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Nayak et al., 2019 - Google Patents

Mechanical properties and thermal conductivity of epoxy composites enhanced by h-BN/RGO and mh-BN/GO hybrid filler for microelectronics packaging application

Nayak et al., 2019

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Document ID
16372361017113034093
Author
Nayak S
Mohanty S
Nayak S
Publication year
Publication venue
SN Applied Sciences

External Links

Snippet

In recent years, significant interest has been focused on fabricating epoxy-based hybrid composite with a high thermal conductivity at optimum filler loading. As epoxy usually has a low thermal conductivity, the high intrinsic thermal conducting fillers such as h-BN, GO and …
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
    • C08K3/00—Use of inorganic ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
    • C08K3/00—Use of inorganic ingredients
    • C08K3/34—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/22—Expanded, porous or hollow particles

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