Sun et al., 1999 - Google Patents
Lifetime resistance model of bare metal electrical contactsSun et al., 1999
- Document ID
- 1864986275544157017
- Author
- Sun M
- Pecht M
- Natishan M
- Martens R
- Publication year
- Publication venue
- IEEE transactions on advanced packaging
External Links
Snippet
The performance of a bare metal electrical contact may be seriously impaired by the formation of surface films in the contact area. The growth of surface films is influenced by the anion diffusion process in the contacts. The present paper examines the effects of …
- 229910052751 metal 0 title abstract description 14
Classifications
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L35/00—Thermo-electric devices comprising a junction of dissimilar materials, i.e. exhibiting Seebeck or Peltier effect with or without other thermo-electric effects or thermomagnetic effects; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L35/02—Details
Similar Documents
Publication | Publication Date | Title |
---|---|---|
Jiao et al. | Interaction of thermal cycling and electric current on reliability of solder joints in different solder balls | |
Bryant | Resistance buildup in electrical connectors due to fretting corrosion of rough surfaces | |
Sun et al. | Lifetime resistance model of bare metal electrical contacts | |
Ziolkowski et al. | Estimation of thermoelectric generator performance by finite element modeling | |
Oguibe et al. | Conduction mechanisms in anisotropic conducting adhesive assembly | |
Camut et al. | Efficiency Measurement and Modeling of a High‐Performance Mg2 (Si, Sn)‐Based Thermoelectric Generator | |
He et al. | Effects of oxidation layer and roughness on the fretting wear behavior of copper under electrical contact | |
Sun | Conductivity of conductive polymer for flip chip bonding and BGA socket | |
Tripp et al. | The gas-tightness of separable base metal electric contacts | |
Malucci | Stability and contact resistance failure criteria | |
Ming et al. | A comparative assessment of gold plating thickness required for stationary electrical contacts | |
Braunovic et al. | A model for life time evaluation of closed electrical contacts | |
Wang et al. | A systematic approach for the reliability evaluation of electric connector | |
Myers | Overview of the use of silver in connector applications | |
Dreier | The impact of films on the long-term behavior of stationary electrical connections and contacts in electric power systems | |
CA1331325C (en) | Electric power connectors | |
Trinh et al. | The role of microstructure and surface topography in the electrical behavior of Sn-coated Cu contacts | |
Ahmad et al. | Au/al wire bond interface resistance degradation rate simulations | |
Zhang et al. | Interfacial Crack Growth-Based Fatigue Lifetime Prediction of Thermoelectric Modules under Thermal Cycling | |
Sun et al. | A kinetic model for noble plated electrical contact behavior | |
Fang et al. | Assessment of risk resulting from unattached tin whisker bridging | |
Loscar et al. | Fluctuations of jamming coverage upon random sequential adsorption on homogeneous and heterogeneous media | |
Jun et al. | Study of contact resistance in the design of a pyro-breaker applied in superconducting fusion facility | |
Lang et al. | Reliability of spring pressure contacts under environmental stress | |
Shibutani et al. | Key reliability concerns with lead-free connectors |