Moon et al., 2004 - Google Patents
Nano metal particles for low temperature interconnect technologyMoon et al., 2004
View PDF- Document ID
- 15191061319287514115
- Author
- Moon K
- Dong H
- Pothukuchi S
- Li Y
- Wong C
- Publication year
- Publication venue
- 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No. 04CH37546)
External Links
Snippet
For low temperature interconnects, melting point (T/sub m/) depression and sintering behavior of metal nano particles are investigated. Nano Ag particles used (/spl sim/20 nm) exhibited obvious sintering behavior, rather than typical melting behavior, at significantly …
- 238000005516 engineering process 0 title description 8
Classifications
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- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L23/00—Details of semiconductor or other solid state devices
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