Utsumi et al., 1987 - Google Patents
Metallized Ceramic Substrate and Method of Manufacturing the SameUtsumi et al., 1987
- Document ID
- 18405289786723434752
- Author
- Utsumi K
- Osaka T
- Publication year
- Publication venue
- Ausz. Eur. Patentanmeld. I
External Links
- 239000000758 substrate 0 title abstract description 8
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0238282A3 (en) | Hybrid ic device and method for manufacturing same | |
| TW265450B (en) | Devices using metallized magnetic substrates | |
| MY125599A (en) | Printed circuit boards and method of producing the same | |
| EP0151413A3 (en) | Auto-selective metal deposition on dielectric surfaces | |
| CA2429734A1 (en) | Coating for preventing erosion of wellbore components | |
| EP0272046A3 (en) | Circuit arrangement including a composite ceramic substrate | |
| AU1346088A (en) | Ceramic substrate with conductively-filled vias and method for producing | |
| MY104191A (en) | Process for producing multilayer printed wiring board | |
| Utsumi et al. | Metallized Ceramic Substrate and Method of Manufacturing the Same | |
| ES2099625T3 (en) | METALIZATION PROCEDURE OF NON-CONDUCTING SUBSTRATES. | |
| EP0381804A3 (en) | Target used for formation of superconductive oxide film, process of producing thereof, and process of forming superconductive oxide film on substrate using the same | |
| ZA875978B (en) | Process for metallizing non-conductive substrates | |
| GB2287132B (en) | A method for connecting electronic circuits in a multi-chip module having a co-fired substrate, and multi-chip module obtained thereby | |
| JPS55138864A (en) | Method of fabricating semiconductor assembling substrate | |
| JPS54100931A (en) | Electroless nickel plating | |
| JPS641291A (en) | Flexible circuit board and manufacture thereof | |
| Duva et al. | Electroless Plating Process | |
| GB1164591A (en) | mprovements in Metallization of Insulating Substrates | |
| EP0273227A3 (en) | A method of improving bond strength between a metal layer and a non-metallic substrate | |
| JPS6422095A (en) | Manufacture of printed wiring board | |
| Bock et al. | Process for the Highly Adhesive Metallization of Ceramic Materials | |
| MY106602A (en) | Array of densely packet discrete metal microspheres | |
| Hofmann et al. | Factors Influencing the Chemical-Reduction Metal Coating on Drilled Holes Through Printed Circuits | |
| JPH05330857A (en) | Metallizing method with copper | |
| Li et al. | An Electroless Plating of Ni--P on the Metalized Ceramics |