Lebby et al., 1998 - Google Patents
VCSEL devices and packagingLebby et al., 1998
- Document ID
- 18376608063385558550
- Author
- Lebby M
- Claisse P
- Jiang W
- Kiley P
- Roll M
- Boughter L
- Sanchez P
- Lawrence R
- Publication year
- Publication venue
- Micro-Optics Integration and Assemblies
External Links
Snippet
Over the last few years, Motorola has been applying a different kind of semiconductor laser technology to a family of datalink and discrete products. The laser technology is commonly referred to as Vertical Cavity Surface Emitting Lasers (VCSELs). This technology is now …
- 238000004806 packaging method and process 0 title abstract description 17
Classifications
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01S—DEVICES USING STIMULATED EMISSION
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/18—Surface-emitting lasers (SE-lasers)
- H01S5/183—Surface-emitting lasers (SE-lasers) having a vertical cavity (VCSE-lasers)
- H01S5/18308—Surface-emitting lasers (SE-lasers) having a vertical cavity (VCSE-lasers) having a special structure for lateral current or light confinement
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01S—DEVICES USING STIMULATED EMISSION
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/02236—Mounts or sub-mounts
- H01S5/02248—Mechanically integrated components on a mount or an optical micro-bench, e.g. optical components, detectors, etc.
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01S—DEVICES USING STIMULATED EMISSION
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
- H01S5/4031—Edge-emitting structures
- H01S5/4043—Edge-emitting structures with vertically stacked active layers
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01S—DEVICES USING STIMULATED EMISSION
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/42—Arrays of surface emitting lasers
- H01S5/423—Arrays of surface emitting lasers having a vertical cavity
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01S—DEVICES USING STIMULATED EMISSION
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0228—Out-coupling light
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01S—DEVICES USING STIMULATED EMISSION
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Cooling arrangements
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01S—DEVICES USING STIMULATED EMISSION
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/026—Monolithically integrated components, e.g. waveguides, monitoring photo-detectors, drivers
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
- G02B6/00—Light guides
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
- G02B6/00—Light guides
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01S—DEVICES USING STIMULATED EMISSION
- H01S5/00—Semiconductor lasers
- H01S5/04—Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
- H01S5/042—Electrical excitation; Circuits therefor
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01S—DEVICES USING STIMULATED EMISSION
- H01S5/00—Semiconductor lasers
- H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01S—DEVICES USING STIMULATED EMISSION
- H01S3/00—Lasers, i.e. devices for generation, amplification, modulation, demodulation, or frequency-changing, using stimulated emission, of infra-red, visible, or ultra-violet waves
- H01S3/09—Processes or apparatus for excitation, e.g. pumping
- H01S3/091—Processes or apparatus for excitation, e.g. pumping using optical pumping
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01S—DEVICES USING STIMULATED EMISSION
- H01S2301/00—Functional characteristics
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP0975072B1 (en) | Apparatus with an optical functional device having a special wiring electrode | |
JP6759274B2 (en) | Microlens for multi-beam array of optoelectronic devices for high frequency operation | |
US5799030A (en) | Semiconductor device with a laser and a photodetector in a common container | |
US8995493B2 (en) | Microlenses for multibeam arrays of optoelectronic devices for high frequency operation | |
US10038304B2 (en) | Laser arrays for variable optical properties | |
US5978401A (en) | Monolithic vertical cavity surface emitting laser and resonant cavity photodetector transceiver | |
US5420954A (en) | Parallel optical interconnect | |
US7496123B2 (en) | VCSEL with improved high frequency characteristics, semiconductor laser device, module, and optical transmission device | |
US5812581A (en) | Lens for a semiconductive device with a laser and a photodetector in a common container | |
US5914976A (en) | VCSEL-based multi-wavelength transmitter and receiver modules for serial and parallel optical links | |
US6392256B1 (en) | Closely-spaced VCSEL and photodetector for applications requiring their independent operation | |
CN111051940A (en) | Optical interconnect module with polymer waveguides on silicon substrate | |
US20130322478A1 (en) | Semiconductor Laser Device | |
US6845118B1 (en) | Encapsulated optoelectronic devices with controlled properties | |
Kosaka | Smart integration and packaging of 2D VCSEL's for high-speed parallel links | |
US10727948B2 (en) | Communication system employing surface-coupled optical devices | |
US7092424B2 (en) | Integrated arrays of modulators and lasers on electronics | |
Hu et al. | Multimode WDM optical data links with monolithically integrated multiple-channel VCSEL and photodetector arrays | |
US7126976B2 (en) | Solid state lasers and a method for their production | |
US8437085B1 (en) | Optical element assembly with integrally formed microlens | |
EP1211764B1 (en) | System for optically pumping a long wavelength laser using a short wavelength laser | |
Lebby et al. | VCSEL devices and packaging | |
US20080205899A1 (en) | Optoelectronic Transmitting and Receiving Device | |
Morgan et al. | Vertical cavity surface emitting lasers for spaceborne photonic interconnects | |
Grabherr et al. | Speed it up to 10 Gb/s and flip chip it: VCSEL today |