[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

Yang et al., 2009 - Google Patents

Localized Ni deposition improved by saccharin sodium in the intermittent MAGE process

Yang et al., 2009

View PDF
Document ID
16580728799283833311
Author
Yang J
Lin J
Chang T
You X
Jiang S
Publication year
Publication venue
Journal of Micromechanics and Microengineering

External Links

Snippet

Localized Ni deposition improved by saccharin sodium (SS) in the intermittent microanode guided electroplating (intermittent MAGE) process has been investigated. This effect is more complicated than conventional planar electroplating. If there was an insignificant amount of …
Continue reading at www.researchgate.net (PDF) (other versions)

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of work-pieces
    • C25D5/48After-treatment of electroplated surfaces
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00Electroplating characterised by the article coated
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02Anodisation
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D13/00Electrophoretic coating characterised by the process
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating

Similar Documents

Publication Publication Date Title
Madden et al. Three-dimensional microfabrication by localized electrochemical deposition
US6203684B1 (en) Pulse reverse electrodeposition for metallization and planarization of a semiconductor substrates
US6319384B1 (en) Pulse reverse electrodeposition for metallization and planarization of semiconductor substrates
CN101238243A (en) Method for producing alloy deposits and controlling the nanostructure thereof using negative current pulsing electro-deposition, and articles incorporating such deposits
Swain et al. Use of coated microtools in advanced manufacturing: An exploratory study in electrochemical machining (ECM) context
Josell et al. Superconformal bottom-up nickel deposition in high aspect ratio through silicon vias
FI103674B (en) A method of electrochemically depositing a surface of a machine part
Yang et al. Localized Ni deposition improved by saccharin sodium in the intermittent MAGE process
Pellicer et al. Localized electrochemical deposition of porous Cu-Ni microcolumns: Insights into the growth mechanisms and the mechanical performance
Sundaram et al. Experimental study of localized electrochemical deposition of Ni-Cu alloy using a moving anode
Fu et al. Corrosion resistance of Ni–P/SiC and Ni–P composite coatings prepared by magnetic field-enhanced jet electrodeposition
Sharma et al. Electrochemical tailoring of Pb-free Sn coatings modified with SiC nanoparticles by surfactant-assisted reverse pulse plating
Habib et al. Performance of electrodes fabricated by localized electrochemical deposition (LECD) in micro-EDM operation on different workpiece materials
Habib et al. Fabrication of complex shape electrodes by localized electrochemical deposition
Vasyliev et al. Influence of polarization curve slope on the accuracy of local copper electrodeposition from sulphate electrolyte
Dikusar et al. On limiting rate of dimensional electrodeposition at meso-and nanomaterial manufacturing by template synthesis
Deshmukh et al. A systematic review on high speed selective jet electrodeposition manufacturing
Lee et al. Localized electrochemical deposition process improvement by using different anodes and deposition directions
Gao et al. Wire electrochemical micromachining of high-aspect ratio microstructures on stainless steel 304 with 270-μm thickness
Yang et al. Assessing the degree of localization in localized electrochemical deposition of copper
US10508358B2 (en) Process for forming a transition zone terminated superconformal filling
Zhu et al. A hybrid process for complex-shaped parts electroforming
Xu et al. Simulation and Experiment of Localized Electrochemical Deposition with Re‐Entrant Structures by Applying the Tip Effect
Habib et al. Modelling for fabrication of microelectrodes by localized electrochemical deposition for micro-electrodischarge machining
Choo et al. Flexible tooling for localized electrochemical deposition with wire-electrodischarge grinding