Roh et al., 2021 - Google Patents
Direct energy Deposition of Mo powDer prepareD by electroDe inDuction Melting gas atoMizationRoh et al., 2021
View PDF- Document ID
- 18063224451675048220
- Author
- Roh G
- Park E
- Moon J
- Lee H
- Byun J
- Publication year
- Publication venue
- Archives of Metallurgy and Materials
External Links
Snippet
Molybdenum (Mo) is used to form a barrier layer for metal wiring in displays or semiconductor devices. Recently, researches have been continuously attempted to fabricate Mo sputtering targets through additive manufacturing. in this study, spherical Mo powders …
- 239000000843 powder 0 title abstract description 42
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
- C23C4/04—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the coating material
- C23C4/06—Metallic material
- C23C4/08—Metallic material containing only metal elements
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C24/00—Coating starting from inorganic powder
Similar Documents
Publication | Publication Date | Title |
---|---|---|
Tan et al. | Selective laser melting of tungsten-copper functionally graded material | |
KR102267761B1 (en) | Sputtering Target Assemblies with Graded Interlayers and Methods of Making | |
Luo et al. | High velocity impact induced microstructure evolution during deposition of cold spray coatings: A review | |
JP5818139B2 (en) | Cu-Ga alloy target material and method for producing the same | |
CN103290361B (en) | The method for applying thermal barrier coating | |
EP2706129A1 (en) | Fine grained, non banded, refractory metal sputtering targets with a uniformly random crystallographic orientation, method for making such film, and thin film based devices and products made there from | |
KR102359630B1 (en) | W-ni sputter target | |
JP4637819B2 (en) | Method and apparatus for manufacturing a sputtering target | |
US20110303535A1 (en) | Sputtering targets and methods of forming the same | |
KR20130078560A (en) | Fabrication method of amorphous alloy powder using gas atomization | |
JP2011523978A (en) | Molybdenum-niobium alloy, sputtering target containing such alloy, method for producing such target, thin film produced therefrom, and use thereof | |
JP4957968B2 (en) | Cu-In-Ga ternary sintered alloy sputtering target and method for producing the same | |
Laha et al. | Synthesis of bulk nanostructured aluminum alloy component through vacuum plasma spray technique | |
Roh et al. | Direct energy Deposition of Mo powDer prepareD by electroDe inDuction Melting gas atoMization | |
Park et al. | Effect of annealing with pressure on tungsten film properties fabricated by atmospheric plasma spray | |
Li et al. | Characterization and solderability of cold sprayed Sn–Cu coatings on Al and Cu substrates | |
KR101459700B1 (en) | Method for heat treatment of amorphous alloy and method for manufacturing crystalline alloy | |
WO2008141593A1 (en) | Method for production of sputtering targets | |
JP6651438B2 (en) | Copper-gallium sputtering target | |
TWI821944B (en) | Sputtering target, method of manufacturing the same, and method of manufacturing alloy thin film | |
Ham et al. | Manufacturing of large-scale cold-sprayed Ta target material and Its sputtering property | |
Lee et al. | Two-layered Zr-base amorphous alloy/metal surface composites fabricated by high-energy electron-beam irradiation | |
KR20220128268A (en) | Sputtering target and its manufacturing method | |
US11945030B2 (en) | Method of forming article, coated powder and article | |
JP2014185384A (en) | Cu-Ga SPUTTERING TARGET AND MANUFACTURING METHOD OF THE SAME |