[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

Wu et al., 2012 - Google Patents

A memory yield improvement scheme combining built-in self-repair and error correction codes

Wu et al., 2012

Document ID
18156786057576204247
Author
Wu T
Chen P
Lee M
Lin B
Wu C
Tien C
Lin H
Chen H
Peng C
Wang M
Publication year
Publication venue
2012 IEEE International Test Conference

External Links

Snippet

Error correction code (ECC) and built-in self-repair (BISR) schemes have been wildly used for improving the yield and reliability of memories. Many built-in redundancy-analysis (BIRA) algorithms and ECC schemes have been reported before. However, most of them focus on …
Continue reading at ieeexplore.ieee.org (other versions)

Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C29/00—Checking stores for correct operation; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/04—Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
    • G11C29/08—Functional testing, e.g. testing during refresh, power-on self testing [POST] or distributed testing
    • G11C29/12—Built-in arrangements for testing, e.g. built-in self testing [BIST] or interconnection details
    • G11C29/44—Indication or identification of errors, e.g. for repair
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C29/00—Checking stores for correct operation; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/04—Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
    • G11C29/08—Functional testing, e.g. testing during refresh, power-on self testing [POST] or distributed testing
    • G11C29/12—Built-in arrangements for testing, e.g. built-in self testing [BIST] or interconnection details
    • G11C29/38—Response verification devices
    • G11C29/40—Response verification devices using compression techniques
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C29/00—Checking stores for correct operation; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/04—Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
    • G11C29/08—Functional testing, e.g. testing during refresh, power-on self testing [POST] or distributed testing
    • G11C29/12—Built-in arrangements for testing, e.g. built-in self testing [BIST] or interconnection details
    • G11C2029/1208—Error catch memory
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING; COUNTING
    • G06F—ELECTRICAL DIGITAL DATA PROCESSING
    • G06F11/00—Error detection; Error correction; Monitoring
    • G06F11/07—Error detection; Error correction; Monitoring responding to the occurence of a fault, e.g. fault tolerance
    • G06F11/08—Error detection or correction by redundancy in data representation, e.g. by using checking codes
    • G06F11/10—Adding special bits or symbols to the coded information, e.g. parity check, casting out 9's or 11's
    • G06F11/1008—Adding special bits or symbols to the coded information, e.g. parity check, casting out 9's or 11's in individual solid state devices
    • G06F11/1012—Adding special bits or symbols to the coded information, e.g. parity check, casting out 9's or 11's in individual solid state devices using codes or arrangements adapted for a specific type of error
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C29/00—Checking stores for correct operation; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/04—Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
    • G11C29/08—Functional testing, e.g. testing during refresh, power-on self testing [POST] or distributed testing
    • G11C29/12—Built-in arrangements for testing, e.g. built-in self testing [BIST] or interconnection details
    • G11C29/18—Address generation devices; Devices for accessing memories, e.g. details of addressing circuits
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C29/00—Checking stores for correct operation; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/70—Masking faults in memories by using spares or by reconfiguring
    • G11C29/78—Masking faults in memories by using spares or by reconfiguring using programmable devices
    • G11C29/80—Masking faults in memories by using spares or by reconfiguring using programmable devices with improved layout
    • G11C29/812—Masking faults in memories by using spares or by reconfiguring using programmable devices with improved layout using a reduced amount of fuses
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C29/00—Checking stores for correct operation; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/70—Masking faults in memories by using spares or by reconfiguring
    • G11C29/72—Masking faults in memories by using spares or by reconfiguring with optimized replacement algorithms
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C29/00—Checking stores for correct operation; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/04—Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
    • G11C29/50—Marginal testing, e.g. race, voltage or current testing
    • G11C2029/5006—Current
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING; COUNTING
    • G06F—ELECTRICAL DIGITAL DATA PROCESSING
    • G06F11/00—Error detection; Error correction; Monitoring
    • G06F11/07—Error detection; Error correction; Monitoring responding to the occurence of a fault, e.g. fault tolerance
    • G06F11/0703—Error or fault processing not based on redundancy, i.e. by taking additional measures to deal with the error or fault not making use of redundancy in operation, in hardware, or in data representation
    • G06F11/0766—Error or fault reporting or storing
    • G06F11/0775—Content or structure details of the error report, e.g. specific table structure, specific error fields
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING; COUNTING
    • G06F—ELECTRICAL DIGITAL DATA PROCESSING
    • G06F11/00—Error detection; Error correction; Monitoring
    • G06F11/07—Error detection; Error correction; Monitoring responding to the occurence of a fault, e.g. fault tolerance
    • G06F11/16—Error detection or correction of the data by redundancy in hardware
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C29/00—Checking stores for correct operation; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/02—Detection or location of defective auxiliary circuits, e.g. defective refresh counters
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere

Similar Documents

Publication Publication Date Title
Wu et al. A memory yield improvement scheme combining built-in self-repair and error correction codes
Su et al. An integrated ECC and redundancy repair scheme for memory reliability enhancement
US9361196B2 (en) Memory device with background built-in self-repair using background built-in self-testing
JP4789303B2 (en) Integrated circuit semiconductor device having self-healing circuit for built-in memory and memory restoration method
US11119857B2 (en) Substitute redundant memory
US20080133985A1 (en) Semiconductor device and testing method for same
CN104412327A (en) Built in self-testing and repair device and method
US4912710A (en) Self-checking random access memory
US11430537B2 (en) Error-correcting code-assisted memory repair
Roberts et al. FAULTSIM: A fast, configurable memory-resilience simulator
WO2014047225A1 (en) Substitute redundant memory
CN102479554A (en) Device and method for repair analysis
CN101414489A (en) Fault-tolerance memory and error-correction error-tolerance method
TW202001917A (en) Memory device
Lu et al. Enhanced built-in self-repair techniques for improving fabrication yield and reliability of embedded memories
Sontakke et al. Memory built-in self-repair and correction for improving yield: a review
Hou et al. High repair-efficiency BISR scheme for RAMs by reusing bitmap for bit redundancy
Lee et al. ECMO: ECC architecture reusing content-addressable memories for obtaining high reliability in DRAM
Kim et al. ECC-ASPIRIN: An ECC-assisted post-package repair scheme for aging errors in DRAMs
Lu et al. Synergistic reliability and yield enhancement techniques for embedded SRAMs
JP2006302464A (en) Semiconductor memory device
Jung et al. Predicting future-system reliability with a component-level dram fault model
US8352781B2 (en) System and method for efficient detection and restoration of data storage array defects
Rao et al. Efficient built in self repair for multiple RAMs
CN110827878B (en) memory device