Lee et al., 2023 - Google Patents
Electrochemical migration in electronic materials: factors affecting the mechanism and recent strategies for inhibitionLee et al., 2023
- Document ID
- 16868429908653419495
- Author
- Lee E
- Goh Y
- Haseeb A
- Wong Y
- Sabri M
- Low B
- Publication year
- Publication venue
- Journal of The Electrochemical Society
External Links
Snippet
Electrochemical migration (ECM) is one of the serious failure modes encountered in electronic devices due to the electrochemical reactions triggered by the presence of moisture and bias voltage, leading to the growth of dendrites and short circuits. The classical …
- 238000009791 electrochemical migration reaction 0 title abstract description 298
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/17—Post-manufacturing processes
- H05K2203/176—Removing, replacing or disconnecting component; Easily removable component
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/66—Electroplating: Baths therefor from melts
- C25D3/665—Electroplating: Baths therefor from melts from ionic liquids
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