Tsujino et al., 2005 - Google Patents
Helical nanoholes bored in silicon by wet chemical etching using platinum nanoparticles as catalystTsujino et al., 2005
- Document ID
- 17786538171798460834
- Author
- Tsujino K
- Matsumura M
- Publication year
- Publication venue
- Electrochemical and Solid-State Letters
External Links
Snippet
Helical as well as cylindrical holes with diameters ranging from were bored in silicon by wet chemical etching in a solution containing HF and using Pt nanoparticles deposited on the silicon surface before the etching process as a catalyst. In a solution containing HF at a low …
- 229910052710 silicon 0 title abstract description 52
Classifications
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- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
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