[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

Lokanathan et al., 2021 - Google Patents

Review of nanocomposite dielectric materials with high thermal conductivity

Lokanathan et al., 2021

Document ID
1728200123295736216
Author
Lokanathan M
Acharya P
Ouroua A
Strank S
Hebner R
Bahadur V
Publication year
Publication venue
Proceedings of the IEEE

External Links

Snippet

Dielectric materials with high thermal conductivity (TC) can enable disruptive performance enhancement in the areas of electronics packaging, thermal management, energy storage, cabling, and heat sinks. There have been widespread global efforts over the past decade on …
Continue reading at ieeexplore.ieee.org (other versions)

Classifications

    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances

Similar Documents

Publication Publication Date Title
Lokanathan et al. Review of nanocomposite dielectric materials with high thermal conductivity
Dang et al. Enhanced thermal conductivity of polymer composites via hybrid fillers of anisotropic aluminum nitride whiskers and isotropic spheres
Wang et al. A roadmap review of thermally conductive polymer composites: critical factors, progress, and prospects
Wen et al. Advances on thermally conductive epoxy‐based composites as electronic packaging underfill materials—a review
Nilagiri Balasubramanian et al. Role, effect, and influences of micro and nano‐fillers on various properties of polymer matrix composites for microelectronics: a review
Zhao et al. Synergistic enhanced thermal conductivity of epoxy composites with boron nitride nanosheets and microspheres
Yang et al. Enhancing dielectric strength of thermally conductive epoxy composites by preventing interfacial charge accumulation using micron-sized diamond
Mao et al. Spherical core-shell Al@ Al2O3 filled epoxy resin composites as high-performance thermal interface materials
Zhao et al. A critical review of the preparation strategies of thermally conductive and electrically insulating polymeric materials and their applications in heat dissipation of electronic devices
Yan et al. Flexible thermally conductive and electrically insulating silicone rubber composite films with BNNS@ Al 2 O 3 fillers
Wang et al. Progress on polymer composites with low dielectric constant and low dielectric loss for high-frequency signal transmission
Lee et al. Novel dielectric BN/epoxy nanocomposites with enhanced heat dissipation performance for electronic packaging
Idumah et al. Recently emerging trends in thermal conductivity of polymer nanocomposites
Wang et al. Combining alumina particles with three-dimensional alumina foam for high thermally conductive epoxy composites
Xiao et al. Review of high thermal conductivity polymer dielectrics for electrical insulation
Huang et al. Polyhedral oligosilsesquioxane‐modified boron nitride nanotube based epoxy nanocomposites: an ideal dielectric material with high thermal conductivity
Wang et al. Enhanced thermal conductivity of segregated poly (vinylidene fluoride) composites via forming hybrid conductive network of boron nitride and carbon nanotubes
Gao et al. A high-performance thermal conductive and outstanding electrical insulating composite based on robust neuron-like microstructure
Yoon et al. Review on three-dimensional ceramic filler networking composites for thermal conductive applications
CN111492474A (en) Insulating radiating fin
JP2013159748A (en) Resin composition, and method for producing the same
Ye et al. Alumina-coated Cu@ reduced graphene oxide microspheres as enhanced antioxidative and electrically insulating fillers for thermal interface materials with high thermal conductivity
Jiang et al. Facile strategy for constructing highly thermally conductive epoxy composites based on a salt template-assisted 3D carbonization nanohybrid network
Liu et al. Thermally conductive elastomer composites with poly (catechol-polyamine)-modified boron nitride
Shi et al. Implementation of epoxy resin composites filled with copper nanowire-modified boron nitride nanosheets for electronic device packaging