Kamnev et al., 2023 - Google Patents
The planar anodic Al2O3-ZrO2 nanocomposite capacitor dielectrics for advanced passive device integrationKamnev et al., 2023
View PDF- Document ID
- 16311666989950991103
- Author
- Kamnev K
- Pytlicek Z
- Bendova M
- Prasek J
- Gispert-Guirado F
- Llobet E
- Mozalev A
- Publication year
- Publication venue
- Science and Technology of Advanced Materials
External Links
Snippet
The need for integrated passive devices (IPDs) emerges from the increasing consumer demand for electronic product miniaturization. Metal-insulator-metal (MIM) capacitors are vital components of IPD systems. Developing new materials and technologies is essential …
- 239000003990 capacitor 0 title abstract description 109
Classifications
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
- H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
- H01G4/1218—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates
- H01G4/1227—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates based on alkaline earth titanates
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/14—Organic dielectrics
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
- H01L28/40—Capacitors
- H01L28/60—Electrodes
- H01L28/82—Electrodes with an enlarged surface, e.g. formed by texturisation
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02172—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/04—Electrodes or formation of dielectric layers thereon
- H01G9/048—Electrodes or formation of dielectric layers thereon characterised by their structure
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/33—Thin- or thick-film capacitors
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof; Multistep manufacturing processes therefor
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L23/00—Details of semiconductor or other solid state devices
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US8697516B2 (en) | Capacitor and a method of manufacturing the same | |
Yoo et al. | Structure and electrical properties of Al-doped HfO2 and ZrO2 films grown via atomic layer deposition on Mo electrodes | |
Mozalev et al. | Nanostructured anodic-alumina-based dielectrics for high-frequency integral capacitors | |
US20150087130A1 (en) | DRAM MIM Capacitor Using Non-Noble Electrodes | |
KR20060005342A (en) | Barium strontium titanate containing multilayer structures on metal foils | |
Kamnev et al. | The planar anodic Al2O3-ZrO2 nanocomposite capacitor dielectrics for advanced passive device integration | |
WO2004077566A1 (en) | High dielectric constant insulating film, thin-film capacitive element, thin-film multilayer capacitor, and method for manufacturing thin-film capacitive element | |
WO2004077460A1 (en) | Composition for thin-film capacitor device, high dielectric constant insulator film, thin-film capacitor device, thin-film multilayer capacitor, electronic circuit and electronic device | |
EP1758153A2 (en) | Perovskite type capacitor and method of manufacturing the same | |
TWI239024B (en) | Composition for thin film capacitor, insulation film with high dielectric rate, thin film capacitor, thin film laminated capacitor, and manufacturing method of thin film capacitor | |
Kannadassan et al. | Modeling the voltage nonlinearity of high-k MIM capacitors | |
Phung et al. | High performance metal-insulator-metal capacitors with Er2O3 on ALD SiO2 for RF applications | |
KR20060084255A (en) | Dielectric multilayer of microelectronic device and fabricating method for the same | |
Thongbai et al. | Reducing loss tangent by controlling microstructure and electrical responses in CaCu3Ti4O12 ceramics prepared by a simple combustion method | |
Padmanabhan et al. | High-performance metal–insulator–metal capacitors using europium oxide as dielectric | |
CN1742121A (en) | Composition for thin film capacitance element, insulating film of high dielectric constant, thin film capacitance element, thin film laminated capacitor and method for manufacturing thin film capacita | |
Karthik et al. | Nanostructured bilayer anodic TiO2/Al2O3 metal-insulator-metal capacitor | |
Lukosius et al. | Electrical and morphological properties of ALD and AVD grown perovskite-type dielectrics and their stacks for metal-insulator-metal applications | |
Ruhl et al. | Dielectric material options for integrated capacitors | |
KR20150124901A (en) | Dielectric thin films based Calcium Copper Titanate and method for fabricating the same | |
JP2004165596A (en) | Composition for thin film capacitive element, high dielectric constant insulation film, thin film capacitive element, thin film multilayer capacitor, electric circuit, and electronic apparatus | |
KR20190067691A (en) | Capacitor comprising metal nanoparticles | |
KR102558060B1 (en) | A nano sheet comprising niobate dielectric and dielectric thin film comprising the same | |
JP4088477B2 (en) | Thin film capacitor and thin film multilayer capacitor | |
Mondal et al. | Structural and Electrical Characterization of Lu2O3 Dielectric Layer for High Performance Analog Metal–Insulator–Metal Capacitors |