[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

Zhou et al., 2015 - Google Patents

A novel design of hybrid slot jet and mini-channel cold plate for electronics cooling

Zhou et al., 2015

Document ID
18242432657981935031
Author
Zhou F
Dede E
Joshi S
Publication year
Publication venue
2015 31st Thermal Measurement, Modeling & Management Symposium (SEMI-THERM)

External Links

Snippet

In the current paper, a high-performance cold plate based on single-phase jet impingement and mini-channel heat sink technologies is described for automotive electronics cooling. A manifold system with cylindrical connection tubes and tapered inserts is designed to …
Continue reading at ieeexplore.ieee.org (other versions)

Classifications

    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING ENGINES OR PUMPS
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING ENGINES OR PUMPS
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING ENGINES OR PUMPS
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F7/00—Elements not covered by group F28F1/00, F28F3/00 or F28F5/00

Similar Documents

Publication Publication Date Title
Moradikazerouni et al. Comparison of the effect of five different entrance channel shapes of a micro-channel heat sink in forced convection with application to cooling a supercomputer circuit board
Andhare et al. Heat transfer and pressure drop characteristics of a flat plate manifold microchannel heat exchanger in counter flow configuration
Lu et al. Effect of branching level on the performance of constructal theory based Y-shaped liquid cooling heat sink
Zhou et al. A novel design of hybrid slot jet and mini-channel cold plate for electronics cooling
Ambatipudi et al. Analysis of conjugate heat transfer in microchannel heat sinks
Abdollahi et al. Fluid flow and heat transfer of nanofluids in microchannel heat sink with V-type inlet/outlet arrangement
Lee et al. Thermal modeling of extreme heat flux microchannel coolers for GaN-on-SiC semiconductor devices
Parida et al. Impingement-based high performance cooling configurations for automotive power converters
Ghaedamini et al. The effect of svelteness on the bifurcation angles role in pressure drop and flow uniformity of tree-shaped microchannels
Hu et al. Numerical study on flow and heat transfer characteristics of microchannel designed using topological optimizations method
Zhou et al. Modular design for a single-phase manifold mini/microchannel cold plate
Rezania et al. New configurations of micro plate-fin heat sink to reduce coolant pumping power
Huang et al. Review of fractal heat exchangers
Ali et al. Thermo-fluid characteristics of microchannel heat sink with multi-configuration NACA 2412 hydrofoil ribs
Khorasanizadeh et al. Three dimensional numerical study on a trapezoidal microchannel heat sink with different inlet/outlet arrangements utilizing variable properties nanofluid
Zhang et al. Computational study of hydrothermal performance of microchannel heat sink with trefoil shape ribs
Farhan et al. Design and analysis of liquid cooling plates for different flow channel configurations
Riera et al. Experimental demonstration of a tailored-width microchannel heat exchanger configuration for uniform wall temperature
Hadad et al. Numerical modeling and optimization of a V-groove warm water cold-plate
Algburı et al. Effect of pitch ratio and diagonal length of pin fin of heat sink on convective heat transfer for turbulent flow condition
Hoang et al. Design and thermal analysis of a 3-D printed impingement pin fin cold plate for heterogeneous integration application
Thangavel et al. Investigations on heat transfer characteristics of porous type copper heat sink with bifurcations
Mao et al. Compact thermal model for microchannel substrate with high temperature uniformity subjected to multiple heat sources
Deng et al. Numerical study on cooling of high-power laser diode arrays using slot jet array impingement
Cong et al. Investigation on the heat dissipation of high heat flux chip array by fractal microchannel networks