Greer et al., 2005 - Google Patents
Size dependence of mechanical properties of gold at the micron scale in the absence of strain gradientsGreer et al., 2005
- Document ID
- 15856069382468491501
- Author
- Greer J
- Oliver W
- Nix W
- Publication year
- Publication venue
- Acta Materialia
External Links
Snippet
Classical laws of mechanics hold that mechanical properties are independent of sample size; however, results of experiments and molecular dynamics simulations indicate that crystals exhibit strong size effects at the sub-micron scale. In experimental studies, the size …
- 239000010931 gold 0 title abstract description 48
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N33/00—Investigating or analysing materials by specific methods not covered by the preceding groups
- G01N33/48—Investigating or analysing materials by specific methods not covered by the preceding groups biological material, e.g. blood, urine; Haemocytometers
- G01N33/50—Chemical analysis of biological material, e.g. blood, urine; Testing involving biospecific ligand binding methods; Immunological testing
Similar Documents
Publication | Publication Date | Title |
---|---|---|
Greer et al. | Size dependence of mechanical properties of gold at the micron scale in the absence of strain gradients | |
Cai et al. | Low temperature creep of nanocrystalline pure copper | |
Greer et al. | Size dependence of mechanical properties of gold at the sub-micron scale | |
Kraft et al. | Fatigue behavior of polycrystalline thin copper films | |
Emery et al. | Tensile behavior of free-standing gold films. Part I. Coarse-grained films | |
Schneider et al. | Effect of orientation and loading rate on compression behavior of small-scale Mo pillars | |
De Hosson et al. | In situ TEM nanoindentation and dislocation-grain boundary interactions: a tribute to David Brandon | |
Bei et al. | Compressive strengths of molybdenum alloy micro-pillars prepared using a new technique | |
Kim et al. | Tensile and compressive behavior of gold and molybdenum single crystals at the nano-scale | |
Read et al. | Morphology, microstructure, and mechanical properties of a copper electrodeposit | |
Kiener et al. | Micro-compression testing: A critical discussion of experimental constraints | |
Brooks et al. | Analysis of hardness–tensile strength relationships for electroformed nanocrystalline materials | |
Greer et al. | The in-situ mechanical testing of nanoscale single-crystalline nanopillars | |
Soler et al. | Understanding size effects on the strength of single crystals through high-temperature micropillar compression | |
Cepeda-Jiménez et al. | Prominent role of basal slip during high-temperature deformation of pure Mg polycrystals | |
Sim et al. | High-temperature tensile behavior of freestanding Au thin films | |
Burek et al. | Grain boundary effects on the mechanical properties of bismuth nanostructures | |
Zhang et al. | Elevated-temperature deformation mechanisms in a CrMnFeCoNi high-entropy alloy | |
Kale et al. | Oxygen effects on crystal plasticity of Titanium: A multiscale calibration and validation framework | |
Huang et al. | Deformation behavior, microstructure evolution, phase transformation and plastic instability origin of powder metallurgy Al0. 8Co0. 5Cr1. 5CuFeNi alloy during high temperature deformation | |
Olliges et al. | Thermo mechanical properties and plastic deformation of gold nanolines and gold thin films | |
Lee et al. | Fabrication, structure and mechanical properties of indium nanopillars | |
Wang et al. | Enhancing high-temperature tensile properties of Ni/Ni-W laminated composites for MEMS devices | |
Ghazi et al. | Experimental investigation of plastic strain recovery and creep in nanocrystalline copper thin films | |
Seo et al. | Influence of grain size on the strength size dependence exhibited by sub-micron scale nickel structures with complex cross-sectional geometries |