[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

Lorenz et al., 2011 - Google Patents

Hermetic glass frit packaging in air and vacuum with localized laser joining

Lorenz et al., 2011

View PDF
Document ID
1611954008157686510
Author
Lorenz N
Millar S
Desmulliez M
Hand D
Publication year
Publication venue
Journal of Micromechanics and Microengineering

External Links

Snippet

Glass frit packaging is a simple and robust method used for hermetic sealing of micro- devices. Conventional glass frit packaging processes rely on furnace heating where the entire package is heated to elevated temperatures, hence restricting the use of temperature …
Continue reading at www.researchgate.net (PDF) (other versions)

Classifications

    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/146—Mixed devices
    • H01L2924/1461—MEMS
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L2021/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H01L2021/60007—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation involving a soldering or an alloying process
    • H01L2021/60022—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation involving a soldering or an alloying process using bump connectors, e.g. for flip chip mounting
    • H01L2021/60097—Applying energy, e.g. for the soldering or alloying process
    • H01L2021/60172—Applying energy, e.g. for the soldering or alloying process using static pressure

Similar Documents

Publication Publication Date Title
Lorenz et al. Hermetic glass frit packaging in air and vacuum with localized laser joining
Tilmans et al. The indent reflow sealing (IRS) technique-a method for the fabrication of sealed cavities for MEMS devices
Cheng et al. A hermetic glass-silicon package formed using localized aluminum/silicon-glass bonding
Emami et al. Low temperature hermetic laser-assisted glass frit encapsulation of soda-lime glass substrates
WO2012106326A1 (en) Using millisecond pulsed laser welding in mems packaging
Tao et al. Selective bonding and encapsulation for wafer-level vacuum packaging of MEMS and related micro systems
Xu et al. Wafer-level vacuum packaging of micromachined thermoelectric IR sensors
Bardin et al. Laser bonding of glass to silicon using polymer for microsystems packaging
Jin et al. MEMS vacuum packaging technology and applications
US20180240722A1 (en) Hermetic Lid Seal Printing Method
Costello et al. Hermeticity testing of MEMS and microelectronic packages
Joyce et al. Stress reduction in silicon/oxidized silicon–Pyrex glass anodic bonding for MEMS device packaging: RF switches and pressure sensors
Lorenz et al. Wafer-level packaging of silicon to glass with a BCB intermediate layer using localised laser heating
Chen et al. Development of wafer level glass frit bonding by using barrier trench technology and precision screen printing
Lin et al. Laser sealing of organic light-emitting diode using low melting temperature glass frit
Niewczas et al. Induction heating assisted optical fiber bonding and sealing technique
Welker et al. Design and Fabrication of Transparent and Gas‐Tight Optical Windows in Low‐Temperature Co‐Fired Ceramics
Jiang et al. A laser-assisted bonding method using a liquid crystal polymer film for MEMS and sensor packaging
Cheng et al. Fabrication and hermeticity testing of a glass-silicon package formed using localized aluminum/silicon-to-glass bonding
Sankarasubramanian et al. High-temperature interfacial adhesion strength measurement in electronic packaging using the double cantilever beam method
Knechtel et al. Heat Conductivity Based Inner Cavity Pressure Monitoring and Hermeticity Monitoring for Glass Frit Wafer Bonded MEMS Devices
Hand et al. Laser-based joining for the packaging of miniature optoelectronic devices
Wang Low temperature hermertic packaging with Ag sintering process
Liu et al. Accurate temperature monitoring in laser-assisted polymer bonding for MEMS packaging using an embedded microsensor array
CN102923638B (en) Level Hermetic Package assembly and method for packing