[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

te Sligte et al., 2017 - Google Patents

Characterization of EBL2 EUV exposure facility

te Sligte et al., 2017

View PDF
Document ID
2003142739024276139
Author
te Sligte E
van Putten M
Molkenboer F
van der Walle P
Muilwijk P
Koster N
Westerhout J
Kerkhof P
Oostdijck B
Mulckhuyse W
Deutz A
Publication year
Publication venue
International Conference on Extreme Ultraviolet Lithography 2017

External Links

Snippet

TNO has built EBL2; a facility for EUV exposure testing and surface analysis. EBL2 is capable of testing EUV optics, EUV photomasks, pellicles, and other components under controlled conditions, relevant to EUV scanner and source operation at all foreseen source …
Continue reading at scholar.archive.org (PDF) (other versions)

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using infra-red, visible or ultra-violet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Exposure apparatus for microlithography
    • G03F7/708Construction of apparatus, e.g. environment, hygiene aspects or materials
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N1/00Sampling; Preparing specimens for investigation
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00Investigating or analysing materials by the use of wave or particle radiation not covered by G01N21/00 or G01N22/00, e.g. X-rays or neutrons
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01JMEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRA-RED, VISIBLE OR ULTRA-VIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00Photometry, e.g. photographic exposure meter
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical means

Similar Documents

Publication Publication Date Title
Brouns et al. NXE pellicle: offering a EUV pellicle solution to the industry
Rajendran et al. Towards a stand-alone high-throughput EUV actinic photomask inspection tool: RESCAN
Hirano et al. Patterned mask inspection technology with projection electron microscope technique on extreme ultraviolet masks
Schmitz et al. Silicon wafer thickness variation measurements using the National Institute of Standards and Technology infrared interferometer
te Sligte et al. EBL2: high power EUV exposure facility
TWI258631B (en) Lithographic apparatus and device manufacturing method
Jonckheere et al. Study of EUV reticle storage effects through exposure on EBL2 and NXE
Weiss et al. Actinic review of EUV masks: status and recent results of the AIMS EUV system
Weiss et al. Actinic review of EUV masks: first results from the AIMS EUV system integration
te Sligte et al. Characterization of EBL2 EUV exposure facility
Stortelder et al. Compatibility assessment of novel reticle absorber materials for use in EUV lithography systems.
Bekaert et al. CNT pellicles: Imaging results of the first full-field EUV exposures
Park et al. Improvement of inter-field CDU by using on-product focus control
Stortelder et al. First results of EUV-scanner compatibility tests performed on novel'high-NA'reticle absorber materials
Teramoto et al. High-radiance LDP source for mask-inspection application
KR102516066B1 (en) Inspection tools, inspection methods and computer program products
Laubis et al. Update on EUV radiometry at PTB
te Sligte et al. EBL2, a flexible, controlled EUV exposure and surface analysis facility
Koster et al. First light and results on EBL2
Wu et al. Lifetime test on EUV photomask with EBL2
Woo et al. Through-pellicle imaging of extreme ultraviolet mask with extreme ultraviolet ptychography microscope
Koster et al. First light at EBL2
Sturm et al. Extreme UV secondary electron yield measurements of Ru, Sn, and Hf oxide thin films
Bekman et al. EBL2 an EUV (Extreme Ultra-Violet) lithography beam line irradiation facility
Rollinger et al. LPP light source for actinic HVM inspection applications