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White et al., 2023 - Google Patents

Coupling Simulated Annealing and Homogenization to Design Thermally Conductive Hybrid Lattice Support Structures for LPBF

White et al., 2023

View PDF
Document ID
17020528277159549978
Author
White L
Liang X
Zhang G
Cagan J
Zhang Y
Publication year
Publication venue
International Design Engineering Technical Conferences and Computers and Information in Engineering Conference

External Links

Snippet

When designed effectively, support structures for Laser Powder Bed Fusion (LPBF) quickly dissipate heat and mitigate part distortion without driving up excessive costs. Lattices, composed of individual unit cells strategically arranged to achieve a desired function, are a …
Continue reading at www.researchgate.net (PDF) (other versions)

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING; COUNTING
    • G06F—ELECTRICAL DIGITAL DATA PROCESSING
    • G06F17/00—Digital computing or data processing equipment or methods, specially adapted for specific functions
    • G06F17/50—Computer-aided design
    • G06F17/5009—Computer-aided design using simulation
    • G06F17/5018—Computer-aided design using simulation using finite difference methods or finite element methods
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING; COUNTING
    • G06F—ELECTRICAL DIGITAL DATA PROCESSING
    • G06F17/00—Digital computing or data processing equipment or methods, specially adapted for specific functions
    • G06F17/50—Computer-aided design
    • G06F17/5086—Mechanical design, e.g. parametric or variational design
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING; COUNTING
    • G06F—ELECTRICAL DIGITAL DATA PROCESSING
    • G06F17/00—Digital computing or data processing equipment or methods, specially adapted for specific functions
    • G06F17/50—Computer-aided design
    • G06F17/5068—Physical circuit design, e.g. layout for integrated circuits or printed circuit boards
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING; COUNTING
    • G06F—ELECTRICAL DIGITAL DATA PROCESSING
    • G06F2217/00—Indexing scheme relating to computer aided design [CAD]
    • G06F2217/41—Molding
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING; COUNTING
    • G06F—ELECTRICAL DIGITAL DATA PROCESSING
    • G06F2217/00—Indexing scheme relating to computer aided design [CAD]
    • G06F2217/78—Power analysis and optimization
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C67/00—Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00
    • B29C67/0051—Rapid manufacturing and prototyping of 3D objects by additive depositing, agglomerating or laminating of plastics material, e.g. by stereolithography or selective laser sintering
    • B29C67/0085—Apparatus components, details or accessories
    • B29C67/0092—Support structures for the 3D object during manufacture, e.g. using sacrificial material
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING; COUNTING
    • G06F—ELECTRICAL DIGITAL DATA PROCESSING
    • G06F2217/00—Indexing scheme relating to computer aided design [CAD]
    • G06F2217/80—Thermal analysis and optimization

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