Shore, 1995 - Google Patents
Assessment of the precision and cost effectiveness of direct machining hybrid type optical surfaces for IR applicationsShore, 1995
- Document ID
- 17977149749771812818
- Author
- Shore P
- Publication year
- Publication venue
- International Conference on Optical Fabrication and Testing
External Links
Snippet
The investigations described in this paper highlight some important aspects of diamond turninghybrid'type IR optics. Three commonly used IR substrate materials are assessed for their machinability into diffractivehybrid'type elements. The influence of various machining …
- 238000003754 machining 0 title abstract description 29
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| Huang et al. | Effect of tool geometry on ultraprecision machining of soft-brittle materials: a comprehensive review | |
| KR100887269B1 (en) | Semiconductor wafers with highly precise edge profile and method for producing them | |
| US10471669B2 (en) | Reusable castings molds | |
| KR102022732B1 (en) | Wafer machining method | |
| US11309191B2 (en) | Method for modifying substrates based on crystal lattice dislocation density | |
| Chen et al. | Influence of cutting parameters on the ductile-brittle transition of single-crystal calcium fluoride during ultra-precision cutting | |
| Takino et al. | Cutting of polished single-crystal silicon by wire electrical discharge machining | |
| JP2014160817A5 (en) | ||
| Takino et al. | High-quality cutting of polished single-crystal silicon by wire electrical discharge machining | |
| CN108453568A (en) | A kind of planar optical elements grinding processing method | |
| Hung et al. | Effect of crystalline orientation in the ductile-regime machining of silicon | |
| JP3544601B2 (en) | Ultra-precision cutting method for crystalline materials | |
| Shore | Assessment of the precision and cost effectiveness of direct machining hybrid type optical surfaces for IR applications | |
| Takino et al. | Contouring of polished single-crystal silicon plates by wire electrical discharge machining | |
| Fang | Nano-turning of single crystal silicon | |
| Ohta et al. | High-efficiency machining of single-crystal germanium using large-radius diamond tools | |
| CN115351609B (en) | Force control mechanical sharpening process of near-tipping-free micro-arc diamond cutter | |
| Kasuriya et al. | Mirror surface finishing of hardened stainless steel using spherical PCD tool | |
| Zhou et al. | Aspheric lens processing of chalcogenide glass via combined PGM-SPDT process | |
| Navare et al. | Experimental investigation on the effect of diamond type on the performance of single-point diamond turning (SPDT) of< 111> silicon | |
| Yan et al. | Nano precision on-machine profiling of curved diamond cutting tools using a white-light interferometer | |
| Parr-Burman et al. | Diamond turning of silicon optics | |
| JPH10166202A (en) | Machining method for die for forming fresnel lens | |
| Pivkin et al. | A new approach of modeling micromachining parts with a shaped generatrix by image processing of tool's cutting surface | |
| Yu et al. | Ductile-regime machining for fast tool servo diamond turning of micro-structured surfaces on brittle materials |