Wan et al., 2012 - Google Patents
Compact modeling of 3d stacked die inter-tier microfluidic cooling under non-uniform heat fluxWan et al., 2012
- Document ID
- 1547836481940487473
- Author
- Wan Z
- Kim Y
- Joshi Y
- Publication year
- Publication venue
- ASME International Mechanical Engineering Congress and Exposition
External Links
Snippet
Three-dimensional (3D) stacking is an emerging trend for future high performance microsystems. The stacking of chips increases the power density significantly, with associated thermal concerns. For interior tiers in a 3D stack, the surface area for the heat …
- 238000001816 cooling 0 title abstract description 26
Classifications
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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