Hippler et al., 2017 - Google Patents
Pressure dependence of Ar, ArTi+, and Ti dimer formation in a magnetron sputtering dischargeHippler et al., 2017
- Document ID
- 15637441328360540933
- Author
- Hippler R
- Cada M
- Stranak V
- Hubicka Z
- Helm C
- Publication year
- Publication venue
- Journal of Physics D: Applied Physics
External Links
Snippet
Abstract Formation of Ar+ and Ti+ monomers and of Ar ${\hspace {0pt}} _2^+ $, ArTi+, and Ti ${\hspace {0pt}} _2^+ $ dimer ions in a magnetron sputtering discharge with a Ti cathode and at argon gas pressures of 0.3–2.1 Pa was investigated by means of energy-resolved …
- 230000015572 biosynthetic process 0 title abstract description 30
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes, e.g. for surface treatment of objects such as coating, plating, etching, sterilising or bringing about chemical reactions
- H01J37/34—Gas-filled discharge tubes, e.g. for surface treatment of objects such as coating, plating, etching, sterilising or bringing about chemical reactions operating with cathodic sputtering
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement, ion-optical arrangement
- H01J37/08—Ion sources; Ion guns
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/06—Sources
- H01J2237/08—Ion sources
- H01J2237/0802—Field ionization sources
- H01J2237/0807—Gas field ion sources [GFIS]
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J49/00—Particle spectrometer or separator tubes
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
Similar Documents
Publication | Publication Date | Title |
---|---|---|
Benedikt et al. | Quadrupole mass spectrometry of reactive plasmas | |
Huo et al. | Particle-balance models for pulsed sputtering magnetrons | |
Hecimovic et al. | Spokes in high power impulse magnetron sputtering plasmas | |
Hippler et al. | Pressure dependence of Ar, ArTi+, and Ti dimer formation in a magnetron sputtering discharge | |
Panjan et al. | Non-uniform plasma distribution in dc magnetron sputtering: origin, shape and structuring of spokes | |
Bowes et al. | Negative ion energy distributions in reactive HiPIMS | |
Čapek et al. | Deposition rate enhancement in HiPIMS without compromising the ionized fraction of the deposition flux | |
Lundin et al. | Ionization of sputtered Ti, Al, and C coupled with plasma characterization in HiPIMS | |
Palmucci et al. | Mass spectrometry diagnostics of short-pulsed HiPIMS discharges | |
Hippler et al. | Pressure dependence of singly and doubly charged ion formation in a HiPIMS discharge | |
Cartry et al. | Alternative solutions to caesium in negative-ion sources: a study of negative-ion surface production on diamond in H2/D2 plasmas | |
Sasao et al. | Negative-hydrogen-ion production from a nanoporous 12CaO∙ 7Al2O3 electride surface | |
Franz et al. | Influence of ionisation zone motion in high power impulse magnetron sputtering on angular ion flux and NbOx film growth | |
Breilmann et al. | Dynamic of the growth flux at the substrate during high-power pulsed magnetron sputtering (HiPIMS) of titanium | |
de los Arcos et al. | Description of HiPIMS plasma regimes in terms of composition, spoke formation and deposition rate | |
Ganeva et al. | Velocity distribution of mass-selected nano-size cluster ions | |
Welzel et al. | Comparison of ion energies and fluxes at the substrate during magnetron sputtering of ZnO: Al for dc and rf discharges | |
Patino et al. | Analysis of secondary electron emission for conducting materials using 4-grid LEED/AES optics | |
Viloan et al. | Pulse length selection for optimizing the accelerated ion flux fraction of a bipolar HiPIMS discharge | |
Kousal et al. | Monitoring of conditions inside gas aggregation cluster source during production of Ti/TiOx nanoparticles | |
Šlapanská et al. | Study of the transition from self-organised to homogeneous plasma distribution in chromium HiPIMS discharge | |
Alami et al. | Design of magnetic field configuration for controlled discharge properties in highly ionized plasma | |
Zeng et al. | Design and experimental testing of a gas cluster ion accelerator | |
Hippler et al. | A positively biased external anode for energy control of plasma ions: hollow cathode and magnetron sputtering discharge | |
Zöhrer et al. | Erosion and cathodic arc plasma of Nb–Al cathodes: composite versus intermetallic |