Van Heerden et al., 2004 - Google Patents
Thermal behavior of a soldered Cu-Si interfaceVan Heerden et al., 2004
- Document ID
- 15252148936876192701
- Author
- Van Heerden D
- Rude T
- Newson J
- Knio O
- Weihs T
- Gailus D
- Publication year
- Publication venue
- Twentieth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (IEEE Cat. No. 04CH37545)
External Links
Snippet
The thermal behavior of a reactively soldered interface between a Cu heat sink and a Si die is analyzed experimentally. Two aspects are addressed, thermal fatigue of these joints, and the survival of the circuitry on the die during joining. In the reactive soldering process a …
- 229910017758 Cu-Si 0 title abstract description 7
Classifications
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
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