high thermal conductivity and acceptable dielectric breakdown (BD) strength. As high thermal conductivity, low permittivity and low thermal expansion coefficient of filler can endow …
- 125000003700 epoxy group 0 title abstract description 76
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
- C08K3/00—Use of inorganic ingredients
- C08K3/34—Silicon-containing compounds
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