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Yoon et al., 2018 - Google Patents

Effect of surface finish metallization on mechanical strength of Ag sintered joint

Yoon et al., 2018

Document ID
15111886399464768217
Author
Yoon J
Back J
Jung S
Publication year
Publication venue
Microelectronic Engineering

External Links

Snippet

A micro-sized Ag paste was fabricated with the metal content of approximately 85% as a sinter-bonding material in this study. The sintering reactions and joint strengths of Ag sintered joints with three different surface finishes of Cu, Ag, and electroless Ni-immersion …
Continue reading at www.sciencedirect.com (other versions)

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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
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    • H01L2224/29099—Material
    • H01L2224/291—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/29101—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of less than 400°C
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    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
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