Kahn et al., 1999 - Google Patents
Electrostatically actuated failure of microfabricated polysilicon fracture mechanics specimensKahn et al., 1999
View PDF- Document ID
- 17646451824024260316
- Author
- Kahn H
- Ballarini R
- Mullen R
- Heuer A
- Publication year
- Publication venue
- Proceedings of the Royal Society of London. Series A: Mathematical, Physical and Engineering Sciences
External Links
Snippet
Polysilicon fracture mechanics specimens have been fabricated using standard microelectromechanical systems (MEMS) processing techniques, and thus have characteristic dimensions comparable with typical MEMS devices. These specimens are …
- 229910021420 polycrystalline silicon 0 title abstract description 40
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/02—Details not specific for a particular testing method
- G01N2203/026—Specifications of the specimen
- G01N2203/0286—Miniature specimen; Testing on micro-regions of a specimen
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/0058—Kind of property studied
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/02—Details not specific for a particular testing method
- G01N2203/06—Indicating or recording means; Sensing means
- G01N2203/0617—Electrical or magnetic indicating, recording or sensing means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/02—Details not specific for a particular testing method
- G01N2203/0202—Control of the test
- G01N2203/0212—Theories, calculations
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/0014—Type of force applied
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01Q—SCANNING-PROBE TECHNIQUES OR APPARATUS; APPLICATIONS OF SCANNING-PROBE TECHNIQUES, e.g. SCANNING PROBE MICROSCOPY [SPM]
- G01Q60/00—Particular type of SPM [Scanning Probe Microscopy] or microscopes; Essential components thereof
- G01Q60/24—AFM [Atomic Force Microscopy] or apparatus therefor, e.g. AFM probes
Similar Documents
Publication | Publication Date | Title |
---|---|---|
Kahn et al. | Electrostatically actuated failure of microfabricated polysilicon fracture mechanics specimens | |
Tsuchiya et al. | Specimen size effect on tensile strength of surface-micromachined polycrystalline silicon thin films | |
Sharpe Jr et al. | New test structures and techniques for measurement of mechanical properties of MEMS materials | |
Sharpe et al. | Measurements of Young's modulus, Poisson's ratio, and tensile strength of polysilicon | |
Lin et al. | A micro strain gauge with mechanical amplifier | |
Jadaan et al. | Probabilistic Weibull behavior and mechanical properties of MEMS brittle materials | |
Schweitz | Mechanical characterization of thin films by micromechanical techniques | |
Tsuchiya et al. | Tensile testing of insulating thin films; humidity effect on tensile strength of SiO2 films | |
EP1987336B1 (en) | Internal stress actuated micro- and nanomachines for testing physical properties of micro and nano-sized material samples | |
Sharpe | Murray lecture tensile testing at the micrometer scale: Opportunities in experimental mechanics | |
Chasiotis et al. | Mechanical properties of thin polysilicon films by means of probe microscopy | |
Chen et al. | MEMS residual stress characterization: Methodology and perspective | |
Gaither et al. | Deformation and fracture of single-crystal silicon theta-like specimens | |
Ballarini et al. | The fracture toughness of polysilicon microdevices | |
Muhlstein et al. | Reliability and fatigue testing of MEMS | |
Hazra et al. | Demonstration of an in situ on-chip tensile tester | |
Bagdahn et al. | Fracture toughness and fatigue investigations of polycrystalline silicon | |
KAHN et al. | fracture mechanics specimensif | |
Gao et al. | Fracture of polycrystalline 3C-SiC films in microelectromechanical systems | |
Allameh et al. | Surface topography evolution and fatigue fracture of polysilicon | |
Rauscher et al. | Electrical contact resistance force sensing in SOI-DRIE MEMS | |
Hung et al. | Various fatigue testing of polycrystalline silicon microcantilever beam in bending | |
Kahn et al. | Wafer-level strength and fracture toughness testing of surface-micromachined MEMS devices | |
Zavracky et al. | Strain analysis of silicon-on-insulator films produced by zone melting recrystallization | |
Kamat | Experimental Techniques for the Measurement of Mechanical Properties of Materials Used in Microelectromechanical Systems. |